Patents by Inventor Lun Wang

Lun Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LENS STRUCTURE
    Publication number: 20200271887
    Abstract: A lens structure includes a lens cone, at least one lens and an acrylate adhesive. The lens cone includes at least one contacting structure. The lens is disposed within the lens cone and abuts against the contacting structure. The acrylate adhesive covers an interface between the lens cone and the lens, wherein a coverage area of the acrylate adhesive accounts for more than 70% of a surface area of a side surface of the lens.
    Type: Application
    Filed: May 12, 2020
    Publication date: August 27, 2020
    Applicant: Rays Optics Inc.
    Inventors: Chen-Cheng Lee, Yu-Hua Huang, Chih-Wei Chang, Tzu-Lun Wang
  • Integrated chip and method of forming the same
    Patent number: 10756208
    Abstract: The present disclosure relates to an integrated chip. In some embodiments, the integrated chip has a gate structure disposed over a substrate between source and drain regions and a dielectric layer laterally extending from over the gate structure to between the gate structure and the drain region. A composite etch stop layer having a plurality of different dielectric materials is stacked over the dielectric layer. A contact etch stop layer directly contacts an upper surface and sidewalls of the composite etch stop layer. A field plate is laterally surrounded by a first inter-level dielectric (ILD) layer and vertically extends from a top of the first ILD layer, through the contact etch stop layer, and into the composite etch stop layer.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: August 25, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hui-Ting Lu, Pei-Lun Wang, Yu-Chang Jong
  • MICRO-ORGANOIDS, AND METHODS OF MAKING AND USING THE SAME
    Publication number: 20200246385
    Abstract: Provided herein are micro-organoids, referred to herein as Functional Physiological Units (FPUs), that are capable of replacing or augmenting one or more physiological functions in an individual, which are useful in the treatment of individuals lacking, or suffering a deficit in, said physiological function.
    Type: Application
    Filed: April 21, 2020
    Publication date: August 6, 2020
    Applicant: Celularity Inc.
    Inventors: Robert J. HARIRI, Mohit BHATIA, Jia-Lun WANG, Wolfgang HOFGARTNER, Qian YE
  • MANUFACTURING APPARATUS AND METHOD FOR MOLDED LENS
    Publication number: 20200189153
    Abstract: A manufacturing apparatus and a manufacturing method for a molded lens are provided. A substrate is located between a first molding core and a second molding core, and the first molding core is moved so that the substrate is formed into a lens. A distance sensor sends a plurality of press distance parameters of moving the first molding core, and the press distance parameters may form a press curve. The press curve and a reference press curve is compared for a difference by a processor and a comparator. The processor determines whether the difference is within an error range.
    Type: Application
    Filed: June 20, 2019
    Publication date: June 18, 2020
    Applicant: Young Optics Inc.
    Inventors: Shiue-Li Liu, Ming-Yuan Chou, Tzu-Lun Wang
  • Terminal stand
    Patent number: 10686265
    Abstract: A terminal stand is provided. The terminal stand includes a base body, a movable part, a metal elastic part, a first signal element and a second signal element. One end of the metal elastic member includes two first abutments. The first signal element is disposed in a second receiving slot. One end of the first signal element includes a first contact portion and a second abutment. The second signal element is disposed in the second receiving slot. One end of the second signal element includes a second contact portion. The second contact portion contacts with the first contact portion and makes a signal circuit. When the movable member is pressed, the movable member drives the two first abutments to move, and the abutment drives the second abutment to move, with the first contact portion leaving the second contact portion, and the signal circuit is in an off-state state.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: June 16, 2020
    Assignee: P-TWO INDUSTRIES INC.
