Abstract: An imaging device may include a plurality of single-photon avalanche diode (SPAD) pixels. The SPAD pixels may be overlapped by microlenses to direct light incident on the pixels onto photosensitive regions of the pixels and a containment grid with openings that surround each of the microlenses. During formation of the microlenses, the containment grid may prevent microlens material for adjacent SPAD pixels from merging. To ensure separation between the microlenses, the containment grid may be formed from material phobic to microlens material, or phobic material may be added over the containment grid material. Additionally, the containment grid may be formed from material that can absorb stray or off-angle light so that it does not reach the associated SPAD pixel, thereby reducing crosstalk during operation of the SPAD pixels.

Abstract: An imaging device may include single-photon avalanche diodes (SPADs). To improve the sensitivity and signal-to-noise ratio of the SPADs, light scattering structures may be formed in the semiconductor substrate to increase the path length of incident light through the semiconductor substrate. The light scattering structures may include a low-index material formed in trenches in the semiconductor substrate. One or more microlenses may focus light onto the semiconductor substrate. Areas of the semiconductor substrate that receive more light from the microlenses may have a higher density of light scattering structures to optimize light scattering while mitigating dark current.

Abstract: An imaging device may include a plurality of single-photon avalanche diode (SPAD) pixels. The SPAD pixels may be overlapped by microlenses to direct light incident on the pixels onto photosensitive regions of the pixels and a containment grid with openings that surround each of the microlenses. During formation of the microlenses, the containment grid may prevent microlens material for adjacent SPAD pixels from merging. To ensure separation between the microlenses, the containment grid may be formed from material phobic to microlens material, or phobic material may be added over the containment grid material. Additionally, the containment grid may be formed from material that can absorb stray or off-angle light so that it does not reach the associated SPAD pixel, thereby reducing crosstalk during operation of the SPAD pixels.

Abstract: An imaging device may include single-photon avalanche diodes (SPADs). To improve the sensitivity and signal-to-noise ratio of the SPADs, light scattering structures may be formed in the semiconductor substrate to increase the path length of incident light through the semiconductor substrate. To mitigate crosstalk, an isolation structure may be formed in a ring around the SPAD. The isolation structure may be a hybrid isolation structure with both a metal filler that absorbs light and a low-index filler that reflects light. The isolation structure may be formed as a single trench or may include a backside deep trench isolation portion and a front side deep trench isolation portion. The isolation structure may also include a color filtering material.

Abstract: Systems and methods for providing a head-up display using a holographic element formed on a visor of a wearable element (e.g., a helmet) are disclosed. Light projectors along with corresponding optics are positioned on both sides of a user's head within the wearable element. Light from a light projector is directed towards the holographic element to reflect towards the eye on the opposite side of the head from the light projector. With light reflecting from both light projectors, images are perceived by the user is being positioned on a virtual screen where the virtual screen is positioned outside the wearable element. Images on the virtual screen are displayed stereoscopically and with a large field of view for the user.

Abstract: An imaging device may include single-photon avalanche diodes (SPADs). To mitigate crosstalk, isolation structures may be formed around each SPAD. The isolation structures may include front side deep trench isolation structures that extend partially or fully through a semiconductor substrate for the SPADs. The isolation structures may include a metal filler such as tungsten that absorbs photons. The isolation structures may include a p-type doped semiconductor liner to mitigate dark current. The isolation structures may include a buffer layer such as silicon dioxide that is interposed between the metal filler and the p-type doped semiconductor liner. The isolation structures may have a tapered portion or may be formed in two steps such that the isolation structures have different portions with different properties. An additional filler such as polysilicon or borophosphosilicate glass may be included in some of the isolation structures in addition to the metal filler.

Abstract: A robust apparatus to improve the efficiency and emissions of a combustion process using a plurality of cell elements disposed within a housing that is placed in the air intake to a combustion chamber. The ozone cell includes an element assembly where the cell elements are bonded together with two or more mounting rings. The mounting rings incorporate rubber-like mechanical isolation such as an o-ring between the mounting rings and the cell elements. The cell elements may also include rubber-like isolation between the insulating tubes and the outer electrodes. The robust element assembly as described herein is better suited to survive the harsh environment of the ozone cell place in or near a combustion engine or process.

