Abstract: Provided herein are methods of treatment of individuals having an immune-related disease, disorder or condition, for example, inflammatory bowel disease, graft-versus-host disease, multiple sclerosis, rheumatoid arthritis, psoriasis, lupus erythematosus, diabetes, mycosis fungoides (Alibert-Bazin syndrome), or scleroderma using placental stem cells or umbilical cord stem cells.

Abstract: A power module and a power device are provided. The power device includes two screws, a heat dissipation components and a power module. The power module includes a substrate, a package body and two fixing structures. Each fixing structure includes a first through hole, two second through holes, an annular structure and two sinking structures. When the power module is fixed to the heat dissipation component, each sinking structure is bent toward the heat dissipation component, and each annular structure is fixed to the flat surface of the heat dissipation component by the screws. The heat dissipation surface of the substrate can be flatly attached to the flat surface of the heat dissipation component through the two fixed structures, so that the heat energy generated during the operation of the power module can be transferred out through the heat dissipation component.

Abstract: A method and apparatus for limiting an RF alternating magnetic field in MRI. The method includes: measuring a perpendicular distance between a local coil placed on a scanned part of a patient and the center of a detection hole of a magnetic resonance (MR) scanner; based on the perpendicular distance, determining a deviation between the B1 field strength at the position of the local coil during an MR scan and the B1 field strength at the center of the detection hole; based on the deviation, computing a conversion coefficient for conversion between the B1 field strength at the position of the local coil and the B1 field strength at the center of the detection hole; based on the B1 field strength required when the surface temperature of the local coil is equal to a safe temperature upper limit and the conversion coefficient, computing a maximum permissible field strength of the B1 field at the center of the detection hole.

Abstract: A drive structure of a desktop robotic arm is disclosed, including a base and a turntable. The base is internally provided with a turntable drive motor and a turntable drive shaft, the turntable drive motor is drive-connected to the turntable drive shaft, and the turntable drive shaft is drive-connected to the turntable. The turntable is provided with an upper arm drive motor and a forearm drive motor. The turntable drive motor, the upper arm drive motor and the forearm drive motor are all servo motors with absolute value encoders. According to the drive structure of the desktop robotic arm, by using servo motors as the drive motors for controlling the turntable, an upper arm and a forearm, for which the absolute value encoders are correspondingly configured, control accuracy and driving power can be improved. Further, the present invention also discloses a desktop robotic arm and a robot.

Abstract: A printing head and a method for applying a correction for mounting deviation of light-emitting chips are provided. The printing head includes a plurality of light-emitting chips. Each light-emitting chip includes a plurality of primary light-emitting elements that are continuously arranged. At least one of two adjacent light-emitting chips further includes at least one spare light-emitting element continuously and linearly arranged after the primary light-emitting elements. If the two adjacent light-emitting chips are both at a target mounting position, first N light-emitting units of one of the two light-emitting chips respectively face to first N light-emitting units of the other one of the two light-emitting chips, where N?1. Each two of the light-emitting units facing to each other form a group. One of the two light-emitting units in each of the groups is set to a light emission disabled state.

Abstract: A method for making a semiconductor device includes forming a ROX layer on a substrate and a patterned silicon oxynitride layer on the patterned ROX layer; conformally forming a dielectric oxide layer to cover the substrate, the patterned silicon oxynitride layer, and the patterned ROX layer; and fully oxidizing the patterned silicon oxynitride layer to form a fully oxidized gate oxide layer on the substrate.

Abstract: The application discloses a die bonding method of an LED chip and a display device. The method may include: a welding material is fixed on a metal pad of the LED chip, the LED chip fixed with the welding material is transferred onto a transient substrate, the metal pad of the LED chip on the transient substrate is aligned with a bonding pad on a receiving substrate, the welding material fixed on the LED chip is heated, and then the LED chip is fixed on the receiving substrate.

Abstract: The present disclosure describes a semiconductor structure that includes a channel region, a source region adjacent to the channel region, a drain region, a drift region adjacent to the drain region, and a dual gate structure. The dual gate structure includes a first gate structure over portions of the channel region and portions of the drift region. The dual gate structure also includes a second gate structure over the drift region.

Abstract: A method for making a semiconductor device includes forming a ROX layer on a substrate and a patterned silicon oxynitride layer on the patterned ROX layer; conformally forming a dielectric oxide layer to cover the substrate, the patterned silicon oxynitride layer, and the patterned ROX layer; and fully oxidizing the patterned silicon oxynitride layer to form a fully oxidized gate oxide layer on the substrate.