    Inventors: Chien-Chun Wang, Wen-Lun Wang
  • Tuning/detuning circuit and detuning method for an RF coil
    Patent number: 10677864
    Abstract: A tuning/detuning structure and a detuning method for an RF coil use an RF power source, a first impedance circuit, a first RF line, and a first port having a first guide leg end and a first input end, with the first guide leg end being connected to a first end ring capacitance of the RF coil. When the RF coil needs to be detuned, the first input end is connected to the first impedance circuit via the first RF line. When the RF coil needs to transmit an RF pulse signal, the first input end is connected to the RF power source via the first RF line. The need for a switch element is thereby reduced as is harm resulting from breakdown of such a switch element. An impedance circuit can be combined with a switch element to realize detuning jointly, and a good detuning effect can be achieved by a small number of switch elements.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: June 9, 2020
    Assignee: Siemens Healthcare GmbH
    Inventors: Hou Quan Lin, Ying Lun Wang, Wen Ming Li, JianMin Wang, Juergen Nistler
  • Methodology and structure for field plate design
    Patent number: 10636904
    Abstract: The present disclosure, in some embodiments, relates to a transistor device having a field plate. The transistor device has a gate electrode disposed over a substrate between a source region and a drain region. One or more dielectric layers are arranged over the gate electrode, and a field plate is arranged over the one or more dielectric layers. The field plate extends from a first outermost sidewall that is directly over an upper surface of the gate electrode to a second outermost sidewall that is between the gate electrode and the drain region and that extends to below the upper surface of the gate electrode.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: April 28, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Hsueh-Liang Chou, Dah-Chuen Ho, Hui-Ting Lu, Po-Chih Su, Pei-Lun Wang, Yu-Chang Jong
  • Optical device package
    Patent number: 10591688
    Abstract: An optical device package includes: (1) a waveguide, the waveguide including: a main body; and multiple forks, wherein each of the plurality of forks has a tapering end and is extended from the main body, and wherein each of the tapering ends of the forks includes a facet for receiving light; and (2) an optical fiber having a surface configured to output the light into the waveguide; wherein a lateral distance between the surface of the optical fiber and at least one of the facets is less than about 25 micrometers (?m).
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: March 17, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Mei-Ju Lu, Tai-Hsuan Tu, Yi-Min Chin, Wei Lun Wang, Jia-Hao Zhang
  • Simple electrical connector structure connecting a ribbon cable and a printed circuit board
    Patent number: 10566720
    Abstract: A simple connector structure includes a connecting body. The connecting body has a first accommodating space and a second accommodating space. The first accommodating space is matched with a PCB, and the second accommodating space is matched with a ribbon cable body. In addition, the first accommodating space is provided with at least one first conductive part, and the second accommodating space is provided with at least one second conductive part. Therefore, quick connection and labor cost reduction can be effectively achieved through connecting the first accommodating space with the PCB and connecting the second accommodating space with the ribbon cable body.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: February 18, 2020
    Assignee: P-Two Industries Inc.
    Inventors: Chien-Chun Wang, Wen-Lun Wang
  • CD34+,CD45- PLACENTAL STEM CELL-ENRICHED CELL POPULATIONS
    Publication number: 20200048603
    Abstract: Provided herein are methods and compositions for the production of hepatocytes from placenta stem cells. Further provided herein is the use of such hepatocytes in the treatment of, and intervention in, for example, trauma, inflammation, and degenerative disorders of the liver. Also provided herein are compositions and methods relating to combinations of nanofibrous scaffolds and adherent placental stem cells and methods of using the same in cartilage repair. Finally, provided herein are compositions and methods relating to nonadherent, CD34+CD45? stem cells from placenta.
    Type: Application
    Filed: October 18, 2019
    Publication date: February 13, 2020
    Applicant: CELULARITY, INC.
    Inventors: James W. Edinger, Robert J. Hariri, Jia-Lun Wang, Qian Ye, Marian Pereira, Sascha Dawn Abramson, Kristen S. Labazzo
  • METHODOLOGY AND STRUCTURE FOR FIELD PLATE DESIGN
    Publication number: 20200020802
    Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method may be performed by forming a source region and a drain region within a substrate. A gate structure is formed over the substrate and between the source region and the drain region. One or more dielectric layers are formed over the gate structure, and a first inter-level dielectric (ILD) layer is formed over the one or more dielectric layers. The first ILD layer laterally surrounds the gate structure. The first ILD layer is etched to define contact openings and a field plate opening. The contact openings and the field plate opening are filled with a conductive material.
