Abstract: An adjustable lumbar support for use in the backrest of a seat, the lumbar support having an elongate flexible band which extends longitudinally between the sides of the seat backrest and which has an effective length capable of variation so as to thereby vary the rearward curvature of the band when the lumbar support is in use. The band includes two parts which overlap in a region intermediate the length of the band and which are interconnected through a drive device including a rotatable cam. The cam interacts with the band parts in such a way that rotation of the cam causes a change in the degree of overlap between those parts and thereby changes the effective length of the band. The cam is contained in a housing and an actuator such as an electric motor can be mounted on that housing to form an integral part of the lumbar support assembly.

Abstract: A method and apparatus for testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O contacts. The apparatus is provided with an interposer that has contacts corresponding to the contacts on the semiconductor chip. Both the chip and the interposer contacts can be any known type including metal ball, bumps, or tabs or may be provided with dendritic surfaces. The chip contacts are first brought into relative loose temporary contact with the contacts on the interposer and then a compressive force greater that 5 grams per chip contact is applied to the chip to force the chip contacts into good electrical contact with the interposer contacts. Testing of the chip is then performed. The tests may include heating of the chip as well as the application of signals to the chip contacts. After testing the chip is removed from the substrate.

Abstract: A reconfigurable computer network interface device (10) includes a reconfigurable controller (12), reconfigurable bus interface (22), and reconfigurable transceiver (14). The device (10) also includes a configuration control arrangement (20) and on-board memory (16) for storing configuration instructions. The preferred form of the invention also includes an arrangement for receiving configuration instructions from an external source. The reconfigurable bus interface (22) may be configured by hardware set-up and operational software instructions to emulate a bus interface for any of a number of different computer bus architectures. A bus adapter (26) connects between a bus port (39) associated with the reconfigurable bus interface (22) and the computer bus to provide the physical connection between the device (10) and the host computer.

Abstract: A toy building block is constructed by folding an integral paperboard blank. The toy building block includes locking tabs and complementary-shaped openings, with the tabs of one toy building block received in the openings of another toy building block.

Abstract: A system and method for generating a universal palette and for mapping the color space for an original image into the universal palette for compression. The universal palette utilizes a one byte three color format type allowing reservation of shades for a presentation layer of an operating system for the digital computer. The three color components for a pixel in an original image are then mapped to a specific palette having the one byte format. Mapping depends in part, upon the original component values. Where a color component does not correspond closely to a color component in the universal palette, it will have a value falling between first and second color values in the universal palette. The component is mapped to either the first or second color value on a pseudo-probablistic basis.

Abstract: An analog output buffer circuit having a low quiescent power dissipation and a high current-driving capability is disclosed. In accordance with a preferred embodiment of the present invention, the analog output buffer circuit includes a capacitor and three transistors. The first transistor is coupled between a power supply and an output. The gate of the first transistor is utilized for receiving input signals. The second transistor is coupled between the output and ground. The capacitor is coupled between a gate of the first transistor and a gate of the second transistor such that voltages at the gate of the first transistor are related to voltages at the gate of the second transistor via the capacitor. Finally, the third transistor is coupled between the gate of the second transistor and a current source. This configuration allows the analog output buffer circuit to have a high current-driving capability while maintaining a low power dissipation during the quiescent period.

Abstract: A method and apparatus for testing semi-conductor chips is disclosed. The individual semiconductor chips have I/O contacts. The apparatus is provided with an interposer that has contacts corresponding to the contacts on the semiconductor chip. Both the chip and the interposer contacts can be any known type including metal ball, bumps, or tabs or may be provided with dendritic surfaces. The chip contacts are first brought into relative loose temporary contact with the contacts on the interposer and then a compressive force greater that 5 grams per chip contact is applied to the chip to force the chip contacts into good electrical contact with the interposer contacts. Testing of the chip is then performed. The tests may include heating of the chip as well as the application of signals to the chip contacts. After testing the chip is removed from the substrate.

Abstract: A solid electrolyte sensor to measuring the amount of trace elements, such as sulfur, in molten metals such as steel is provided wherein zirconia toughened strontium .beta.-alumina is used as the solid electrolyte. The resulting sensor is highly resistant to thermal shock, and is suitable for use with molten metals at temperatures of 1350.degree. C. or higher.

Abstract: A customizeable interconnect device is provided for coupling a base component to a stacked insert component. The interconnect device is customizeable to provide connection between various types of components, regardless of whether the components are leaded or leadless, or whether the lead pitch is large or small. The interconnect device is fully customized by modifying a retainer, a base and/or a housing. Each part (i.e., base, retainer and housing) is coupled together as a modular assembly, wherein the base is customizeable to fit the lead arrangement of the base component, and the retainer is customizeable to fit the lead arrangement of a daughter board edge connector. One or more daughter boards are inserted into corresponding housing units in stacked, spaced arrangement over a base component to enhance interconnect density in a three-dimensional fashion.

Abstract: The pulping of lignocellulosic material in the presence of oxygen gas and an alkaline liquid is improved by carrying out the process in two stages. In the first stage, the alkaline liquid is trickled over the material as the oxygen is passed up through the material. In the second stage, the material is submerged in oxygenated alkaline liquid which flows through the material.