Patents by Inventor Markus Brunnbauer

Markus Brunnbauer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optoelectronic semiconductor assembly with an optically transparent cover, and a method for producing optoelectronic semiconductor assembly with an optically transparent cover
    Publication number: 20060273437
    Abstract: An optoelectronic semiconductor assembly includes at least the following components: a semiconductor chip with an optical sensor region on its active topside, a wiring substrate on which the semiconductor chip is arranged, electrical connecting elements extending between the semiconductor chip and the wiring substrate, and an optically transparent cover an optically transparent plastic encapsulation compound that embeds at least the semiconductor chip and electrical connecting elements. The optically transparent encapsulation compound can be formed via a compression molding process.
    Type: Application
    Filed: May 22, 2006
    Publication date: December 7, 2006
    Inventors: Gottfried Beer, Markus Brunnbauer, Edward Fuergut