Patents by Inventor Makoto Nakayama
Makoto Nakayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150185123Abstract: An observation and photography apparatus that has a polishing mechanism attached thereto. The polishing mechanism is provided with a turntable with a perpendicular rotation shaft, a polishing cloth for polishing the surface of a sample attached to the bottom surface of the turntable, and a polishing-fluid spraying nozzle disposed below the polishing cloth for spraying polishing fluid containing polishing material upward to we the polishing cloth.Type: ApplicationFiled: June 18, 2013Publication date: July 2, 2015Applicants: Kagoshima University, National University Corporation, Nakayamadenki Co., Ltd.Inventors: Yoshitaka Adachi, Makoto Nakayama
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Patent number: 9038839Abstract: A box includes a first cover and a second cover have engaging mechanisms which engage the one end of the first cover to the one end of the second cover, and have retaining mechanisms which retain the other end of the first cover to the other end of the second cover. The first cover and the second cover are fit to each other in a normal state when the engaging mechanisms are engaged with each other and the retaining mechanisms are retained normally. When an engagement between the engaging mechanisms is in an abnormal state, a projection abuts against at least the other of the one end of the first cover and the one end of the second cover so that a gap is formed and the interior component housed in the internal space can be seen through the gap.Type: GrantFiled: January 29, 2009Date of Patent: May 26, 2015Assignee: YAZAKI CORPORATIONInventors: Makoto Nakayama, Shinichi Hamaguchi
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Patent number: 8507809Abstract: A component-equipped-holder mounting structure having an electric component; a holder holding the electric component; and a holder mounting portion. The electric component includes a housing and a terminal extending therefrom. The holder includes a holder body, a pair of holder arms extending therefrom and configured to position the housing therebetween, the holder arms holding the electric component displaceably such that the electric component is positioned in a longitudinal direction of a mating terminal to be connected to the electric component, and a locking portion protruding from the pair of holder arms and configured to be brought into locking engagement with the housing. The holder mounting portion includes an accommodating portion accommodating therein a mating terminal with the holder slidably inserted into the holder mounting portion.Type: GrantFiled: March 22, 2011Date of Patent: August 13, 2013Assignee: Yazaki CorporationInventors: Makoto Nakayama, Takahiko Mitsui
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Patent number: 8492650Abstract: A partitioned electrical junction box includes at least three partitioned junction box main bodies slidingly joined together to form a main cover, a lower cover and upper cover fitted into the main cover. The lower cover is fitted into a recess groove of the main cover, and the upper cover is fitted into an outside of the main cover. The three partitioned junction box main bodies respectively receive different functional components. First fitting parts are adjacently provided on any two of the partitioned junction box main bodies, and a first bracket is slidingly fitted into the first fitting parts simultaneously to join the two partitioned junction box main bodies.Type: GrantFiled: June 22, 2010Date of Patent: July 23, 2013Assignee: Yazaki CorporationInventors: Makoto Nakayama, Tatsuya Tsubouchi, Hiroshi Sakurai
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Attachment structure for attachment of component to article and electric junction box having thereof
Patent number: 8425262Abstract: The attachment structure for attachment of a component to an article in two postures includes a case as the article and the component. The case includes a pair of guide portions, first locking arms and a second locking arm. The component includes a slide portion between the guide portions, a stopper arranged in an end of the slide portion and formed in a size which is not able to insert stopper between the guide portions. The first locking arm is engaged where the slide portion is inserted in a space between the guide portions from one end and slides toward an other end. The second locking arm is engaged where the slide portion is inserted in the space between the guide portions from the other end in a posture opposite to that in which the slide portion is inserted between the pair of the guide portions from the one end.Type: GrantFiled: January 26, 2012Date of Patent: April 23, 2013Assignee: Yazaki CorporationInventors: Hitoshi Hirasawa, Hiroaki Takahashi, Makoto Nakayama, Takahiko Mitsui -
