Patents by Inventor Makoto Nakayama

Makoto Nakayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7748756
    Abstract: In a sidewall of a connector frame, a cantilevered lock arm is provided. A lower end of the lock arm is connected to the sidewall with a curved supporting unit interposed therebetween. The lock arm extends upward from the supporting unit with a space. The supporting unit has a slit to increase the flexibility of the lock arm. An engagement protrusion is provided on the lock arm. Moreover, a fitting sidewall is provided in a box body, and a lock wall having a lock protrusion is provided outside the fitting sidewall. The lock protrusion includes a downward-facing engagement surface. A mold hole used in molding the engagement surface is formed between the fitting sidewall and lock wall. An abutment surface is provided at an upper end of the fitting sidewall and contacted with the supporting unit to close communication between the mold hole and the slit.
    Type: Grant
    Filed: December 27, 2007
    Date of Patent: July 6, 2010
    Assignee: Yazaki Corporation
    Inventors: Masahiro Kanamaru, Makoto Nakayama, Tarou Inoue
  • Patent number: 7750238
    Abstract: An electrical junction box includes a box body provided with a first groove; an attachment bracket provided with a second groove; and a lower cover provided attached to the bottom surface of the box body. When the attachment bracket is properly mounted on the box body, the first and second grooves are arranged to form a single continuous third groove. A protrusion is provided on the lower cover and fits to the third groove.
    Type: Grant
    Filed: December 19, 2007
    Date of Patent: July 6, 2010
    Assignee: Yazaki Corporation
    Inventors: Masahiro Kanamaru, Makoto Nakayama, Tarou Inoue
  • Publication number: 20100148307
    Abstract: A semiconductor device has a semiconductor substrate, a multi-layered wiring construction formed over the semiconductor device, and a metal-insulator-metal (MIM) capacitor arrangement established in the multi-layered wiring construction. The MIM capacitor arrangement includes first, second, third, fourth, fifth, and sixth electrode structures, which are arranged in order in parallel with each other at regular intervals. The first, second, fifth and sixth electrode structures are electrically connected to each other so as to define a first capacitor, and the third and fourth electrode structures are electrically connected to each other so as to define a second capacitor.
    Type: Application
    Filed: February 17, 2010
    Publication date: June 17, 2010
    Applicant: NEC ELECTRONICS CORPORATION
    Inventors: Masayuki FURUMIYA, Kuniko KIKUTA, Ryota YAMAMOTO, Makoto NAKAYAMA
  • Patent number: 7705422
    Abstract: A semiconductor device has a semiconductor substrate, a multi-layered wiring construction formed over the semiconductor device, and a metal-insulator-metal (MIM) capacitor arrangement established in the multi-layered wiring construction. The MIM capacitor arrangement includes first, second, third, fourth, fifth, and sixth electrode structures, which are arranged in order in parallel with each other at regular intervals. The first, second, fifth and sixth electrode structures are electrically connected to each other so as to define a first capacitor, and the third and fourth electrode structures are electrically connected to each other so as to define a second capacitor.
    Type: Grant
    Filed: October 12, 2005
    Date of Patent: April 27, 2010
    Assignee: NEC Electronics Corporation
    Inventors: Masayuki Furumiya, Kuniko Kikuta, Ryota Yamamoto, Makoto Nakayama
  • Patent number: 7696432
    Abstract: In a mounting structure of an electrical junction box, the electrical junction box is vertically mounted on a wall surface along a vertical direction in a state where mating faces of an under case member and an upper case member are set in the vertical direction. Each of the under case member and the upper case member has a pair of left and right locking projections provided therein. A bracket including a backside plate part and a pair of case hook parts provided upright from both sides of the backside plate part is disposed along the vertical direction on the wall surface. The electrical junction box is slidingly inserted from above along the backside plate part in the vertical direction until both pairs of locking projections of the under case member and the upper case member are locked to the pair of case hook parts. Thus, the electrical junction box is mounted on the wall surface by use of the bracket.
