Patents by Inventor Long Lu

Long Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250250217
    Abstract: The present disclosure describes compositions comprising substantially pure ribitol, pharmaceutical compositions of ribitol, and methods of making ribitol. The methods may include combining a reducing agent (e.g., borohydride) and ribose (e.g. D-ribose), optionally with stirring, to form a first reaction mixture; and contacting the first reaction mixture and an acidic quenching agent, optionally with stirring, to form a second reaction mixture, thereby forming ribitol.
    Type: Application
    Filed: February 4, 2025
    Publication date: August 7, 2025
    Inventors: George L. MCLENDON, Bas Wilhelmus Theodorus GRUIJTERS, Qi Long LU
  • Publication number: 20250241869
    Abstract: The present invention is related to pharmaceutical formulations comprising a synthetic deoxypentitol and methods of use thereof in treating cancer.
    Type: Application
    Filed: March 24, 2025
    Publication date: July 31, 2025
    Inventors: Qi Long Lu, Pei Juan Lu
  • Patent number: 12352501
    Abstract: A radiator and an immersion tank using the radiator is provided. The immersion tank includes a first condensation tank and the radiator. Multiple motherboards and a first working fluid are located in the first condensation tank. The radiator includes a condensation assembly and multiple heat exchanger parts. The condensation assembly is assembled outside the first condensation tank along a first direction, wherein the condensation assembly has a second condensation tank, and the second working fluid flows through the second condensation tank. Each heat exchanger part extends along the first direction, a first end of the heat exchanger part is plugged into the first condensation tank, and a second end of each heat exchanger part is plugged into the condensation assembly.
    Type: Grant
    Filed: December 28, 2023
    Date of Patent: July 8, 2025
    Assignees: Industrial Technology Research Institute, KENMEC MECHANICAL ENGINEERING CO., LTD.
    Inventors: Shu-Jung Yang, Chih-Yao Wang, Heng-Chieh Chien, Kuei-Yuan Huang, Yu-Long Lu
  • Patent number: 12344889
    Abstract: The invention provides compositions and methods allowing for rapid, accurate, robust, and low-cost diagnosis of infectious diseases via extraction-free, direct PCR techniques.
    Type: Grant
    Filed: March 9, 2022
    Date of Patent: July 1, 2025
    Assignees: Transformative Biotech, LLC, The Regents of the University of Colorado
    Inventors: Robert E. Blomquist, Shi-Long Lu, Brian L. Harry, Jose P. Zevallos, Xin Yao
  • Publication number: 20250206209
    Abstract: Vehicles, vehicle seat arrangements, and methods for manufacturing modal blocks for use with vehicle seats in vehicles are provided. A method for manufacturing a modal block for use with a vehicle seat in a vehicle includes identifying a frequency range of output frequencies of the vehicle; determining a natural frequency of the vehicle seat; designing a modal block configured to adjust the natural frequency of the vehicle seat; and locating the modal block between the vehicle and the vehicle seat to adjust the natural frequency of the vehicle seat.
    Type: Application
    Filed: December 21, 2023
    Publication date: June 26, 2025
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Eryk Jerzy Dabrowski, Chung-long Lu
  • Patent number: 12337736
    Abstract: Vehicles, vehicle seat arrangements, and methods for manufacturing modal blocks for use with vehicle seats in vehicles are provided. A method for manufacturing a modal block for use with a vehicle seat in a vehicle includes identifying a frequency range of output frequencies of the vehicle; determining a natural frequency of the vehicle seat; designing a modal block configured to adjust the natural frequency of the vehicle seat; and locating the modal block between the vehicle and the vehicle seat to adjust the natural frequency of the vehicle seat.
    Type: Grant
    Filed: December 21, 2023
    Date of Patent: June 24, 2025
    Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Eryk Jerzy Dabrowski, Chung-long Lu
  • Publication number: 20250183106
    Abstract: A package structure and a circuit layer structure are provided in the present disclosure. The package structure includes a wiring structure, a first electronic device, a second electronic device and at least one dummy trace. The wiring structure includes a plurality of interconnection traces. The first electronic device and the second electronic device are disposed on the wiring structure, and electrically connected to each other through the interconnection traces. The dummy trace is adjacent to the interconnection traces. A mechanical strength of the at least one dummy trace is less than a mechanical strength of one of the interconnection traces.
    Type: Application
    Filed: February 11, 2025
    Publication date: June 5, 2025
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • Patent number: 12297507
    Abstract: Disclosed is a diagnostic panel of methylated genomic loci encoding microRNA (mgmiR) markers that demonstrated 90% sensitivity and 100% specificity in the detection of head and neck squamous cell carcinoma (HNSCC). These results represent the first use of quantitative MS-PCR for the detection of mgmiRs. In addition, this panel demonstrates the ability to detect hypermethylation in the adjacent mucosa of cancer patients, suggesting its utility in early detection. This panel is also capable of detecting cancer by using saliva, blood and FNA tissue samples.
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: May 13, 2025
    Assignee: The Regents of the University of Colorado, a body corporate
    Inventors: Shi-Long Lu, John Song
  • Patent number: 12257214
    Abstract: The present invention is related to pharmaceutical formulations comprising a synthetic deoxypentitol and methods of use thereof in treating cancer.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: March 25, 2025
    Assignee: The Charlotte Mecklenburg Hospital Authority
    Inventors: Qi Long Lu, Pei Juan Lu
  • Patent number: 12252463
    Abstract: The present disclosure describes compositions comprising substantially pure ribitol, pharmaceutical compositions of ribitol, and methods of making ribitol. The methods may include combining a reducing agent (e.g., borohydride) and ribose (e.g. D-ribose), optionally with stirring, to form a first reaction mixture; and contacting the first reaction mixture and an acidic quenching agent, optionally with stirring, to form a second reaction mixture, thereby forming ribitol.
