Patents by Inventor Man Li

Man Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040221051
    Abstract: A policy server operates to configure differentiated services over multi-protocol label switching (Diffserv/MPLS) in a communications network. The policy server enables the definition and deployment of a customer policy, a network policy and a mapping policy. The policy server is arranged to create a group of MPLS tunnels, and associate the tunnels to the mapping policy and the customer policy. The customer policy includes a tunnel group identifier and a tunneling mode, and maps customer traffic to MPLS tunnels. The policy server translates the customer policy, the network policy and the mapping policy into device-specific commands, and then deploys the device-specific commands to the network interfaces of the affected network devices.
    Type: Application
    Filed: November 21, 2003
    Publication date: November 4, 2004
    Applicant: Nokia Corporation
    Inventors: Yin L. Liong, Roberto Barnes, Man Li
  • Publication number: 20040218535
    Abstract: A policy server is arranged to construct device-neutral policies for configuring CBR for MPLS traffic engineering across a network. The policy server translates the device-neutral policies into device-specific commands (e.g. link attribute definitions and affinity profiles). The policy server defines the link attributes, assigns the link attributes to network interfaces, establishes affinity profiles and attaches the affinity profiles to MPLS tunnels. The link attribute definitions and affinity profiles are shared across the network to construct the policies such that IP operators can configure CBR easily across a network.
    Type: Application
    Filed: August 5, 2003
    Publication date: November 4, 2004
    Applicant: Nokia Corporation
    Inventors: Yin-Ling Liong, Roberto Barnes, Man Li
  • Publication number: 20040195134
    Abstract: A bag personalization kit is disclosed that includes a bag and a plurality of adhesive stickers for adhering to the bag. The stickers are mounted to at least one backing sheet which may be coupled to the bag.
    Type: Application
    Filed: February 2, 2004
    Publication date: October 7, 2004
    Inventor: Man Li
  • Publication number: 20040064555
    Abstract: There is disclosed a method and apparatus for controlling service level requirements between a communication network and a user equipment associated with an end-user connected in the communication network, in which the user equipment communicates with an external service via the communication network, the method comprising determining the end-user service level in dependence on a service level specification determined by the communication network and the external service.
    Type: Application
    Filed: September 27, 2002
    Publication date: April 1, 2004
    Inventors: Renaud Cuny, Kati Ahvonen, Zhi-Chun Honkasalo, Man Li
  • Patent number: 6661780
    Abstract: Mechanisms for QoS mapping rules on a mobile network between a UMTS layer and an IP layer are provided. A policy server is coupled to the SGSNs and GGSNs on the mobile network and maintains a centralized location for layer QoS mapping on the mobile network. Three mapping mechanisms have been provided, including an out-sourcing mechanism, a provisioning mechanism, and a hybrid mechanism. The out-sourcing mechanism uses the policy server to handle PDP context events and supply the appropriate rules to the appropriate support node. Under the provisioning mechanism, the policy server pushes down the corresponding mapping rules to each support node across the network in advance of any PDP context event. The hybrid mechanism utilizes a combination of the out-sourcing mechanism and the provisioning mechanism. The mechanisms ensure consistent UMTS layer QoS to IP layer QoS mapping across a mobile network.
    Type: Grant
    Filed: December 7, 2001
    Date of Patent: December 9, 2003
    Assignee: Nokia Corporation
    Inventor: Man Li
  • Publication number: 20030126290
    Abstract: In mobile IP networks, when a mobile node (MN) moves from one cell to another, handover occurs. The result of the handover is that the MN connects to the network through a new access router (AR). The handover may occur between access routers of the same or different administrative domains. In all cases, the information related to the mobile node has to be transferred from the old AR to the new AR in order to minimize the effect of the change of access routers. This is the so-called context transfer.
    Type: Application
    Filed: December 2, 2002
    Publication date: July 3, 2003
    Inventors: Ram Gopal Lakshmi Narayanan, Man Li
  • Publication number: 20030108015
    Abstract: Mechanisms for QoS mapping rules on a mobile network between a UMTS layer and an IP layer are provided. A policy server is coupled to the SGSNs and GGSNs on the mobile network and maintains a centralized location for layer QoS mapping on the mobile network. Three mapping mechanisms have been provided, including an out-sourcing mechanism, a provisioning mechanism, and a hybrid mechanism. The out-sourcing mechanism uses the policy server to handle PDP context events and supply the appropriate rules to the appropriate support node. Under the provisioning mechanism, the policy server pushes down the corresponding mapping rules to each support node across the network in advance of any PDP context event. The hybrid mechanism utilizes a combination of the out-sourcing mechanism and the provisioning mechanism. The mechanisms ensure consistent UMTS layer QoS to IP layer QoS mapping across a mobile network.
    Type: Application
    Filed: December 7, 2001
    Publication date: June 12, 2003
    Applicant: Nokia Corporation
    Inventor: Man Li
  • Publication number: 20030103496
    Abstract: In mobile IP networks, when a mobile node (MN) moves from one cell to another, handover occurs. The result of the handover is that the MN connects to the network through a new access router (AR). The handover may occur between access routers of the same or different administrative domains. In all cases, the information related to the mobile node has to be transferred from the old AR to the new AR in order to minimize the effect of the change of access routers.
