Abstract: A wire harness leading-out opening is provided at a junction between an electric connection box and a bottom surface cover which constitute an electric connection box. A cylindrical wire harness leading-out guide is provided on the periphery of the wire harness leading-out opening, and is formed in a way that the both circumferential ends of a half-cylindrical body formed on the electric connection box and a half-cylindrical body formed on the bottom surface cover are coupled to each other. In the inner circumference of a circumferential junction between the peripheral walls of the two half-cylindrical bodies, a concave portion is provided to accommodate a loose portion of an armoring member wrapped around the outer circumference of the wire harness.

Abstract: On a silicon substrate, a first insulation layer, a lower conductive layer, a capacitor-insulator layer, and an upper conductive layer are formed in that order. Then, a first resist pattern is formed, the upper conductive layer is etched to form an upper electrode, and the capacitor-insulator layer is successively etched partway under the same etching condition as that of the upper conductive layer. Next, second resist pattern is formed, the remaining part of the capacitor-insulator layer is etched to form a second insulation layer, and the lower conductive layer is successively etched under the same etching condition as that of the capacitor-insulator layer so as to form a lower electrode and a lower wiring. In this manner, an MiM capacitor element constituted by the upper electrode, a part of the second insulation layer, and the lower electrode can be fabricated.

Abstract: In a mounting structure of an electrical junction box, the electrical junction box is vertically mounted on a wall surface along a vertical direction in a state where mating faces of an under case member and an upper case member are set in the vertical direction. Each of the under case member and the upper case member has a pair of left and right locking projections provided therein. A bracket including a backside plate part and a pair of case hook parts provided upright from both sides of the backside plate part is disposed along the vertical direction on the wall surface. The electrical junction box is slidingly inserted from above along the backside plate part in the vertical direction until both pairs of locking projections of the under case member and the upper case member are locked to the pair of case hook parts. Thus, the electrical junction box is mounted on the wall surface by use of the bracket.

Abstract: A lock structure for a box includes a first box member having a retaining projection, and a second box member having an elastic retaining arm. The retaining arm has at its distal end a retaining portion for engagement with the retaining projection. The first box member has an arm restraint rib which restricts a releasing movement of the retaining arm in a condition in which the retaining arm and the retaining projection are engaged with each other. When the arm restraint rib is pressed by the elastic retaining arm, the arm restraint rib is deformed by a pressing force of the elastic retaining arm. A retaining distance of the retaining projection relative to the retaining portion of the elastic retaining arm is larger than a gap between the elastic retaining arm and the arm restraint rib in the engaged condition.

Abstract: In a sidewall of a connector frame, a cantilevered lock arm is provided. A lower end of the lock arm is connected to the sidewall with a curved supporting unit interposed therebetween. The lock arm extends upward from the supporting unit with a space. The supporting unit has a slit to increase the flexibility of the lock arm. An engagement protrusion is provided on the lock arm. Moreover, a fitting sidewall is provided in a box body, and a lock wall having a lock protrusion is provided outside the fitting sidewall. The lock protrusion includes a downward-facing engagement surface. A mold hole used in molding the engagement surface is formed between the fitting sidewall and lock wall. An abutment surface is provided at an upper end of the fitting sidewall and contacted with the supporting unit to close communication between the mold hole and the slit.

Abstract: An electrical junction box includes an accommodation box having an accommodation box body having an accommodation space penetrating trough the accommodation box body up and down and an electrical component mounting block inserted into the accommodation space from either upside thereof or the underside and fixed in the accommodation space. The electrical junction box fiber includes a first locking mechanism arranged between an inner wall of the accommodation box body and an outer wall of a block body to lock up the electrical component mounting block inserted into the accommodation space from its upside and a second locking mechanism arranged between the inner wall of the accommodation box body and the outer wall of the block body to lock up the electrical component mounting block inserted into the accommodation space from the underside.

Abstract: In an upper surface of a bottom wall of a box body having a part accommodation room formed inside, a recess is provided. In the bottom of the recess, a bolt hole to fix an electrical junction box to a vehicle body is penetrated. In the upper surface of the bottom wall of the body hole, a flat sealing surface is formed to surround an opening of the recess. When an electronic unit is accommodated in the part accommodation room, the bottom surface of the electronic unit is brought into close contact with the sealing surface to close the recess, thus providing a seal between the part accommodation room and recess.