    Type: Grant
    Filed: August 29, 2007
    Date of Patent: April 13, 2010
    Assignee: Yazaki Corporation
    Inventors: Makoto Nakayama, Katsuya Hashimoto, Hirofumi Mizuno
  • Patent number: 7684436
    Abstract: Various services for a mobile communication network or an IP network are implemented by processing necessary information suitably in accordance with a service type so as to exchange the information to a service control device and transmitting the results of the service process by the service control device to the mobile communication network or the IP network, for a service request from the mobile communication network or the IP network. A gateway device of the present invention retains a signal defining various rules or policies received from the service control device, judges a service type and a destination requested from the service request signal by the various rules or policies for the service request signal transmitted from a communication terminal of the mobile communication network or the communication terminal of the IP network, performs protocol conversion on the service request signal in accordance with the service type, and transmits the service request signal to the corresponding destination.
    Type: Grant
    Filed: June 18, 2003
    Date of Patent: March 23, 2010
    Assignee: NTT DoCoMo, Inc.
    Inventors: Makoto Nakayama, Yasuhiko Kokubun, Masayuki Nakanishi, Wataru Takita
  • Patent number: 7663207
    Abstract: A semiconductor device includes a capacitor with an MIM structure, by which the dimensional accuracy of the device is improved, and a stable capacitance value is given. The semiconductor device 100 includes: a semiconductor substrate 102; a capacitor forming region 130 in which an MIM capacitor is formed, which has an insulating interlayer 104 formed on the semiconductor substrate 102, a first electrode 110, and a second electrode 112, and the first electrode 110 and the second electrode 112 are arranged facing each other through the insulating interlayer 104; and a shielding region 132 which includes a plurality of shielding electrodes 114 formed in the outer edge of the capacitor forming region 130 and, at the same time, set at a predetermined potential in the same layer as that of the MIM capacitor on the semiconductor substrate 102, and shields the capacitor forming region 130 from other regions.
    Type: Grant
    Filed: April 20, 2006
    Date of Patent: February 16, 2010
    Assignee: NEC Electronics Corporation
    Inventors: Kuniko Kikuta, Masayuki Furumiya, Ryota Yamamoto, Makoto Nakayama
  • Patent number: 7622674
    Abstract: A wire harness leading-out opening is provided at a junction between an electric connection box and a bottom surface cover which constitute an electric connection box. A cylindrical wire harness leading-out guide is provided on the periphery of the wire harness leading-out opening, and is formed in a way that the both circumferential ends of a half-cylindrical body formed on the electric connection box and a half-cylindrical body formed on the bottom surface cover are coupled to each other. In the inner circumference of a circumferential junction between the peripheral walls of the two half-cylindrical bodies, a concave portion is provided to accommodate a loose portion of an armoring member wrapped around the outer circumference of the wire harness.
    Type: Grant
    Filed: April 18, 2008
    Date of Patent: November 24, 2009
    Assignee: Yazaki Corporation
    Inventors: Masahiro Kanamaru, Makoto Nakayama, Tarou Inoue
  • Publication number: 20090242267
    Abstract: A box for accommodating an electric connection box is provided. The box includes a lower cover which comprises a plurality of walls for surrounding a space to accommodate the electric connection box toward a predetermined insertion direction, and an upper cover. The plurality of walls includes: a first wall which extends along the insertion direction; second and third walls which extend from the first wall in a direction intersecting the insertion direction and faces each other; a fourth wall which extends from the first, second and third walls at a deep side of the insertion direction so as to support the electric connection box; and a fifth wall which extends from the second and third walls along the insertion direction, and is substantially parallel to the first wall so as to press-sandwich the electric connection box by the first and fifth walls.
    Type: Application
    Filed: March 27, 2009
    Publication date: October 1, 2009
    Applicant: YAZAKI CORPORATION
    Inventors: Makoto NAKAYAMA, Shinichi HAMAGUCHI, Yutaka SEKIUCHI
  • Patent number: 7586038
    Abstract: An electrical junction box is provided to reduce looseness of a cover. The electrical junction box includes a box body and the cover to be slidably mounted on a lateral side of the box body from above. The cover has a front wall and a pair of left and right sidewalls connected to both left and right ends of the front wall to overlap with left and right connecting walls of the box body, providing a U-shaped cross section. The electrical junction box further includes first slide guides provided on both of the cover and the box body and second slide guides provided on both of the cover and the box body. The second slide guides are positioned in areas where the left and right sidewalls of the cover overlapping with the left and right connecting walls of the box body. Further, the second slide guides are closer to the front wall of the cover being mounted to the box body than the first slide guides.