Patent number: 8414334Abstract: A holder-mounting structure comprises a holder and a holder mounting portion into which the holder is slidably inserted. The holder includes a holder body for mounting of an electric component and a pair of plate portions extending from the holder body such that the electric component resides therebetween. The plate portions include a thick-walled portion continuing to the holder body and a thin-walled portion continuing to the thick-walled portion and provided at an end of the plate portion away from the holder body. The holder mounting portion includes an accommodating portion into which a connecting terminal connected to the electric component is accommodated. The thin-walled portion includes a complete-locking portion configured to be brought into locking engagement with the holder at a position where the electric component is connected to the connecting terminal with the holder slidably inserted into the accommodating portion.Type: GrantFiled: March 22, 2011Date of Patent: April 9, 2013Assignee: Yazaki CorporationInventors: Makoto Nakayama, Takahiko Mitsui
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ATTACHMENT STRUCTURE FOR ATTACHMENT OF COMPONENT TO ARTICLE AND ELECTRIC JUNCTION BOX HAVING THEREOF
Publication number: 20130082048Abstract: The attachment structure for attachment of a component to an article in two postures includes a case as the article and the component. The case includes a pair of guide portions, first locking arms and a second locking arm. The component includes a slide portion between the guide portions, a stopper arranged in an end of the slide portion and formed in a size which is not able to insert stopper between the guide portions. The first locking arm is engaged where the slide portion is inserted in a space between the guide portions from one end and slides toward an other end. The second locking arm is engaged where the slide portion is inserted in the space between the guide portions from the other end in a posture opposite to that in which the slide portion is inserted between the pair of the guide portions from the one end.Type: ApplicationFiled: January 26, 2012Publication date: April 4, 2013Applicant: Yazaki CorporationInventors: Hitoshi HIRASAWA, Hiroaki Takahashi, Makoto Nakayama, Takahiko Mitsui -
Publication number: 20130056238Abstract: An electric connection box 1 includes a bracket 2 in which a plurality of connectors 7a, 7b, 8a, 8b, 9a, 9b, 10a, 10b, 10b? joined with each end of electric wires 11, and a case main body 3 receiving the bracket 2. The electric connection box is provided with a mount device 81 mounting the bracket 2 in the case main body 3 movably between a near position near an opening 3a of a case main body 3 and a fix position 3c deeper than the near position near the opening 3c in the case main body 3, and a maintain device 82 maintaining a state that the bracket 2 is positioned at the near position near the opening 3a, and a fix device 83 fixing the bracket 2 positioned at the fix position 3c at the case main body 3.Type: ApplicationFiled: May 11, 2011Publication date: March 7, 2013Applicant: YAZAKI CORPORATIONInventors: Makoto Nakayama, Norio Ito, Ryo Nakano, Tatsuya Tsubouchi
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Patent number: 8378454Abstract: A semiconductor device has a semiconductor substrate, a multi-layered wiring construction formed over the semiconductor device, and a metal-insulator-metal (MIM) capacitor arrangement established in the multi-layered wiring construction. The MIM capacitor arrangement includes first, second, third, fourth, fifth, and sixth electrode structures, which are arranged in order in parallel with each other at regular intervals. The first, second, fifth and sixth electrode structures are electrically connected to each other so as to define a first capacitor, and the third and fourth electrode structures are electrically connected to each other so as to define a second capacitor.Type: GrantFiled: June 30, 2011Date of Patent: February 19, 2013Assignee: Renesas Electronics CorporationInventors: Masayuki Furumiya, Kuniko Kikuta, Ryota Yamamoto, Makoto Nakayama
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Patent number: 8229370Abstract: A method for automatically adjusting signal output power of a ZigBee wireless module. The method includes sending a signal with an output power from a transmitter of a ZigBee module to a receiver. The ZigBee module includes a power amplifier/low noise amplifier (PA/LNA) circuit. The output power can be adjusted between a minimum level and a maximum level. Additionally, the method includes generating a Link Quality Indicator (LQI) by the receiver based on the signal strength and returning the LQI to the ZigBee module. If the LQI is not within a predetermined range between a maximum value and a minimum value, the method includes adjusting the output power for sending next signal. If the output power from the transmitter has reached to the minimum level or the maximum level, the method further includes adjusting the PA/LNA circuit of the ZigBee module for maintaining the LQI within the predetermined range.Type: GrantFiled: March 10, 2009Date of Patent: July 24, 2012Assignee: Minebea Co., Ltd.Inventors: Mario Wu, Makoto Nakayama, John Guo, Jack Lieng, Walter Lee
