Abstract: The silicon bipolar transistor (100) comprises a base, with a first highly-doped base layer (105) and a second poorly-doped base layer (106) which together form the base. The emitter is completely highly-doped and mounted directly on the second base layer (106).

Abstract: A method for the manufacture of micro-mechanical components from a stack of layers having at least a substrate, a sacrificial layer and a layer which is to be undercut includes forming at least one etch hole in the layer, which is to be undercut, and providing at least one passivation layer for controlling a selective depositing of a cover material which closes each of the etch holes after a step of etching the sacrificial layer. The passivation layer makes it possible that the undercut layer elements do not become excessively thick or grow together with the substrate due to the deposition of the cover material.

Abstract: A contact spring configuration for contacting semiconductor wafers is provided. At least one strip-type contact spring is provided on a substrate. The contact spring is fixed to a surface of the substrate on one side and is composed of a semiconductor material having a stress gradient which causes a permanent bending of the contact spring. The stress gradient in the semiconductor material is brought about by two semiconductor layers which are connected to one another and are mechanically strained differently. The different strains can be set by different doping or by deposition temperatures of different magnitude during the deposition of the semiconductor layers. The contact springs provide a good ohmic contact in particular with contact regions of a semiconductor wafer that are composed of a semiconductor material.

Abstract: A DRAM capacitor is described that contains a BaSrTiO3 (BST) dielectric. The dielectric has a three-layer structure enabling the formation of a potential trough in which electrons can be permanently trapped.

Abstract: A storage capacitor for a DRAM has a dielectric composed of silicon nitride and has at least two electrodes disposed opposite one another across the dielectric. A material having a high tunneling barrier between the Fermi level of the material and the conduction band of the dielectric is used for the electrodes. Suitable materials for the electrodes are metals such as platinum, tungsten and iridium or silicides.

Abstract: A bipolar transistor includes a first layer with a collector. A second layer has a base cutout for a base. A third layer includes a lead for the base. The third layer is formed with an emitter cutout for an emitter. An undercut is formed in the second layer adjoining the base cutout. The base is at least partially located in the undercut. In order to obtain a low transition resistance between the lead and the base, an intermediate layer is provided between the first and the second layer. The intermediate layer is selectively etchable with respect to the second layer. At least in the region of the undercut between the lead and the base, a base connection zone is provided that can be adjusted independent of other production conditions. The intermediate layer is removed in a contact region with the base.

Abstract: The bipolar transistor is produced such that a connection region of its base is provided with a silicide layer, so that a base resistance of the bipolar transistor is small. No silicide layer is produced between an emitter and an emitter contact and between a connection region of a collector and a collector contact. The base is produced by in situ-doped epitaxy in a region in which a first insulating layer is removed by isotropic etching such that the connection region of the base which is arranged on the first insulating layer is undercut. In order to avoid defects of a substrate in which the bipolar transistor is partly produced, isotropic etching is used for the patterning of auxiliary layers, whereby etching is selective with respect to auxiliary layers lying above, which are patterned by anisotropic etching.

Abstract: A storage capacitor for a DRAM has a dielectric composed of silicon nitride and has at least two electrodes disposed opposite one another across the dielectric. A material having a high tunneling barrier between the Fermi level of the material and the conduction band of the dielectric is used for the electrodes. Suitable materials for the electrodes are metals such as platinum, tungsten and iridium or silicides.

Abstract: A vertical semiconductor transistor component is built up on a substrate by using a statistical mask. The vertical semiconductor transistor component has vertical pillar structures statistically distributed over the substrate. The vertical pillar structures are electrically connected on a base side thereof to a first common electrical contact. The vertical pillar structures include, along the vertical direction, layer zones of differing conductivity, and have insulation layers on their circumferential walls. An electrically conductive material is deposited between the pillar structures and forms a second electrical contact of the semiconductor transistor component. The pillar structures are electrically contacted to a third common electrical contact on their capping side.

Abstract: A method for the manufacture of micro-mechanical components from a stack of layers having at least a substrate, a sacrificial layer and a layer which is to be undercut includes forming at least one etch hole in the layer, which is to be undercut, and providing at least one passivation layer for controlling a selective depositing of a cover material which closes each of the etch holes after a step of etching the sacrificial layer. The passivation layer makes it possible that the undercut layer elements do not become excessively thick or grow together with the substrate due to the deposition of the cover material.

Abstract: A method for electrically contacting a rear side of a semiconductor substrate when processing the semiconductor substrate includes the step of placing the semiconductor substrate with a substrate rear side on a substrate holder such that an electrically conductive contact layer formed of a semiconductor material is disposed between the semiconductor substrate and the substrate holder.