Abstract: An imaging device may include a plurality of single-photon avalanche diode (SPAD) pixels. The SPAD pixels may be overlapped by square toroidal microlenses to direct light incident on the pixels onto photosensitive regions of the pixels. The square toroidal microlenses may be formed as first and second sets of microlenses aligned with every other SPAD pixel and may allow the square toroidal microlenses to be formed without gaps between adjacent lenses. Additionally or alternatively, a central portion of each square toroidal microlenses may be filled by a fill-in microlens. Together, the square toroidal microlenses and the fill-in microlenses may form convex microlenses over each SPAD pixel. The fill-in microlenses may be formed from material having a higher index of refraction than material that forms the square toroidal microlenses.

Abstract: An image sensor package may include a semiconductor wafer having a pixel array, a color filter array (CFA) formed over the pixel array, and one or more lenses formed over the CFA. A light block layer may couple over the semiconductor wafer around a perimeter of the lenses and an encapsulation layer may be coupled around the perimeter of the lenses and over the light block layer. The light block layer may form an opening providing access to the lenses. A mold compound layer may be coupled over the encapsulation layer and the light block layer. A temporary protection layer may be used to protect the one or more lenses from contamination during application of the mold compound and/or during processes occurring outside of a cleanroom environment.

Abstract: An image sensor package may include a semiconductor wafer having a pixel array, a color filter array (CFA) formed over the pixel array, and one or more lenses formed over the CFA. A light block layer may couple over the semiconductor wafer around a perimeter of the lenses and an encapsulation layer may be coupled around the perimeter of the lenses and over the light block layer. The light block layer may form an opening providing access to the lenses. A mold compound layer may be coupled over the encapsulation layer and the light block layer. A temporary protection layer may be used to protect the one or more lenses from contamination during application of the mold compound and/or during processes occurring outside of a cleanroom environment.

Abstract: An imaging device may include a plurality of single-photon avalanche diode (SPAD) pixels. The SPAD pixels may be overlapped by square toroidal microlenses to direct light incident on the pixels onto photosensitive regions of the pixels. The square toroidal microlenses may be formed as first and second sets of microlenses aligned with every other SPAD pixel and may allow the square toroidal microlenses to be formed without gaps between adjacent lenses. Additionally or alternatively, a central portion of each square toroidal microlenses may be filled by a fill-in microlens. Together, the square toroidal microlenses and the fill-in microlenses may form convex microlenses over each SPAD pixel. The fill-in microlenses may be formed from material having a higher index of refraction than material that forms the square toroidal microlenses.

Abstract: A robust apparatus to improve the efficiency and emissions of a combustion process using a plurality of cell elements disposed within a housing that is placed in the air intake to a combustion chamber. Each of the plurality of cell elements include an inner electrode and an outer electrode. The inner electrodes are electrically and physically bonded to a bonding ring. The bonding ring with the bonded inner electrodes may then be encased in a potting material to provide a robust element assembly. The opposing end of the element assembly may also be bonded together in a potting material. The robust element assembly as described herein is better suited to survive the harsh environment of the ozone cell place in or near a combustion engine or process.

Abstract: An open-topped drinking cup and a lid comprising a lid cover and a mixing device for holding and mixing a condiment into a beverage held in the dinking cup. The lid cover defines a circular mounting aperture within which the mixing device is displaceably located. The mixing device includes at least two mixing elements which are connected to another so as to be telescopically displaceable relative to one another between a retracted condition and an extended condition wherein the mixing device extends into the beverage. The mixing device includes a condiment chamber which is defined within a mixing element for holding a condiment such as sugar. The mixing device further includes a mixing element which has a number of circumferentially-spaced slots through which the condiment is discharged into the beverage.

