Abstract: Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

Abstract: Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

Abstract: Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

Abstract: Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

Abstract: Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

Abstract: A lumber check grader-actuatable interface enables a check grader to interact with grade-quality measured boards of lumber conveyed along a flow path and passing in front of the check grader. The interface accurately and continuously tracks the location of each board in front of a check grader and tracks the location of the check grader's hands relative to the boards. Gestures can, therefore, be used for a selected board to perform additional actions, such as changing the grade or changing the trims. The interface enables a check grader to walk alongside and keep pace with a board of interest as it is transported and to provide feedback to the interface about a needed change for the board of interest. By knowing which board is of interest to a check grader, the interface can display additional information for only that board without overwhelming the check grader with non-stop information overload.

Abstract: A lumber check grader-actuatable interface enables a check grader to interact with grade-quality measured boards of lumber conveyed along a flow path and passing in front of the check grader. The interface accurately and continuously tracks the location of each board in front of a check grader and tracks the location of the check grader's hands relative to the boards. Gestures can, therefore, be used for a selected board to perform additional actions, such as changing the grade or changing the trims. The interface enables a check grader to walk alongside and keep pace with a board of interest as it is transported and to provide feedback to the interface about a needed change for the board of interest. By knowing which board is of interest to a check grader, the interface can display additional information for only that board without overwhelming the check grader with non-stop information overload.

Abstract: Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

Abstract: Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

Abstract: An optics block includes a substrate having first and second opposing surfaces, the substrate being a first material, a plurality of through holes extending in the substrate between the first and second opposing surface, a second material, different than the first material, filling a portion of the through holes and extending on a portion of the first surface of the substrate outside the through holes, and a first lens structure in the second material and corresponding to each of the through holes.

Abstract: The invention includes methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices. In one implementation, a method of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit includes providing a semiconductor substrate comprising at least one integrated circuit die. The semiconductor substrate comprises a circuit side, a backside, and a plurality of conductive vias extending from the circuit side to the backside. The plurality of conductive vias on the semiconductor substrate backside is examined to determine location of portions of at least two of the plurality of conductive vias on the semiconductor substrate backside. From the determined location, x-y spatial orientation of the semiconductor substrate is determined.

Abstract: Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

Abstract: An optics block includes a substrate having first and second opposing surfaces, the substrate being a first material, a plurality of through holes extending in the substrate between the first and second opposing surface, a second material, different than the first material, filling a portion of the through holes and extending on a portion of the first surface of the substrate outside the through holes, and a first lens structure in the second material and corresponding to each of the through holes.

Abstract: An optics block includes a substrate having first and second opposing surfaces, the substrate being a first material, a plurality of through holes extending in the substrate between the first and second opposing surface, a second material, different than the first material, filling a portion of the through holes and extending on a portion of the first surface of the substrate outside the through holes, and a first lens structure in the second material and corresponding to each of the through holes.

Abstract: Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice.

Abstract: A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

Abstract: An optics block includes a substrate having first and second opposing surfaces, the substrate being a first material, a plurality of through holes extending in the substrate between the first and second opposing surface, a second material, different than the first material, filling a portion of the through holes and extending on a portion of the first surface of the substrate outside the through holes, and a first lens structure in the second material and corresponding to each of the through holes.

Abstract: The invention includes methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices. In one implementation, a method of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit includes providing a semiconductor substrate comprising at least one integrated circuit die. The semiconductor substrate comprises a circuit side, a backside, and a plurality of conductive vias extending from the circuit side to the backside. The plurality of conductive vias on the semiconductor substrate backside is examined to determine location of portions of at least two of the plurality of conductive vias on the semiconductor substrate backside. From the determined location, x-y spatial orientation of the semiconductor substrate is determined.

Abstract: A through-wafer interconnect for imager, memory and other integrated circuit applications is disclosed, thereby eliminating the need for wire bonding, making devices incorporating such interconnects stackable and enabling wafer level packaging for imager devices. Further, a smaller and more reliable die package is achieved and circuit parasitics (e.g., L and R) are reduced due to the reduced signal path lengths.

Abstract: The invention includes methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices. In one implementation, a method of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit includes providing a semiconductor substrate comprising at least one integrated circuit die. The semiconductor substrate comprises a circuit side, a backside, and a plurality of conductive vias extending from the circuit side to the backside. The plurality of conductive vias on the semiconductor substrate backside is examined to determine location of portions of at least two of the plurality of conductive vias on the semiconductor substrate backside. From the determined location, x-y spatial orientation of the semiconductor substrate is determined.