Patents by Inventor Masahiro Yoshikawa

Masahiro Yoshikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6632538
    Abstract: A battery packet (50) comprises a battery case (51) formed by processing a battery case forming laminated sheet (10), a battery 50a contained in the battery case (51), and tabs (59, 60) extending outside from the battery case (51). The battery case forming laminated sheet (10) is formed by laminating a first base film layer (1a), i.e., an outermost layer, a metal foil layer (2), and a heat-adhesive resin layer (3) in that order. The first base film layer (1a) is a biaxially oriented polyethylene terephthalate resin film or a biaxially oriented nylon resin film. The metal foil layer (2) is an aluminum or copper foil. The heat-adhesive resin layer (3) is formed of a polyolefin resin, more preferably, of an acid-denatured polyolefin resin.
    Type: Grant
    Filed: December 13, 1999
    Date of Patent: October 14, 2003
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Takuya Yamazaki, Kiyoshi Oguchi, Koji Shimizu, Kenichiro Suto, Tsutomu Yoshinaka, Hideki Kurokawa, Hitoshi Sekino, Masahiro Yoshikawa, Hiroshi Miyama, Katsuhiko Hayashi, Jun Fukuda
  • Patent number: 6529541
    Abstract: A surface emitting semiconductor laser that is easy to manufacture and has a high-intensity fundamental lateral mode optical output power. The surface emitting semiconductor laser has a semiconductor substrate on which are sequentially laminated a lower n-type DBR layer, an active layer region, an upper p-type DBR layer, a p-side electrode that is an upper layer of the upper n-type DBR layer and functions as an upper electrode provided with an aperture that forms an emission region for a laser beam, and a current confinement portion formed by oxidization. On the basis of the reflectance of a cavity in a region corresponding to the p-side electrode, a metal aperture diameter (Wmetal) of the aperture and a diameter (Woxide) of the current confinement portion are determined such that the difference between an optical loss of a cavity in a higher-order lateral mode of a laser beam and an optical loss of a cavity in a fundamental lateral mode of a laser beam becomes larger.
    Type: Grant
    Filed: November 20, 2000
    Date of Patent: March 4, 2003
    Assignee: Fuji Xerox Co., Ltd.
    Inventors: Nobuaki Ueki, Akira Sakamoto, Masahiro Yoshikawa, Hideo Nakayama, Hiromi Otoma
  • Publication number: 20030039294
    Abstract: The present invention provides a surface emitting semiconductor laser, comprising: a semiconductor substrate having sequentially layered thereon a lower multi-layer mirror, an active layer region, and an upper multi-layer mirror that, together with the lower multi-layer mirror, contributes to the formation of a cavity; an upper electrode disposed on an upper layer of the upper multi-layer mirror and provided with an aperture that forms an emission region of a laser beam generated at the active layer region; and a current confinement portion disposed between the upper electrode and the lower multi-layer mirror and provided with an aperture that forms a current path; wherein an aperture diameter of the upper electrode and an aperture diameter of the current confinement portion are determined such that a difference between an optical loss of the cavity in a higher-order lateral mode of the laser beam and an optical loss of the cavity in a fundamental lateral mode of the laser beam becomes a value in the vicinity
    Type: Application
    Filed: August 27, 2002
    Publication date: February 27, 2003
    Applicant: FUJI XEROX CO., LTD.
    Inventors: Nobuaki Ueki, Akira Sakamoto, Masahiro Yoshikawa, Hideo Nakayama, Hiromi Otoma
  • Publication number: 20010046822
    Abstract: A soft, meshed, electromagnetic shielding textile sheet is placed in a mold, and the mold is clamped. The soft, meshed electromagnetic shielding textile sheet is shaped so as to conform with the inner surface of the mold when the mold is clamped. Therefore, it is not necessary to fabricate beforehand any insert of a shape corresponding to that of the inner surface of the mold. Since the meshed, electromagnetic shielding textile sheet is impregnated with part of a resin injected into the mold to form an injection-molded resin body, the adhesion of the electromagnetic shielding textile sheet to the injection-molded resin body is improved.
    Type: Application
    Filed: July 10, 2001
    Publication date: November 29, 2001
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventors: Masahiro Yoshikawa, Katsumi Kameda
  • Patent number: 6319810
    Abstract: Method for forming solder bumps on a first member such as a semiconductor chip having electrode pads formed thereon. A flat plate having holes is prepared and the holes are filled with solder paste by squeezing. The flat plate is then overlapped with the first member with the flat plate above the first plate. The flat plate and the first member are heated to a temperature higher than the melting point of the solder alloy in the solder paste. Therefore, solder bumps having identical sizes and uniform structures can be obtained.
    Type: Grant
    Filed: June 6, 1996
    Date of Patent: November 20, 2001
    Assignee: Fujitsu Limited
    Inventors: Masayuki Ochiai, Yasuo Yamagishi, Ichiro Yamaguchi, Masahiro Yoshikawa, Koki Otake, Masataka Mizukoshi, Yuuji Watanabe
  • Patent number: 6291369
    Abstract: A soft, meshed, electromagnetic shielding textile sheet is placed in a mold, and the mold is clamped. The soft, meshed electromagnetic shielding textile sheet is shaped so as to conform with the inner surface of the mold when the mold is clamped. Therefore, it is not necessary to fabricate beforehand any insert of a shape corresponding to that of the inner surface of the mold. Since the meshed, electromagnetic shielding textile sheet is impregnated with part of a resin injected into the mold to form an injection-molded resin body, the adhesion of the electromagnetic shielding textile sheet to the injection-molded resin body is improved.