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Patent number: 8129617Abstract: An electric distribution box includes a resin exterior cover which houses an interior component and has an opening for resin-molding the exterior cover on a bottom wall of the exterior cover, and a resin cap which is fit into the opening to close the opening. A flange formed on an outer periphery of the resin cap is kept in intimate contact with the bottom wall of the exterior cover. A molding hole for forming a locking piece by resin molding is provided on the flange. The locking piece locks the resin cap to the opening of the exterior cover. A swell is formed at an entire peripheral edge of the molding hole of the resin cap. An outer face of the interior component is kept in intimate contact with the swell so that the molding hole of the resin cap is closed by the outer face of the interior component and the flange is kept in intimate contact with the bottom wall of the exterior cover.Type: GrantFiled: January 29, 2009Date of Patent: March 6, 2012Assignee: Yazaki CorporationInventors: Makoto Nakayama, Shinichi Hamaguchi
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Patent number: 8071877Abstract: A box for accommodating an electric connection box is provided. The box includes a lower cover which has a plurality of walls for surrounding a space to accommodate the electric connection box toward a predetermined insertion direction, and an upper cover. The plurality of walls includes: a first wall which extends along the insertion direction; second and third walls which extend from the first wall in a direction intersecting the insertion direction and faces each other; a fourth wall which extends from the first, second and third walls at a deep side of the insertion direction so as to support the electric connection box; and a fifth wall which extends from the second and third walls along the insertion direction, and is substantially parallel to the first wall so as to press-sandwich the electric connection box by the first and fifth walls.Type: GrantFiled: March 27, 2009Date of Patent: December 6, 2011Assignee: Yazaki CorporationInventors: Makoto Nakayama, Shinichi Hamaguchi, Yutaka Sekiuchi
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Publication number: 20110254130Abstract: A semiconductor device has a semiconductor substrate, a multi-layered wiring construction formed over the semiconductor device, and a metal-insulator-metal (MIM) capacitor arrangement established in the multi-layered wiring construction. The MIM capacitor arrangement includes first, second, third, fourth, fifth, and sixth electrode structures, which are arranged in order in parallel with each other at regular intervals. The first, second, fifth and sixth electrode structures are electrically connected to each other so as to define a first capacitor, and the third and fourth electrode structures are electrically connected to each other so as to define a second capacitor.Type: ApplicationFiled: June 30, 2011Publication date: October 20, 2011Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Masayuki FURUMIYA, Kuniko KIKUTA, Ryota YAMAMOTO, Makoto NAKAYAMA
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Publication number: 20110237129Abstract: A holder-mounting structure comprises a holder and a holder mounting portion into which the holder is slidably inserted. The holder includes a holder body for mounting of an electric component and a pair of plate portions extending from the holder body such that the electric component resides therebetween. The plate portions include a thick-walled portion continuing to the holder body and a thin-walled portion continuing to the thick-walled portion and provided at an end of the plate portion away from the holder body. The holder mounting portion includes an accommodating portion into which a connecting terminal connected to the electric component is accommodated. The thin-walled portion includes a complete-locking portion configured to be brought into locking engagement with the holder at a position where the electric component is connected to the connecting terminal with the holder slidably inserted into the accommodating portion.Type: ApplicationFiled: March 22, 2011Publication date: September 29, 2011Applicant: Yazaki CorporationInventors: Makoto Nakayama, Takahiko Mitsui