    Type: Application
    Filed: September 21, 2019
    Publication date: January 16, 2020
    Inventors: Hsueh-Liang Chou, Dah-Chuen Ho, Hui-Ting Lu, Po-Chih Su, Pei-Lun Wang, Yu-Chang Jong
  • COMPOSITE ETCH STOP LAYER FOR CONTACT FIELD PLATE ETCHING
    Publication number: 20200020803
    Abstract: The present disclosure, in some embodiments, relates to a method of forming an integrated chip. The method may be performed by forming a gate structure over a substrate and between a source region and a drain region. A composite etch stop structure is formed over the gate structure and a first inter-level dielectric (ILD) layer is formed over the composite etch stop structure. The composite etch stop structure has a plurality of stacked dielectric materials. The first ILD layer is etched to concurrently define contact openings extending to the substrate and a field plate opening extending to the composite etch stop structure. The contact openings and the field plate opening are concurrently filled with one or more conductive materials.
    Type: Application
    Filed: September 21, 2019
    Publication date: January 16, 2020
    Inventors: Hui-Ting Lu, Pei-Lun Wang, Yu-Chang Jong
  • Knob lock and lock box having the same
    Patent number: 10513871
    Abstract: The knob lock of the present invention includes a knob, a first driving unit disposed on the knob, a driving barrel, a second driving unit, a lock unit, and a lock core. When the lock core is in a locked state, the driving barrel is restricted from rotating by the lock core, and the knob rotates alone with respect to the driving barrel. When the lock core is in an unlocked state, the restriction to the rotation of the driving barrel by the lock core is removed, the first driving unit applies a driving force on the second driving unit when the knob rotates, and the driving force rotates the driving barrel to make the lock unit rotate together.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: December 24, 2019
    Assignee: SINOX CO., LTD
    Inventors: Chih-Lun Wang, Chia-Hung Wang
  • VOICE CONTROL DEVICE AND METHOD
    Publication number: 20190371323
    Abstract: A voice control device includes a user database, a first image capturing module, a voice command module and a management module. The user database stores first user identification data of a first user account. The first image capturing module captures an environmental image. The voice command module is enabled to receive a voice command for controlling the voice control device. The management module is used to detect whether at least one facial image exists in the environmental image, and detect whether the facial image matches with the first user identification data, and when the facial image matches with the first user identification data, the management module logs in the first user account and enables the voice command module.
    Type: Application
    Filed: April 15, 2019
    Publication date: December 5, 2019
    Inventors: CHENG-YU KAO, NIEN-CHIH WANG, YU-HUNG TSENG, YUEH-FEI CHANG, CHIH-LUN WANG
  • CD34,CD45placental stem cell-enriched cell populations
    Patent number: 10494607
    Abstract: Provided herein are methods and compositions for the production of hepatocytes from placenta stem cells. Further provided herein is the use of such hepatocytes in the treatment of, and intervention in, for example, trauma, inflammation, and degenerative disorders of the liver. Also provided herein are compositions and methods relating to combinations of nanofibrous scaffolds and adherent placental stem cells and methods of using the same in cartilage repair. Finally, provided herein are compositions and methods relating to nonadherent, CD34+CD45? stem cells from placenta.
    Type: Grant
    Filed: February 12, 2008
    Date of Patent: December 3, 2019
    Assignee: CELULARITY, INC.