    Type: Grant
    Filed: December 19, 2007
    Date of Patent: September 8, 2009
    Assignee: Yazaki Corporation
    Inventors: Masahiro Kanamaru, Makoto Nakayama, Tarou Inoue
  • Publication number: 20090200298
    Abstract: A box includes a first cover, a second cover, and an interior component housed in an internal space formed when the first cover and second cover are fit to each other. The first cover and the second cover have engaging mechanisms which engage the one end of the first cover to the one end of the second cover, and have retaining mechanisms which retain the other end of the first cover to the other end of the second cover. The first cover and the second cover are fit to each other in a normal state in a case that the engaging mechanisms are engaged with each other in a state where the retaining mechanisms are normally retained to each other. A projection is provided on at least one of the one end of the first cover and the one end of the second cover.
    Type: Application
    Filed: January 29, 2009
    Publication date: August 13, 2009
    Applicant: YAZAKI CORPORATION
    Inventors: Makoto NAKAYAMA, Shinichi HAMAGUCHI
  • Publication number: 20090194324
    Abstract: An electric distribution box includes a resin exterior cover which houses an interior component and has an opening for resin-molding the exterior cover on a bottom wall of the exterior cover, and a resin cap which is fit into the opening to close the opening. A flange formed on an outer periphery of the resin cap is kept in intimate contact with the bottom wall of the exterior cover. A molding hole for forming a locking piece by resin molding is provided on the flange. The locking piece locks the resin cap to the opening of the exterior cover. A swell is formed at an entire peripheral edge of the molding hole of the resin cap. An outer face of the interior component is kept in intimate contact with the swell so that the molding hole of the resin cap is closed by the outer face of the interior component and the flange is kept in intimate contact with the bottom wall of the exterior cover.
    Type: Application
    Filed: January 29, 2009
    Publication date: August 6, 2009
    Applicant: Yazaki Corporation
    Inventors: Makoto NAKAYAMA, Shinichi Hamaguchi
  • Patent number: 7566829
    Abstract: In an electrical junction box, an electrical junction box main body is housed in a housing case consisting of an under case member and an upper case member, and a wire harness having its one end connected to the electrical junction box main body is led out to the outside of the housing case. The under case member has a pair of holding arms provided therein, which temporarily hold the wire harness to be led out roughly in a desired lead-out direction, the wire harness being led out from the under case member, in a state where the electrical junction box main body is temporarily housed in the under case member. The upper case member has guide ribs provided therein, which guide the wire harness in the desired lead-out direction, the wire harness being led out roughly in the desired lead-out direction by the pair of holding arms in the under case member, in an assembled state of the under case member and the upper case member.
    Type: Grant
    Filed: August 29, 2007
    Date of Patent: July 28, 2009
    Assignee: Yazaki Corporation
    Inventors: Makoto Nakayama, Katsuya Hashimoto, Hirofumi Mizuno
  • Patent number: 7563109
    Abstract: An electrical junction box includes an accommodation box having an accommodation box body having an accommodation space penetrating trough the accommodation box body up and down and an electrical component mounting block inserted into the accommodation space from either upside thereof or the underside and fixed in the accommodation space. The electrical junction box fiber includes a first locking mechanism arranged between an inner wall of the accommodation box body and an outer wall of a block body to lock up the electrical component mounting block inserted into the accommodation space from its upside and a second locking mechanism arranged between the inner wall of the accommodation box body and the outer wall of the block body to lock up the electrical component mounting block inserted into the accommodation space from the underside.
    Type: Grant
    Filed: January 15, 2008
    Date of Patent: July 21, 2009
    Assignee: Yazaki Corporation
    Inventors: Masahiro Kanamaru, Makoto Nakayama, Katsuya Hashimoto
  • Publication number: 20090115296
    Abstract: An electrical junction box comprises a box body provided with a first groove; an attachment bracket provided with a second groove; and a lower cover provided attached to the bottom surface of the box body. When the attachment bracket is properly mounted on the box body, the first and second grooves are arranged to form a single continuous third groove. A protrusion is provided on the lower cover and fits to the third groove.