Abstract: A DRAM capacitor is described that contains a BaSrTiO3 (BST) dielectric. The dielectric has a three-layer structure enabling the formation of a potential trough in which electrons can be permanently trapped.

Abstract: An integrated circuit arrangement having two NMOS transistors with different cut off voltages and two PMOS transistors with different cut off voltages. Channel regions of the NMOS transistors exhibit the same dopant concentration. The analogous case applies to the PMOS transistors. The different cut off voltages are achieved by different chemical compositions of the gate electrodes of the transistors. Preferably, the chemical compositions of the gate electrodes of respectively one of the NMOS transistors and one of the PMOS transistors thereby coincide. Si1−xGex with 0≦x≦1 is suitable as a material for the gate electrodes. The transistors preferably form pairs with transistors complementary to one another that exhibit the same cut off voltages. Given a dopant concentration of the channel regions of the NMOS transistors that is approximately 1.5 times greater than a dopant concentration of the channel regions of the PMOS transistors, the value of x amounts, for example, to 0.

Abstract: An integrated circuit configuration includes a structure, a p-n junction, and a defect plane disposed such that each of a plurality of straight lines, that intersect or touch the structure and the p-n junction, intersect the defect plane. This prevents unwanted leakage currents through the p-n junction and increases a retention time in a DRAM cell configuration. A wafer configuration and a method of producing an integrated circuit configuration are also provided.

Abstract: A memory cell configuration in a semiconductor substrate is proposed, in which the semiconductor substrate is of the first conductivity type. Trenches which run parallel to one another are incorporated in the semiconductor substrate, and first address lines run along the side walls of the trenches. Second address lines are formed on the semiconductor substrate, transversely with respect to the trenches. Semiconductor substrate regions, in which a diode and a dielectric whose conductivity can be changed are arranged, are located between the first address lines and the second address lines. A suitable current pulse can be used to produce a breakdown in the dielectric, with information thus being stored in the dielectric.

Abstract: A manufacturing method for a capacitor in an integrated memory circuit includes initially depositing a first conducting layer and an auxiliary layer acting as an etch-stop onto a carrier. Then a layer sequence which contains alternating layers of the first material and a second material is produced on top of the first conducting layer and the auxiliary layer. The layer sequence may, in particular, have p+/p− silicon layers or silicon/germanium layers. A layer structure with a base of a capacitor to be produced is formed from the layer sequence. Sides of the layer structure are provided with a conducting supporting structure. An opening is formed inside the layer structure, all the way down to the auxiliary layer and then the auxiliary layer and the layers made of the second material are removed. A free surface of the layers made of the first material and the supporting structure are provided with a capacitor dielectric onto which a counter electrode is applied.

Abstract: A method for the fabrication of a doped silicon layer, includes carrying out deposition by using a process gas containing SiH4, Si2H6 and a doping gas. The doped silicon layer which is thus produced can be used both as a gate electrode of an MOS transistor and as a conductive connection. At a thickness between 50 and 200 nm it has a resistivity less than or equal to 0.5 m&OHgr;cm.

Abstract: An integrated electrical circuit has at least one memory cell, in which the memory cell is disposed in the region of a surface of a semiconductor substrate. The memory cell contains at least two inverters that are electrically connected to one another. The inverters each contain two complementary MOS transistors having a source, a drain and a channel, the channels of the complementary MOS transistors having different conductivity types. According to the invention, the integrated electrical circuit is constructed in such a way that the inverters are disposed perpendicularly to the surface of the semiconductor substrate. The source, the drain and the channel of the complementary MOS transistors are formed by layers which lie one on top of the other and are disposed in such a way that the complementary MOS transistors are situated one above the other. The invention furthermore relates to a method for fabricating the integrated electrical circuit.

Abstract: In order to produce a MOS transistor with HDD profile and LDD profile, the HDD profile is firstly formed, followed by the LDD profile, in the area for the LDD profile in order to produce steep dopant profiles. The LDD profile is preferably produced by etching and in situ doped selective epitaxy.

Abstract: For manufacturing a capacitor that is essentially suited for DRAM arrangements, column structures that form an electrode of the capacitor are etched upon employment of a statistical mask that is produced without lithographic steps by nucleus formation of Si/Ge and subsequent selective epitaxy. Structure sizes below 100 nm can be realized in the statistical mask. Surface enlargement factors up to 60 are thus achieved.