Abstract: The present invention is related to pharmaceutical formulations comprising a synthetic deoxypentitol and methods of use thereof in treating cancer.

Abstract: The present disclosure describes compositions comprising substantially pure ribitol, pharmaceutical compositions of ribitol, and methods of making ribitol. The methods may include combining a reducing agent (e.g., borohydride) and ribose (e.g. D-ribose), optionally with stirring, to form a first reaction mixture; and contacting the first reaction mixture and an acidic quenching agent, optionally with stirring, to form a second reaction mixture, thereby forming ribitol.

Abstract: A semiconductor device package includes an electronic component and a substrate. The electronic component has a first surface and a second surface. The substrate is connected to the first surface of the electronic component through an adhesive layer. The substrate includes a first antenna disposed over the second surface of the electronic components through the adhesive layer.

Abstract: A package structure and a circuit layer structure are provided in the present disclosure. The package structure includes a wiring structure, a first electronic device, a second electronic device and at least one dummy trace. The wiring structure includes a plurality of interconnection traces. The first electronic device and the second electronic device are disposed on the wiring structure, and electrically connected to each other through the interconnection traces. The dummy trace is adjacent to the interconnection traces. A mechanical strength of the at least one dummy trace is less than a mechanical strength of one of the interconnection traces.

Abstract: The disclosure relates to an immersion cooling system and a tank structure thereof. The tank structure comprises a tank and a vapor chamber. The tank comprises a tank body, a door panel type condenser and a baffle. The door panel type condenser disposes on the top plane of the tank body and seals the tank body, and cool the electric vapor flowing to the top plane. One end of the baffle disposes on the top plane, and the other end of the baffle faces the liquid surface of the coolant in the tank body. The baffle divides a vapor space into a first vapor space and a second vapor space away from the door panel type condenser. The vapor chamber is connected to the tank body and used to cool the electric vapor flowing to the vapor chamber through the second vapor space.

Abstract: The present invention provides compositions and methods of their use in treating muscular dystrophy and other disorders.

Abstract: A semiconductor device package includes an electronic component and a substrate. The electronic component has a first surface and a second surface. The substrate is connected to the first surface of the electronic component through an adhesive layer. The substrate includes a first antenna disposed over the second surface of the electronic components through the adhesive layer.

Abstract: A circuit structure includes a low-density conductive structure, a high-density conductive structure and a plurality of traces. The high-density conductive structure is disposed over the low-density conductive structure, and defines an opening extending from a top surface of the high-density conductive structure to a bottom surface of the high-density conductive structure. The opening exposes a first pad of the low-density conductive structure and a second pad of the low-density conductive structure. The second pad is spaced apart from the first pad. The traces extend from the top surface of the high-density conductive structure into the opening. The traces include a first trace connecting to the first pad of the low-density conductive structure and a second trace connecting to the second pad of the low-density conductive structure.

Abstract: A semiconductor device is provided. The semiconductor device includes a first optical transceiver, a second optical transceiver and a component. The component is configured to provide a magnetic field to change a light emitting direction from the first optical transceiver to the second optical transceiver or from the second optical transceiver to the first optical transceiver.

Abstract: A semiconductor device package includes a substrate; an electronic component disposed on the substrate; multiple supporting structures disposed on the substrate; and a reinforced structure disposed on the supporting structures and extending in parallel with the substrate.

Abstract: Methods, systems, and devices for compressing firmware data are described. A memory system may access firmware data associated with the memory system that includes bank data. The memory system may determine whether the bank data in the firmware data is compressed and, in cases that the bank data is compressed, the memory system may decompress the bank data prior to storing the bank data at a controller of the memory system. In some examples, a bank header in the firmware data may include information for the memory system to decompress the bank data. For example, the bank header may indicate the size of the compressed bank data associated with each bank. Additionally, the memory system may read the compressed bank data according to the indicated size and store the bank data at the controller or at a memory device of the memory system.

Abstract: The present invention provides compositions and methods of their use in treating muscular dystrophy and other disorders.

Abstract: A thermal conduction unit includes a conductive via, a periphery conductor and an isolation material. The conductive via includes a first thermoelectric material. The periphery conductor encloses the conductive via and includes a second thermoelectric material. An end of the periphery conductor is electrically connected to an end of the conductive via. The isolation material is interposed between the conductive via and the periphery conductor.

Abstract: A semiconductor device package includes an electronic component and a substrate. The electronic component has a first surface and a second surface. The substrate is connected to the first surface of the electronic component through an adhesive layer. The substrate includes a first antenna disposed over the second surface of the electronic components through the adhesive layer.

Abstract: Provided are methods of treating a disease or disorder in a subject in need thereof and associated compositions. An effective amount of ribitol is administered, thereby restoring and/or enhancing functional glycosylation of ?-DG and/or treating the disease or disorder.

Abstract: An electronic device package and a method for manufacturing an electronic device package are provided. The electronic device package includes electronic device structure which includes a first electronic device and a first encapsulant, a second electronic device, and a second encapsulant. The first encapsulant encapsulates the first electronic device. The second electronic device is adjacent to the electronic device structure. The second encapsulant encapsulates the electronic device structure and the second electronic device. A first extension line along a lateral surface of the first electronic device and a second extension line along a lateral surface of the first encapsulant define a first angle, the second extension line along the lateral surface of the first encapsulant and a third extension line along a lateral surface of the second electronic device define a second angle, and the first angle is different from the second angle.

Abstract: A semiconductor device package includes an electronic component and a substrate. The electronic component has a first surface and a second surface. The substrate is connected to the first surface of the electronic component through an adhesive layer. The substrate includes a first antenna disposed over the second surface of the electronic components through the adhesive layer.

Abstract: A semiconductor package device includes a wiring structure, a semiconductor chip and an encapsulant. The semiconductor chip is electrically connected to the wiring structure. The encapsulant is disposed on the wiring structure and covers the semiconductor chip. A roughness (Ra) of a surface of the encapsulant is about 5 nm to about 50 nm.

Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first module, a second module, a first intermediate circuit layer, a first conductive transmission path and a second conductive transmission path. The second module is stacked on the first module. The first intermediate circuit layer is arranged between the first module and the second module. The first conductive transmission is configured to electrically connect the first semiconductor module with the first intermediate circuit layer. The second conductive transmission path is configured to electrically connect the first intermediate circuit layer with the second semiconductor module.

Abstract: A package structure includes a base material, at least one electronic device, at least one encapsulant and a plurality of dummy pillars. The electronic device is electrically connected to the base material. The encapsulant covers the electronic device. The dummy pillars are embedded in the encapsulant. At least two of the dummy pillars have different heights.