    Type: Application
    Filed: December 19, 2007
    Publication date: May 7, 2009
    Inventors: Masahiro KANAMARU, Makoto Nakayama, Tarou Inoue
  • Patent number: 7507905
    Abstract: An electrical junction box facilitates a worker's wiring of a wire harness without using a superfluous component and allows the workability in assembling the electrical junction box as well as that in disassembling to be improved. The electrical junction box includes a box body and a cover to be mounted to the box body after wiring wire harnesses about the box body. The box body has wiring grooves shaped to have U-shaped cross sections and arranged on its exterior surface to accommodate the wire harnesses, which have been drawn out of the box body through its one side and further led from an upper part of the one side downwardly. Left and right sidewalls defining each groove are provided, at their leading ends, with temporary locking parts restricting slipping of the wire harness out of the wiring groove. The cover is provided with restricting walls (sidewalls, rib) restricting outward deflection of the left and right sidewalls.
    Type: Grant
    Filed: December 19, 2007
    Date of Patent: March 24, 2009
    Assignee: Yazaki Corporation
    Inventors: Masahiro Kanamaru, Makoto Nakayama, Tarou Inoue
  • Patent number: 7494867
    Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a lower interconnection on a semiconductor substrate; forming a first interlayer insulation film in which the lower interconnection is buried; forming an MIM capacitive element on the first interlayer insulation film, the MIM capacitive element being formed by layering a lower electrode, a dielectric film, and an upper electrode; forming a second interlayer insulation film in which the MIM capacitive element is buried; forming via holes in the second interlayer insulation film so as to reach the lower electrode; forming a connection plug by filling the via hole with conductive film; and forming an upper interconnection to be connected to the connection plug above the second interlayer insulation film.
    Type: Grant
    Filed: March 5, 2007
    Date of Patent: February 24, 2009
    Assignee: NEC Electronics Corporation
    Inventors: Kuniko Kikuta, Makoto Nakayama
  • Patent number: 7459631
    Abstract: Provided is a structure for housing an electrical junction box in a housing box by inserting the electrical junction box into the housing box from above and also for fixing the electrical junction box to the housing box so as to prevent slipping-off thereof by engagement between engagement parts provided on external side surfaces of the electrical junction box and engagement parts provided on internal side surfaces of the housing box, both of which face each other in parallel with an insertion direction in insertion of the electrical junction box. Moreover, groove-like depressions extended along the insertion direction into the housing box are provided in the external side surfaces of the electrical junction box, and engagement convex parts are provided in the depressions. Furthermore, engagement projections engaged with the engagement convex parts are provided on the internal side surfaces of the housing box.
    Type: Grant
    Filed: October 5, 2007
    Date of Patent: December 2, 2008
    Assignee: Yazaki Corporation
    Inventors: Makoto Nakayama, Masahiro Kanamaru
  • Publication number: 20080256996
    Abstract: A lock mechanism includes: a lock arm provided in a cantilever manner on an inner wall of a part compartment of a box body of an electric connection box; and a lock projection provided to the lock arm on its surface facing a part housed in the part compartment. The lock arm can be divided in a longitudinal direction into: a base end region fixed to the inner wall; upper end region located in the free end which interferes with the part and receives a pressing force for unlocking operation; and a middle region located within a predetermined distance range between the base and upper end region. The flexural rigidity of the base and upper end region is set larger than that of the middle region by providing ribs on the base and upper end region and providing no ribs on the middle region.
    Type: Application
    Filed: April 18, 2008
    Publication date: October 23, 2008
    Inventors: Makoto Nakayama, Masahiro Kanamaru
  • Patent number: D597519
    Type: Grant
    Filed: February 27, 2008
    Date of Patent: August 4, 2009
    Assignee: NEC Infrontia Corporation
    Inventors: Tetsuo Nakano, Makoto Nakayama, Motomasa Igarashi, Hiromitsu Ogura, Masafuku Akatsu, Eiichi Taniguchi, Hiromitsu Nakano, Takeshi Suzuki, Takayuki Izumo, Masaki Kato, Takashi Matsuda