Patents by Inventor Long Lu

Long Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230097992
    Abstract: Bivalent epidermal growth factor (EGF) fusion toxin including two EGF domains are provided. The described fusion toxin demonstrates increased binding and cytotoxicity when compared to a fusion toxin having a single EGF binding domain (monovalent). Methods for treating epidermal growth factor receptor (EGFR)-positive cancers and related materials are also provided.
    Type: Application
    Filed: March 25, 2021
    Publication date: March 30, 2023
    Inventors: Zhirui WANG, Shi-Long LU
  • Publication number: 20230087984
    Abstract: The invention provides a chemical-mechanical polishing composition comprising: (a) about 3.0 wt. % to about 10 wt. % silica abrasive; (b) an anionic polymer having a weight average molecular weight of about 400 kDa to about 7000 kDa; and (c) water, wherein the polishing composition has a viscosity of at least about 1 cPs, a ratio of viscosity (cPs) to wt. % of silica abrasive of about 0.2 cPs/wt. % to about 1.5 cPs/wt. %, and a pH of about 9 to about 12. The invention additional provides a chemical-mechanical polishing composition comprising: (a) about 3.0 wt. % to about 10 wt. % silica abrasive; (b) a nonionicpolymer having a weight average molecular weight of about 300 kDa to about 7000 kDa; and (c) water, wherein the polishing composition has a viscosity of at least about 2 cPs, and a pH of about 9 to about 12.
    Type: Application
    Filed: September 23, 2022
    Publication date: March 23, 2023
    Inventors: Brian REISS, Brittany JOHNSON, Sajo NAIK, Lung-Tai LU, Kim LONG, Elliot KNAPTON, Douglas ROBELLO, Sarah BROSNAN
  • Publication number: 20230085845
    Abstract: A flat spring (100) is disclosed, for use in a surge protection device (SPD) such as a fast activation thermal fuse, to be integrated with a thermal metal oxide varistor (TMOV). The flat spring (100) has a V-shaped protrusion (110) to enable ultra-high short circuit current protection under overvoltage condition.
    Type: Application
    Filed: May 11, 2020
    Publication date: March 23, 2023
    Applicant: Dongguan Littelfuse Electronics Company Limited
    Inventors: Long Min, Libing LU, Dongjian Song
  • Publication number: 20230090985
    Abstract: This application disclosed video transmission method and devices. An example method includes obtaining a first video and a second video, where the first video and the second video have same content, and image quality of the first video is lower than image quality of the second video. M first video frames and identifier information of N target frames based on the first video are obtained. Related frames corresponding to the N target frames are obtained from the second video based on the identifier information of the N target frames, where the target frames and the related frames have same identifier information but different image quality. The M first video frames and the N related frames are recorded to obtain a third video, where the third video is transmitted to a receiving device, and a data volume of the third video is less than a data volume of the second video.
    Type: Application
    Filed: November 28, 2022
    Publication date: March 23, 2023
    Inventors: Long SUN, Wei LU
  • Publication number: 20230071575
    Abstract: Disclosed is a diagnostic panel of methylated genomic loci encoding microRNA (mgmiR) markers that demonstrated 90% sensitivity and 100% specificity in the detection of head and neck squamous cell carcinoma (HNSCC). These results represent the first use of quantitative MS-PCR for the detection of mgmiRs. In addition, this panel demonstrates the ability to detect hypermethylation in the adjacent mucosa of cancer patients, suggesting its utility in early detection. This panel is also capable of detecting cancer by using saliva, blood and FNA tissue samples.
    Type: Application
    Filed: August 4, 2022
    Publication date: March 9, 2023
    Inventors: Shi-Long Lu, John Song
  • Publication number: 20230055697
    Abstract: A server containing hard disk modules which can be slid into place and which allow connection at the front and at the rear of a housing. The server includes the housing which defines an opening, the hard disk modules, and a plurality of trays. Receiving channels communicating with the opening are defined in the housing, the receiving channels are isolated and arranged side by side and each channel can receive one tray. A hard disk module is positioned in one tray, a front end and a rear end of the housing defines front connection port and rear connection port for cable connections to each hard disk module.
    Type: Application
    Filed: October 29, 2021
    Publication date: February 23, 2023
    Inventors: HAN-YU LI, WEN-HU LU, SHU-TONG WANG, LI-YI YIN, GONG-WEN ZHANG, YANG LI, SAN-LONG ZHOU
  • Publication number: 20230042566
    Abstract: The present disclosure provides a battery pack housing, a battery pack, and an electric vehicle. The battery pack housing includes a housing body and at least one structural beam disposed in the housing body. The at least one structural beam divides the internal space of the housing body into a number of accommodation cavities. The housing body includes a top plate and a bottom plate arranged opposite to each other in a first direction, the first direction is a height direction of the battery pack housing, and the structural beam is located between and attached to the top plate and the bottom plate. The battery pack housing comprises a mounting part for connecting mounting portion for a fixed connection with an external load. The battery pack housing disclosed in the present disclosure has relatively high strength and stiffness as well as high space utilization.