Abstract: An electrical junction box facilitates a worker's wiring of a wire harness without using a superfluous component and allows the workability in assembling the electrical junction box as well as that in disassembling to be improved. The electrical junction box includes a box body and a cover to be mounted to the box body after wiring wire harnesses about the box body. The box body has wiring grooves shaped to have U-shaped cross sections and arranged on its exterior surface to accommodate the wire harnesses, which have been drawn out of the box body through its one side and further led from an upper part of the one side downwardly. Left and right sidewalls defining each groove are provided, at their leading ends, with temporary locking parts restricting slipping of the wire harness out of the wiring groove. The cover is provided with restricting walls (sidewalls, rib) restricting outward deflection of the left and right sidewalls.

Abstract: An electrical junction box is provided to reduce looseness of a cover. The electrical junction box includes a box body and the cover to be slidably mounted on a lateral side of the box body from above. The cover has a front wall and a pair of left and right sidewalls connected to both left and right ends of the front wall to overlap with left and right connecting walls of the box body, providing a U-shaped cross section. The electrical junction box further includes first slide guides provided on both of the cover and the box body and second slide guides provided on both of the cover and the box body. The second slide guides are positioned in areas where the left and right sidewalls of the cover overlapping with the left and right connecting walls of the box body. Further, the second slide guides are closer to the front wall of the cover being mounted to the box body than the first slide guides.

Abstract: Provided is a structure for housing an electrical junction box in a housing box by inserting the electrical junction box into the housing box from above and also for fixing the electrical junction box to the housing box so as to prevent slipping-off thereof by engagement between engagement parts provided on external side surfaces of the electrical junction box and engagement parts provided on internal side surfaces of the housing box, both of which face each other in parallel with an insertion direction in insertion of the electrical junction box. Moreover, groove-like depressions extended along the insertion direction into the housing box are provided in the external side surfaces of the electrical junction box, and engagement convex parts are provided in the depressions. Furthermore, engagement projections engaged with the engagement convex parts are provided on the internal side surfaces of the housing box.

Abstract: In an electrical junction box, an electrical junction box main body is housed in a housing case consisting of an under case member and an upper case member, and a wire harness having its one end connected to the electrical junction box main body is led out to the outside of the housing case. The under case member has a pair of holding arms provided therein, which temporarily hold the wire harness to be led out roughly in a desired lead-out direction, the wire harness being led out from the under case member, in a state where the electrical junction box main body is temporarily housed in the under case member. The upper case member has guide ribs provided therein, which guide the wire harness in the desired lead-out direction, the wire harness being led out roughly in the desired lead-out direction by the pair of holding arms in the under case member, in an assembled state of the under case member and the upper case member.

Abstract: A lock structure for a box includes a first box member having a retaining projection, and a second box member having an elastic retaining arm. The retaining arm has at its distal end a retaining portion for engagement with the retaining projection. The first box member has an arm restraint rib which restricts a releasing movement of the retaining arm in a condition in which the retaining arm and the retaining projection are engaged with each other. When the arm restraint rib is pressed by the elastic retaining arm, the arm restraint rib is deformed by a pressing force of the elastic retaining arm. A retaining distance of the retaining projection relative to the retaining portion of the elastic retaining arm is larger than a gap between the elastic retaining arm and the arm restraint rib in the engaged condition.

Abstract: A lower interconnection is provided on a semiconductor substrate. A MIM capacitive element is provided on a first interlayer insulation film in which the lower interconnection is buried, and includes a lower electrode, an upper electrode, and a dielectric film sandwiched therebetween. An upper interconnection is provided on a second interlayer insulation film in which the MIM capacitive element is buried. A contact electrically connects the lower electrode and the upper interconnection. The lower electrode is mainly formed of Al, so that they are lower in electrical resistance than barrier metal, and also low in stress value. Therefore, it becomes possible to widen the area of the lower electrode for electrically connecting the contact while restraining their influences on charge accumulation and close contact between the lower electrode and the insulation film. In addition, since the electrical resistance is lowered, the thickness of the lower electrode can be increased.