    Inventors: James W. Edinger, Robert J. Hariri, Jia-Lun Wang, Qian Ye, Marian Pereira, Sascha Dawn Abramson, Kristen S. Labazzo
  • TERMINAL STAND
    Publication number: 20190334259
    Abstract: The present invention relates to a terminal stand, particularly, to a terminal stand with a base body, a movable part and a metal elastic part. The base body includes a casing and a side cover. One end of the movable part is a pressing end, the other end extends to form two arms. The metal elastic part is disposed in the accommodating space, one end of the metal elastic part has two abutments, one of the abutments passes through the first through hole and abut against one of the abutment holes, the other abutment passes through the second through hole and abuts against the other abutment hole, the other end of the metal elastic part has two pins, and at least one leg respectively passes through the corresponding pin hole.
    Type: Application
    Filed: February 7, 2019
    Publication date: October 31, 2019
    Inventors: Chien-Chun WANG, Wen-Lun WANG
  • TERMINAL STAND
    Publication number: 20190334260
    Abstract: A terminal stand is provided. The terminal stand includes a base body, a movable part, a metal elastic part, a first signal element and a second signal element. One end of the metal elastic member includes two first abutments. The first signal element is disposed in a second receiving slot. One end of the first signal element includes a first contact portion and a second abutment. The second signal element is disposed in the second receiving slot. One end of the second signal element includes a second contact portion. The second contact portion contacts with the first contact portion and makes a signal circuit. When the movable member is pressed, the movable member drives the two first abutments to move, and the abutment drives the second abutment to move, with the first contact portion leaving the second contact portion, and the signal circuit is in an off-state state.
    Type: Application
    Filed: February 7, 2019
    Publication date: October 31, 2019
    Inventors: Chien-Chun WANG, Wen-Lun WANG
  • CONTACT FIELD PLATE
    Publication number: 20190334032
    Abstract: The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a gate structure disposed over a substrate between a source region and a drain region. A first inter-level dielectric (ILD) layer is disposed over the substrate and the gate structure and a second ILD layer is disposed over the first ILD layer. A field plate etch stop structure is between the first ILD layer and the second ILD layer. A field plate extends from an uppermost surface of the second ILD layer to the field plate etch stop structure. A plurality of conductive contacts extend from the uppermost surface of the second ILD layer to the source region and the drain region.
    Type: Application
    Filed: July 9, 2019
    Publication date: October 31, 2019
    Inventors: Chia-Cheng Ho, Hui-Ting Lu, Pei-Lun Wang, Yu-Chang Jong, Jyun-Guan Jhou
  • Method, apparatus and system of selecting routing in asymmetric link
    Patent number: 10447574
    Abstract: A method, apparatus and/or system of selecting a routing in an asymmetric link, in which an arbitrary intermediate node of the at least one intermediate node receives routing request information including a first link quality for a path from the source node to the arbitrary neighbor node from an arbitrary neighbor node of the arbitrary intermediate node, acquires a second link quality for a path between the arbitrary intermediate node and the arbitrary neighbor node, acquires a third link quality based on the first and second link qualities, updates the first link quality in the routing request information with the third link quality, and broadcasts an updated routing request information to other neighbor node for the destination node to determine at least one of a desirable forward path or a desirable backward path from the source node to the destination node, may be provided.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: October 15, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Qiang Gao, Ying Huang, Hong Li Ge, Jang-su Lee, Lun Wang
  • CIRCUIT BOARD, PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20190306987
    Abstract: A circuit board including an interconnect substrate and a multilayer structure is provided. The interconnect substrate includes a core layer and a conductive structure disposed on the core layer. The multilayer structure is disposed on the conductive structure. The multilayer structure includes a plurality of dielectric layers and a plurality of circuit structures. The circuit structures are disposed in the dielectric layers. A topmost layer in the circuit structures is exposed to the dielectric layers to be in contact with the conductive structure. A pattern of the topmost layer in the circuit structures and a pattern of a top surface of the conductive structure are engaged with each other.
    Type: Application
    Filed: March 21, 2019
    Publication date: October 3, 2019
    Applicant: Unimicron Technology Corp.
    Inventors: Tzyy-Jang Tseng, Cheng-Ta Ko, Kai-Ming Yang, Chih-Lun Wang