    Type: Application
    Filed: October 24, 2022
    Publication date: February 9, 2023
    Inventors: Huajun SUN, Zhipei LU, Qingbo PENG, Long WAN, Yan ZHU
  • Publication number: 20230041540
    Abstract: A battery pack includes a housing, and at least one housing structural beam and multiple electrode core strings electrically connected to one another located in the housing. The housing includes a housing body, including a top plate and a bottom plate arranged opposite to each other in a first direction. The structural beam is located between the top plate and the bottom plate, the at least one structural beam is connected to the top plate and the bottom plate, and divides the interior of the housing into multiple accommodating cavities, and at least one electrode core string is provided in at least one accommodating cavity. A mounting portion is provided on the housing, and the mounting portion is configured to be connected and fixed to an external load. The electrode core string includes multiple electrode core assemblies sequentially disposed in a second direction and connected in series.
    Type: Application
    Filed: October 24, 2022
    Publication date: February 9, 2023
    Inventors: Huajun SUN, Zhipei LU, Qingbo PENG, Long WAN, Yan ZHU
  • Publication number: 20230035072
    Abstract: The present disclosure is generally directed to antibodies, e.g., monoclonal, chimeric, humanized antibodies, antibody fragments, etc., that specifically bind one or more epitopes within a CD33 protein, e.g., human CD33 or a mammalian CD33, and have improved and/or enhanced functional characteristics. The present disclosure is further directed to the methods of treating and/or delaying the progression of a disease or injury in an individual by administering such antibodies.
    Type: Application
    Filed: December 11, 2020
    Publication date: February 2, 2023
    Applicant: Alector LLC
    Inventors: Robert PAUL, Michael F. WARD, Hua LONG, Shiao-Ping LU, Omer Rizwan SIDDIQUI, Arnon ROSENTHAL
  • Publication number: 20230021687
    Abstract: A semiconductor package comprises a semiconductor substrate, a first metal layer, an adhesive layer, a second metal layer, a rigid supporting layer, and a plurality of contact pads. A thickness of the semiconductor substrate is equal to or less than 50 microns. A thickness of the rigid supporting layer is larger than the thickness of the semiconductor substrate. A thickness of the second metal layer is larger than a thickness of the first metal layer. A method comprises the steps of providing a device wafer; providing a supporting wafer; attaching the supporting wafer to the device wafer via an adhesive layer; and applying a singulaton process so as to form a plurality of semiconductor packages.
    Type: Application
    Filed: October 5, 2022
    Publication date: January 26, 2023
    Applicant: ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
    Inventors: Jun Lu, Long-Ching Wang, Madhur Bobde, Bo Chen, Shuhua Zhou
  • Publication number: 20230023909
    Abstract: A battery pack and an electric vehicle are provided. The battery pack includes a cell array and two first reinforcing plates. The cell array includes a number of cells. Each of the cells is defined with a length L, a thickness D, and a height H between the length L and the thickness D. The number of cells are arranged along a thickness direction, and the cells are adhered to each other by a structural adhesive. The two first reinforcing plates are arranged opposite to each other and are respectively adhered to two surfaces of the cell array along the arrangement direction of the cells, and are configured to constrain relative positions between the cells.
    Type: Application
    Filed: October 22, 2020
    Publication date: January 26, 2023
    Inventors: Long HE, Huajun SUN, Zhipei LU, Long WAN, Yan ZHU
  • Publication number: 20230026556
    Abstract: The invention provides compositions, devices, methods and kits allowing for rapid diagnosis of infectious diseases via extraction-free, direct PCR techniques using combined biological samples.
    Type: Application
    Filed: July 13, 2022
    Publication date: January 26, 2023
    Inventors: Robert E. Blomquist, Shi-Long Lu, Brian L. Harry, Xin Yao
  • Publication number: 20230027674
    Abstract: A semiconductor device and method for manufacturing the same are provided. The method includes providing a first substrate. The method also includes forming a first metal layer on the first substrate. The first metal layer includes a first metal material. The method further includes treating a first surface of the first metal layer with a solution including an ion of a second metal material. In addition, the method includes forming a plurality of metal particles including the second metal material on a portion of the first surface of the first metal layer.