Abstract: A lower interconnection is provided on a semiconductor substrate. A MIM capacitive element is provided on a first interlayer insulation film in which the lower interconnection is buried, and includes a lower electrode, an upper electrode, and a dielectric film sandwiched therebetween. An upper interconnection is provided on a second interlayer insulation film in which the MIM capacitive element is buried. A contact electrically connects the lower electrode and the upper interconnection. The lower electrode is mainly formed of Al, so that they are lower in electrical resistance than barrier metal, and also low in stress value. Therefore, it becomes possible to widen the area of the lower electrode for electrically connecting the contact while restraining their influences on charge accumulation and close contact between the lower electrode and the insulation film. In addition, since the electrical resistance is lowered, the thickness of the lower electrode can be increased.

Abstract: As for the resistor on the semiconductor substrate, it is required to achieve obtaining a metal resistor, which can be formed in the latter half of a preliminary process for manufacturing a semiconductor, in addition to forming a polysilicon resistor, which is formed in the first half of the preliminary process. A capacitor having MIM structure comprises a lower electrode, a capacitive insulating film and an upper electrode, all of which are sequentially formed in this sequence. A resistor structure having MIM structure also comprises a lower electrode, a capacitive insulating film and a resistor, all of which are sequentially formed in this sequence. In this case, the biasing conditions thereof should be selected so that the resistor structure lower electrode of the MIM structure resistor is not coupled to any electric potential, and is in a floating condition.

Abstract: A semiconductor device includes a capacitor with an MIM structure, by which the dimensional accuracy of the device is improved, and a stable capacitance value is given. The semiconductor device 100 includes: a semiconductor substrate 102; a capacitor forming region 130 in which an MIM capacitor is formed, which has an insulating interlayer 104 formed on the semiconductor substrate 102, a first electrode 110, and a second electrode 112, and the first electrode 110 and the second electrode 112 are arranged facing each other through the insulating interlayer 104; and a shielding region 132 which includes a plurality of shielding electrodes 114 formed in the outer edge of the capacitor forming region 130 and, at the same time, set at a predetermined potential in the same layer as that of the MIM capacitor on the semiconductor substrate 102, and shields the capacitor forming region 130 from other regions.

Abstract: A semiconductor device has a semiconductor substrate, a multi-layered wiring construction formed over the semiconductor device, and a metal-insulator-metal (MIM) capacitor arrangement established in the multi-layered wiring construction. The MIM capacitor arrangement includes first, second, third, fourth, fifth, and sixth electrode structures, which are arranged in order in parallel with each other at regular intervals. The first, second, fifth and sixth electrode structures are electrically connected to each other so as to define a first capacitor, and the third and fourth electrode structures are electrically connected to each other so as to define a second capacitor.

Abstract: A lower interconnection is provided on a semiconductor substrate. A MIM capacitive element is provided on a first interlayer insulation film in which the lower interconnection is buried, and includes a lower electrode, an upper electrode, and a dielectric film sandwiched therebetween. An upper interconnection is provided on a second interlayer insulation film in which the MIM capacitive element is buried. A contact electrically connects the lower electrode and the upper interconnection. The lower electrode is mainly formed of Al, so that they are lower in electrical resistance than barrier metal, and also low in stress value. Therefore, it becomes possible to widen the area of the lower electrode for electrically connecting the contact while restraining their influences on charge accumulation and close contact between the lower electrode and the insulation film. In addition, since the electrical resistance is lowered, the thickness of the lower electrode can be increased.

Abstract: An electric motor control unit mounted in an automotive vehicle having a motor that is variable in its rotational speed. A temperature sensing element is arranged to contact a busbar so that relays permit switching operation in response to detection of abnormal heat generation. This controls an electrical power supply to the motor to decrease the rotational speed of the motor without complete stopping of the motor. The rotational speed of the motor returns to a normal speed from the decreased speed by switching operation of the relays with diminishing of the abnormal heat generation.

Abstract: On a silicon substrate, a first insulation layer, a lower conductive layer, a capacitor-insulator layer, and an upper conductive layer are formed in that order. Then, a first resist pattern is formed, the upper conductive layer is etched to form an upper electrode, and the capacitor-insulator layer is successively etched partway under the same etching condition as that of the upper conductive layer. Next, second resist pattern is formed, the remaining part of the capacitor-insulator layer is etched to form a second insulation layer, and the lower conductive layer is successively etched under the same etching condition as that of the capacitor-insulator layer so as to form a lower electrode and a lower wiring. In this manner, an MiM capacitor element constituted by the upper electrode, a part of the second insulation layer, and the lower electrode can be fabricated.