Abstract: A method for making a semiconductor device includes forming a ROX layer on a substrate and a patterned silicon oxynitride layer on the patterned ROX layer; conformally forming a dielectric oxide layer to cover the substrate, the patterned silicon oxynitride layer, and the patterned ROX layer; and fully oxidizing the patterned silicon oxynitride layer to form a fully oxidized gate oxide layer on the substrate.

Abstract: The present invention relates to an anti-adhesion crushing tool for crushing damp ores. The anti-adhesion crushing tool can effectively improve the current working environment in attapulgite crushing, and is beneficial to effectively improve the anti-adhesion properties of the attapulgite clay.

Abstract: Various embodiments of the present disclosure are directed towards an integrated chip comprising a gate electrode disposed on a substrate between a pair of source/drain regions. A dielectric layer is over the substrate. A field plate is disposed on the dielectric layer and laterally between the gate electrode and a first source/drain region in the pair of source/drain regions. The field plate comprises a first field plate layer and a second field plate layer. The second field plate layer extends along sidewalls and a bottom surface of the first field plate layer. The first and second field plate layers comprise a conductive material.

Abstract: An opening and closing device is provided, including a fixing device and a limiting device. The fixing device includes a fixing portion and a fixing member, and the limiting device includes a driving device, a limiting portion, and a limiting member. The fixing member may rotate to be engaged with the fixing portion. The driving device is disposed on a first shell. The limiting portion is disposed on an inner side of the first shell. The limiting member is disposed on an inner side of a second shell. When the first shell approaches the second shell, the limiting member end portion may be engaged with the limiting portion. The driving device may be subjected to an external force to release the engagement between the fixing member and the fixing portion and the engagement between the limiting member end portion and the limiting portion.

Abstract: The invention relates to an apparatus for manipulating a focus of excitation light on or in a sample, particularly in a microscope, comprising a light source for emitting excitation light, an excitation beam path for guiding the excitation light onto or into the sample, the excitation beam path comprising an objective for guiding the excitation light onto or into the sample and a wavefront modulator for modulating the excitation light, and a control device for driving the wavefront modulator.

Abstract: Various embodiments of the present disclosure are directed towards a method for forming an integrated chip. The method includes forming a source region and a drain region within a substrate. A drift region is formed within the substrate such that the drift region is disposed laterally between the source region and the drain region. A first gate structure is formed over the drift region. An inter-level dielectric (ILD) layer is formed over the first gate structure. The ILD layers is patterned to define a field plate opening. A first field plate layer, a second field plate layer, and a third field plate layer are formed within the field plate opening.

Abstract: Provided herein are methods of using adherent placental stem cells and placental stem cell populations, and methods of culturing, proliferating and expanding the same. Also provided herein are methods of differentiating the placental stem cells. Further provided herein are methods of using the placental stem cells to formulate implantable or injectable compositions suitable for administration to a subject. Still further provided herein are provides methods for treating bone defects with stem cells and compositions comprising stem cells.

Abstract: A coil assembly, an MRI system, and a method of using the coil assembly. The coil assembly includes: a flexible coil configured to cover a tissue under test in a wound fashion; a pressure adjuster configured to be integrated with the flexible coil, for the purpose of applying uniform pressure to the entire flexible coil such that the flexible coil fits the covered tissue under test; a pressure controller configured to control the pressure applied to the flexible coil by the pressure adjuster; and a connection member, constructed to connect the pressure controller to the pressure adjuster.

Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method may be performed by forming a gate structure over a substrate and between a source region and a drain region. A composite etch stop structure is formed over the gate structure and a first inter-level dielectric (ILD) layer is formed over the composite etch stop structure. The composite etch stop structure has a plurality of stacked dielectric materials. The first ILD layer is etched to concurrently define contact openings extending to the substrate and a field plate opening extending to the composite etch stop structure. The contact openings and the field plate opening are concurrently filled with one or more conductive materials.

Abstract: A lens structure includes a lens cone, at least one lens and an acrylate adhesive. The lens cone includes at least one contacting structure. The lens is disposed within the lens cone and abuts against the contacting structure. The acrylate adhesive covers an interface between the lens cone and the lens, wherein a coverage area of the acrylate adhesive accounts for more than 70% of a surface area of a side surface of the lens.

Abstract: The present application relates to a method of operating a capacitance sensing device comprises: calculating a difference of a raw data compared to one of the raw data received in a previous data frame; and performing a comparison calculation based on the raw data and a stored baseline value to determine whether a proximity event has occurred. Under the proximity event, selects one of several baseline value update procedures based on the magnitude of the difference. Thus, the present application effectively avoids the problem of failure to update the baseline value when the object is close to the capacitance sensing device for a long period of time, which may lead to misjudgment of the capacitance sensing device.