    Type: Application
    Filed: September 30, 2022
    Publication date: January 26, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jhao-Cheng CHEN, Huang-Hsien CHANG, Wen-Long LU, Shao Hsuan CHUANG, Ching-Ju CHEN, Tse-Chuan CHOU
  • Publication number: 20230019343
    Abstract: Disclosed in the present invention is An annotation method of arbitrary-oriented rectangular bounding box, wherein: the elements for annotation being: the coordinates of the center point C, a vector {right arrow over (CD)} formed by the center point C and a chosen vertex D, and the ratio of the vector {right arrow over (CP)} to vector {right arrow over (CD)}, where {right arrow over (CP)} is the projection of the vector {right arrow over (CE)} to {right arrow over (CD)}, and {right arrow over (CE)} is a vector formed by the center of the bounding box to one of the vertex E that close neighbor to vertex D; and it is also required that the vector {right arrow over (CP)} is in the same direction as the vector {right arrow over (CD)}, the vertex E in either of the clockwise or counterclockwise direction of the vertex D.
    Type: Application
    Filed: September 13, 2022
    Publication date: January 19, 2023
    Inventors: Wenlong Song, Juan LV, Changjun LIU, Rui TANG, Tao SUN, Xiaotao LI, June FU, He ZHU, Yizhu LU, Long CHEN, Hongjie LIU
  • Publication number: 20220415739
    Abstract: A package structure and a circuit layer structure are provided in the present disclosure. The package structure includes a wiring structure, a first electronic device, a second electronic device and at least one dummy trace. The wiring structure includes a plurality of interconnection traces. The first electronic device and the second electronic device are disposed on the wiring structure, and electrically connected to each other through the interconnection traces. The dummy trace is adjacent to the interconnection traces. A mechanical strength of the at least one dummy trace is less than a mechanical strength of one of the interconnection traces.
    Type: Application
    Filed: August 29, 2022
    Publication date: December 29, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • Patent number: 11538760
    Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a lower conductive structure, a first semiconductor device and a second semiconductor device. The upper conductive structure is disposed on the lower conductive structure. The second semiconductor device is electrically connected to the first semiconductor device by a first path in the upper conductive structure. The lower conductive structure is electrically connected to the first semiconductor device through a second path in the upper conductive structure under the first path.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: December 27, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen-Long Lu
  • Patent number: 11538395
    Abstract: A shift register unit includes an input circuit, a first control circuit, a second control circuit and an output circuit. The input circuit is configured to provide signals of the signal input terminal to the first control node, and provide signals of the first power supply terminal or the first clock signal terminal to the second control node. The first control circuit is configured to provide signals of the second power supply terminal or the second clock signal terminal to the first output terminal. The second control circuit is configured to provide signals of the first power supply terminal to the second output terminal. The output circuit is configured to provide signals of the second power supply terminal to the second output terminal.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: December 27, 2022
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Guangliang Shang, Jiangnan Lu, Can Zheng, Hao Zhang, Long Han, Libin Liu, Shiming Shi, Dawei Wang
  • Patent number: 11532542
    Abstract: A wiring structure and a method for manufacturing the same are provided. The wiring structure includes a conductive structure and a plurality of conductive through vias. The conductive structure includes a dielectric layer, a circuit layer in contact with the dielectric layer, a plurality of dam portions and an outer metal layer. The dam portions extend through the dielectric layer. The dam portion defines a through hole. The outer metal layer is disposed adjacent to a top surface of the dielectric layer and extends into the through hole of the dam portion. The conductive through vias are disposed in the through holes of the dam portions and electrically connecting the circuit layer.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: December 20, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen-Long Lu
  • Publication number: 20220387346
    Abstract: The present invention is related to pharmaceutical formulations comprising a synthetic deoxypentitol and methods of use thereof in treating cancer.
    Type: Application
    Filed: June 2, 2022
    Publication date: December 8, 2022
    Inventors: Qi Long Lu, Pei Juan Lu
  • Patent number: 11512319
    Abstract: The present invention provides a recombinant Corynebacterium glutamicum producing N-acetylglucosamine and use thereof. The recombinant Corynebacterium glutamicum is obtained by overexpressing, in Corynebacterium glutamicum, the transcription factor SugR derived therefrom. The recombinant Corynebacterium glutamicum of the present invention increases the production of acetylglucosamine to up to 26 g/L, and lays a foundation for further metabolic engineering of Corynebacterium glutamicum to produce glucosamine.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: November 29, 2022
    Assignees: JIANGNAN UNIVERSITY, SHANDONG RUNDE BIOTECHNOLOGY CO., LTD.
    Inventors: Jianxing Lu, Long Liu, Jian Chen, Changfeng Liu, Xueqin Lv, Guocheng Du, Jianghua Li, Chen Deng, Jiangong Lu