    Type: Grant
    Filed: May 27, 2020
    Date of Patent: March 18, 2025
    Assignee: THE CHARLOTTE MECKLENBURG HOSPITAL AUTHORITY
    Inventors: George L. McLendon, Bas Wilhelmus Theodorus Gruijters, Qi Long Lu
  • Publication number: 20250070058
    Abstract: A semiconductor device package includes an electronic component and a substrate. The electronic component has a first surface and a second surface. The substrate is connected to the first surface of the electronic component through an adhesive layer. The substrate includes a first antenna disposed over the second surface of the electronic components through the adhesive layer.
    Type: Application
    Filed: November 11, 2024
    Publication date: February 27, 2025
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • Patent number: 12224219
    Abstract: A package structure and a circuit layer structure are provided in the present disclosure. The package structure includes a wiring structure, a first electronic device, a second electronic device and at least one dummy trace. The wiring structure includes a plurality of interconnection traces. The first electronic device and the second electronic device are disposed on the wiring structure, and electrically connected to each other through the interconnection traces. The dummy trace is adjacent to the interconnection traces. A mechanical strength of the at least one dummy trace is less than a mechanical strength of one of the interconnection traces.
    Type: Grant
    Filed: August 29, 2022
    Date of Patent: February 11, 2025
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen-Long Lu
  • Publication number: 20250040093
    Abstract: The disclosure relates to an immersion cooling system and a tank structure thereof. The tank structure comprises a tank and a vapor chamber. The tank comprises a tank body, a door panel type condenser and a baffle. The door panel type condenser disposes on the top plane of the tank body and seals the tank body, and cool the electric vapor flowing to the top plane. One end of the baffle disposes on the top plane, and the other end of the baffle faces the liquid surface of the coolant in the tank body. The baffle divides a vapor space into a first vapor space and a second vapor space away from the door panel type condenser. The vapor chamber is connected to the tank body and used to cool the electric vapor flowing to the vapor chamber through the second vapor space.
    Type: Application
    Filed: July 26, 2024
    Publication date: January 30, 2025
    Inventors: Kuei-Yuan HUANG, Yu-Long LU
  • Publication number: 20250009770
    Abstract: The present invention provides compositions and methods of their use in treating muscular dystrophy and other disorders.
    Type: Application
    Filed: February 12, 2024
    Publication date: January 9, 2025
    Inventors: Qi Long LU, Marcela CATALDI, Pei Juan LU
  • Patent number: 12142584
    Abstract: A semiconductor device package includes an electronic component and a substrate. The electronic component has a first surface and a second surface. The substrate is connected to the first surface of the electronic component through an adhesive layer. The substrate includes a first antenna disposed over the second surface of the electronic components through the adhesive layer.
    Type: Grant
    Filed: August 8, 2023
    Date of Patent: November 12, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen-Long Lu
  • Publication number: 20240306295
    Abstract: A circuit structure includes a low-density conductive structure, a high-density conductive structure and a plurality of traces. The high-density conductive structure is disposed over the low-density conductive structure, and defines an opening extending from a top surface of the high-density conductive structure to a bottom surface of the high-density conductive structure. The opening exposes a first pad of the low-density conductive structure and a second pad of the low-density conductive structure. The second pad is spaced apart from the first pad. The traces extend from the top surface of the high-density conductive structure into the opening. The traces include a first trace connecting to the first pad of the low-density conductive structure and a second trace connecting to the second pad of the low-density conductive structure.
    Type: Application
    Filed: March 8, 2023
    Publication date: September 12, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • Publication number: 20240288745
    Abstract: A semiconductor device is provided. The semiconductor device includes a first optical transceiver, a second optical transceiver and a component. The component is configured to provide a magnetic field to change a light emitting direction from the first optical transceiver to the second optical transceiver or from the second optical transceiver to the first optical transceiver.
    Type: Application
    Filed: February 24, 2023
    Publication date: August 29, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen-Long LU
  • Patent number: 12046523
    Abstract: A semiconductor device package includes a substrate; an electronic component disposed on the substrate; multiple supporting structures disposed on the substrate; and a reinforced structure disposed on the supporting structures and extending in parallel with the substrate.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: July 23, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Wen-Long Lu
  • Publication number: 20240184596
    Abstract: Methods, systems, and devices for compressing firmware data are described. A memory system may access firmware data associated with the memory system that includes bank data. The memory system may determine whether the bank data in the firmware data is compressed and, in cases that the bank data is compressed, the memory system may decompress the bank data prior to storing the bank data at a controller of the memory system. In some examples, a bank header in the firmware data may include information for the memory system to decompress the bank data. For example, the bank header may indicate the size of the compressed bank data associated with each bank. Additionally, the memory system may read the compressed bank data according to the indicated size and store the bank data at the controller or at a memory device of the memory system.
    Type: Application
    Filed: March 17, 2022
    Publication date: June 6, 2024
    Inventors: Jiawei Wang, Zephyr Yu, Yaming Lu, Long Lu, Huachen Li, Wenjun Wu, Chen Huang
  • Patent number: 11931371
    Abstract: The present invention provides compositions and methods of their use in treating muscular dystrophy and other disorders.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: March 19, 2024
    Assignee: The Charlotte Mecklenburg Hospital Authority
    Inventors: Qi Long Lu, Marcela Cataldi, Pei Juan Lu