Abstract: An open-topped drinking cup 10 and a lid 12 comprising a lid cover 14 and a mixing device 16 for holding a mixing a condiment into a beverage 44 held in the dinking cup. The lid cover defines a circular mounting aperture 22 within which the mixing device is displaceably located. The mixing device 16 includes four tubular mixing elements 32.1, 32.2, 32.3, and 32.4 which are connected to another so as to be telescopically displaceable relative to one another between a retracted condition and an extended condition wherein the mixing device extends into the beverage 44. The mixing device 16 includes a condiment holder comprising a condiment chamber 36 which is defined within the mixing element 32.1, for holding a condiment 38 such as sugar. The mixing element 32.4 has a number of circumferentially-spaced slots 42 through which the condiment 38 is discharged into the beverage 44.

Abstract: A robust apparatus to improve the efficiency and emissions of a combustion process using a plurality of cell elements disposed within a housing that is placed in the air intake to a combustion chamber. Each of the plurality of cell elements include an inner electrode and an outer electrode. The inner electrodes are electrically and physically bonded to a bonding ring. The bonding ring with the bonded inner electrodes may then be encased in a potting material to provide a robust element assembly. The opposing end of the element assembly may also be bonded together in a potting material. The robust element assembly as described herein is better suited to survive the harsh environment of the ozone cell place in or near a combustion engine or process.

Abstract: A robust apparatus to improve the efficiency and emissions of a combustion process using a plurality of cell elements disposed within a housing that is placed in the air intake to a combustion chamber. The ozone cell includes an element assembly where the cell elements are bonded together with two or more mounting rings. The mounting rings incorporate rubber-like mechanical isolation such as an o-ring between the mounting rings and the cell elements. The cell elements may also include rubber-like isolation between the insulating tubes and the outer electrodes. The robust element assembly as described herein is better suited to survive the harsh environment of the ozone cell place in or near a combustion engine or process.

Abstract: Systems and methods for providing an active display of a user's environment on a wearable element (e.g., a helmet) are disclosed. Displaying an active display may include displaying a head-up-display on a display screen on the wearable element that is positioned to cover the field of view of the user when the user wears the wearable element. The head-up display may include a display generated from images (e.g., video) captured by one or more image capture elements (e.g., cameras) coupled to the wearable element. In certain instances, the head-up-display replaces the field of view of the user while the wearable element is worn by the user. The head-up-display may also display data received from one or more sensors coupled to the wearable element and data received from another data source in wireless communication with the wearable element.

Abstract: An imaging device may include single-photon avalanche diodes (SPADs). To improve the sensitivity and signal-to-noise ratio of the SPADs, light scattering structures may be formed in the semiconductor substrate to increase the path length of incident light through the semiconductor substrate. To mitigate crosstalk, an isolation structure may be formed in a ring around the SPAD. The isolation structure may be a hybrid isolation structure with both a metal filler that absorbs light and a low-index filler that reflects light. The isolation structure may be formed as a single trench or may include a backside deep trench isolation portion and a front side deep trench isolation portion. The isolation structure may also include a color filtering material.

Abstract: An imaging device may include single-photon avalanche diodes (SPADs). To improve the sensitivity and signal-to-noise ratio of the SPADs, light scattering structures may be formed in the semiconductor substrate to increase the path length of incident light through the semiconductor substrate. The light scattering structures may include a low-index material formed in trenches in the semiconductor substrate. One or more microlenses may focus light onto the semiconductor substrate. Areas of the semiconductor substrate that receive more light from the microlenses may have a higher density of light scattering structures to optimize light scattering while mitigating dark current.

Abstract: An imaging device may include single-photon avalanche diodes (SPADs). To improve the sensitivity and signal-to-noise ratio of the SPADs, light scattering structures may be formed in the semiconductor substrate to increase the path length of incident light through the semiconductor substrate. To mitigate crosstalk, multiple rings of isolation structures may be formed around the SPAD. An outer deep trench isolation structure may include a metal filler such as tungsten and may be configured to absorb light. The outer deep trench isolation structure therefore prevents crosstalk between adjacent SPADs. Additionally, one or more inner deep trench isolation structures may be included. The inner deep trench isolation structures may include a low-index filler to reflect light and keep incident light in the active area of the SPAD.