    Type: Application
    Filed: December 2, 2002
    Publication date: June 5, 2003
    Inventors: Ram Gopal Lakshmi Narayanan, Man Li
  • Patent number: 6573123
    Abstract: A semiconductor chip package generally comprises a lead frame, a semiconductor die and a plastic package body. The lead frame includes a plurality of leads and a window pad. The window pad is connected to the lead frame by connecting bars. The inner ends of the plurality of leads defines a central area. The window pad is disposed in the central area and has an opening defined therein. The semiconductor die is disposed in the opening of the window pad and has a plurality of bonding pads formed on the active surface thereof. The inner ends of the leads are interconnected to the bonding pads on the semiconductor die through a plurality of bonding wires. The lead frame, the semiconductor die and the bonding wires are encapsulated in the plastic package body wherein the lower surface of the lead frame and the backside surface of the semiconductor die are exposed through the plastic package body.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: June 3, 2003
    Inventors: Sai Man Li, Chun Hung Lin, Shin Hua Chao, Su Tao
  • Patent number: 6552513
    Abstract: A portable charging device includes a housing having a space for receiving the mobile phone and having one or more prongs for plugging to the mobile phone, a circuit board secured in the housing, a speaker coupled to the circuit board for generating sound waves, and a battery engaged in the housing and coupled to the circuit board for energizing the speaker. The mobile phone may be easily carried by the users with the housing, and may be easily secured to the vehicle and may be electrically coupled to the battery of the vehicle via the circuit board.
    Type: Grant
    Filed: January 15, 2002
    Date of Patent: April 22, 2003
    Assignee: Canhold International Ltd.
    Inventor: Kai Man Li
  • Patent number: 6483499
    Abstract: A sculpturing input device for computerized 3D sculpturing includes a base for connection to a computer loaded with a virtual engraving program, and a magnetic stylus for use with the base for controlling a virtual engraving tool to cut a virtual object of the program. An optical position measuring system is provided in the base for measuring the position and direction of the stylus relative to the base, and determining the position and direction of the tool relative to the object. A magnetic force feedback system is provided in the base for exerting a magnetic resistive force upon the stylus when the tool cuts into the object, thereby simulating a counteracting resistive force of the object being cut.
    Type: Grant
    Filed: April 21, 2000
    Date of Patent: November 19, 2002
    Assignee: Hong Kong Productivity Council
    Inventors: Li Man Li, Derek Louie, Chi Hong Chan
  • Patent number: 6430160
    Abstract: A method (1000) of estimating the delays that data packets experiences along a path in an IP network is presented. The method involves sending probe packets (102), transmitted along the same path as the data whose delays are to be estimated, with a frequency dictated by statistics that include Poisson statistics. Information obtained about the delays in the probe packet transmissions may be used to estimate data delays.
    Type: Grant
    Filed: February 29, 2000
    Date of Patent: August 6, 2002
    Assignee: Verizon Laboratories Inc.
    Inventors: Donald E. Smith, Man Li
  • Publication number: 20020056903
    Abstract: A semiconductor chip package generally comprises a lead frame, a semiconductor die and a plastic package body. The lead frame includes a plurality of leads and a window pad. The window pad is connected to the lead frame by connecting bars. The inner ends of the plurality of leads defines a central area. The window pad is disposed in the central area and has an opening defined therein. The semiconductor die is disposed in the opening of the window pad and has a plurality of bonding pads formed on the active surface thereof. The inner ends of the leads are interconnected to the bonding pads on the semiconductor die through a plurality of bonding wires. The lead frame, the semiconductor die and the bonding wires are encapsulated in the plastic package body wherein the lower surface of the lead frame and the backside surface of the semiconductor die are exposed through the plastic package body.
    Type: Application
    Filed: December 31, 2001
    Publication date: May 16, 2002
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Sai Man Li, Chun Hung Li, Shin Hua Chao, Su Tao
  • Patent number: 6348729
    Abstract: A semiconductor chip package generally comprises a lead frame, a semiconductor die and a plastic package body. The lead frame includes a plurality of leads and a window pad. The window pad is connected to the lead frame by connecting bars. The inner ends of the plurality of leads defines a central area. The window pad is disposed in the central area and has an opening defined therein. The semiconductor die is disposed in the opening of the window pad and has a plurality of bonding pads formed on the active surface thereof. The inner ends of the leads are interconnected to the bonding pads on the semiconductor die through a plurality of bonding wires. The lead frame, the semiconductor die and the bonding wires are encapsulated in the plastic package body wherein the lower surface of the lead frame and the backside surface of the semiconductor die are exposed through the plastic package body.
    Type: Grant
    Filed: September 7, 1999
    Date of Patent: February 19, 2002
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Sai Man Li, Chun Hung Lin, Shin Hua Chao, Su Tao
  • Patent number: 6061331
    Abstract: A real-time process estimates the source-destination traffic matrix in a packet-switched communications network. The inputs for the process are a set of aggregate link traffic measurements and a set of source node traffic measurements. The process uses a novel and computationally efficient decomposition method to estimate the traffic matrix. The process also makes uses of Linear Programming (LP) methods to estimate the source-destination traffic matrix.
    Type: Grant
    Filed: July 28, 1998
    Date of Patent: May 9, 2000
    Assignee: GTE Laboratories Incorporated
    Inventors: Adrian E. Conway, Man Li
  • Patent number: 5978144
    Abstract: A prismatic optical device employs an improved prismatic image erecting system with curved refracting surfaces. The optical device can be any one of a wide variety of known devices such as telescopes and binoculars which include an objective, an image erecting system and an ocular. The erecting prism of the optical system is preferably an integral prism formed of optical quality plastic and may comprise a Porro erecting prism system or an image erecting system employing pentangular or roof prisms.
    Type: Grant
    Filed: November 4, 1997
    Date of Patent: November 2, 1999
    Assignee: Hong Kong Productivity Council
    Inventors: Li-Man Li, Chi-Shing Chan, Chi-Keung Chung