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Publication number: 20110232960Abstract: A component-equipped-holder mounting structure comprises an electric component; a holder holding the electric component; and a holder mounting portion. The electric component includes a housing and a terminal extending therefrom. The holder includes a holder body, a pair of holder arms extending therefrom and configured to position the housing therebetween, the holder arms holding the electric component displaceably such that the electric component is positioned in a longitudinal direction of a mating terminal to be connected to the electric component, and a locking portion protruding from the pair of holder arms and configured to be brought into locking engagement with the housing. The holder mounting portion includes an accommodating portion accommodating therein a mating terminal with the holder slidably inserted into the holder mounting portion.Type: ApplicationFiled: March 22, 2011Publication date: September 29, 2011Applicant: Yazaki CorporationInventors: Makoto Nakayama, Takahiko Mitsui
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Patent number: 7986026Abstract: A semiconductor device has a semiconductor substrate, a multi-layered wiring construction formed over the semiconductor device, and a metal-insulator-metal (MIM) capacitor arrangement established in the multi-layered wiring construction. The MIM capacitor arrangement includes first, second, third, fourth, fifth, and sixth electrode structures, which are arranged in order in parallel with each other at regular intervals. The first, second, fifth and sixth electrode structures are electrically connected to each other so as to define a first capacitor, and the third and fourth electrode structures are electrically connected to each other so as to define a second capacitor.Type: GrantFiled: February 17, 2010Date of Patent: July 26, 2011Assignee: Renesas Electronics CorporationInventors: Masayuki Furumiya, Kuniko Kikuta, Ryota Yamamoto, Makoto Nakayama
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Patent number: 7888596Abstract: In an upper surface of a bottom wall of a box body having a part accommodation room formed inside, a recess is provided. In the bottom of the recess, a bolt hole to fix an electrical junction box to a vehicle body is penetrated. In the upper surface of the bottom wall of the body hole, a flat sealing surface is formed to surround an opening of the recess. When an electronic unit is accommodated in the part accommodation room, the bottom surface of the electronic unit is brought into close contact with the sealing surface to close the recess, thus providing a seal between the part accommodation room and recess.Type: GrantFiled: December 27, 2007Date of Patent: February 15, 2011Assignee: Yazaki CorporationInventors: Masahiro Kanamaru, Makoto Nakayama
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Publication number: 20100319951Abstract: A partitioned electrical junction box includes at least three partitioned junction box main bodies slidingly joined together to form a main cover, a lower cover and upper cover fitted into the main cover. The lower cover is fitted into a recess groove of the main cover, and the upper cover is fitted into an outside of the main cover. The three partitioned junction box main bodies respectively receive different functional components. First fitting parts are adjacently provided on any two of the partitioned junction box main bodies, and a first bracket is slidingly fitted into the first fitting parts simultaneously to join the two partitioned junction box main bodies.Type: ApplicationFiled: June 22, 2010Publication date: December 23, 2010Applicant: Yazaki CoroporationInventors: Makoto Nakayama, Tatsuya Tsubouchi, Hiroshi Sakurai
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Publication number: 20100233975Abstract: A method for automatically adjusting signal output power of a ZigBee wireless module. The method includes sending a signal with an output power from a transmitter of a ZigBee module to a receiver. The ZigBee module includes a power amplifier/low noise amplifier (PA/LNA) circuit. The output power can be adjusted between a minimum level and a maximum level. Additionally, the method includes generating a Link Quality Indicator (LQI) by the receiver based on the signal strength and returning the LQI to the ZigBee module. If the LQI is not within a predetermined range between a maximum value and a minimum value, the method includes adjusting the output power for sending next signal. If the output power from the transmitter has reached to the minimum level or the maximum level, the method further includes adjusting the PA/LNA circuit of the ZigBee module for maintaining the LQI within the predetermined range.Type: ApplicationFiled: March 10, 2009Publication date: September 16, 2010Applicant: Minebea Co., Ltd.Inventors: Mario Wu, Makoto Nakayama, John Guo, Jack Lieng, Walter Lee
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Patent number: D664936Type: GrantFiled: September 23, 2010Date of Patent: August 7, 2012Assignee: Yazaki CorporationInventors: Makoto Nakayama, Takahiko Mitsui