    Type: Grant
    Filed: April 5, 1999
    Date of Patent: September 18, 2001
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Masahiro Yoshikawa, Katsumi Kameda
  • Patent number: 6271110
    Abstract: First and second ball forming plates are prepared. The cavities of the first plate and the cavities of the second plate 20 are filled with solder paste, respectively. The first plate and the second plate are placed in a facing relationship to each other and heated to form metal balls each of which corresponds to the total metal components of the solder paste in one cavity of the first plate and one cavity in the second plate. The metal balls are formed in the cavities of the lower plate 10. The metal balls are transferred from the cavities of the first plate to a device on which bumps are to be formed.
    Type: Grant
    Filed: July 17, 1998
    Date of Patent: August 7, 2001
    Assignee: Fujitsu Limited
    Inventors: Ichiro Yamaguchi, Koki Otake, Masahiro Yoshikawa
  • Patent number: 6090301
    Abstract: A method for fabricating a bump forming plate member by which bumps can be formed on an electronic component. A mask is formed on a surface of a crystalline plate, and the crystalline plate is subjected to anisotropic etching to form a plurality of grooves. The crystalline plate is also subjected to isotropic etching to deepen the grooves. The method can further includes additional anisotropic and isotropic etchings. Also, a method for fabricating a metallic bump forming plate member is disclosed. This method uses the above described crystalline plate having the grooves, and includes fabrication of a replica using the crystalline plate as an original, and fabrication of a metallic bump forming plate member using the replica as an original.
    Type: Grant
    Filed: May 19, 1997
    Date of Patent: July 18, 2000
    Assignee: Fujitsu Limited
    Inventors: Masataka Mizukoshi, Ichiro Yamaguchi, Masahiro Yoshikawa, Koki Otake, Junichi Kasai
  • Patent number: 5273855
    Abstract: (Objective) In a color-proof material performed by forming multi-color image on an arbitrary material (ultimate image-receiving material) such as paper using a photosensitive transfer sheet and an intermediate image-receiving sheet, the objective is to bring the quality close to the printed quality formed with inks alone.(Constitution) For the photosensitive sheet, the colored photosensitive layer is formed with a material comprising a synthetic resin emulsion with Tg=-20.degree. to 40.degree. C. such as acrylic ester or ethylene-vinyl acetate copolymer so that the image layer itself has heat-adhesivity. Moreover, the image-receiving layer of the intermediate image-receiving sheet is formed with a material containing a resin cross-linked copolymer of olefin and .alpha., .beta.-unsaturated carboxylic acid with metallic ions and a resin comprising a copolymer of ethylene and vinyl acetate in a proportion by weight of 100/0 to 10/90.
    Type: Grant
    Filed: November 21, 1991
    Date of Patent: December 28, 1993
    Assignee: Sanyo-Kokusaku Pulp Co., Ltd.
    Inventors: Hisahiro Omote, Masahiro Yoshikawa, Masahide Takano
  • Patent number: 5081072
    Abstract: A manufacturing method of a superconducting material having the steps of: milling and mixing a powderly primary material in a casing of a dry type milling mixer; heat-processing the primary material obtained from the milling/mixing step; and again milling and mixing the primary material obtained from the heat-processing step in the casing of the milling mixer so as to obtain a secondary material. The milling mixer includes a casing for holding the primary material therein and friction-pulverizing mixing elements for frictionally pulverizing, stirring and mixing the primary material inside the casing. The two milling/mixing steps are effected under a high-speed rotation of the casing where a centrifugal force resulting from the casing rotation presses the primary material against an inner surface of the casing and a layer of the material formed on the surface is frictionally pulverized, stirred and mixed by the friction-pulverizing mixture elements.
    Type: Grant
    Filed: September 12, 1990
    Date of Patent: January 14, 1992
    Assignee: Hosokawa Micron Corporation
    Inventors: Masuo Hosokawa, Tohei Yokoyama, Makio Naito, Masahiro Yoshikawa
  • Patent number: 5001034
    Abstract: An image transfer method is disclosed, characterized in for the preparation of a color proof wherein separate-in-color images are formed in each colored photosensitive layer of photosensitive material coated on a thermosensitive adhesive layer on a release surface provided on a support from which the thermosensitive adhesive layer is releasable, and a multicolor image is formed on an image receiver by transferring said separate-in-color images onto said image receiver one by one together with said adhesive layer, repeating concurrent heating and pressurizing procedures, and thereafter further submitting the image receiver with the multicolor image formed thereon to heat treatment.
    Type: Grant
    Filed: June 8, 1989
    Date of Patent: March 19, 1991
    Assignee: Sanyo-Kokusaku Pulp Co., Ltd.
    Inventors: Hisahiro Omote, Masahiro Yoshikawa, Masahide Takano