Abstract: An organic electron transport material, which includes a phosphine oxide derivative represented by the following Formula (1): R1 represents an atomic group which has one or more of either or both of aryl and heteroaryl groups and may have one or more phosphine oxide groups, R2 to R11 each independently represent an atom or an atomic group selected from the group consisting of a hydrogen atom, a halogen atom, a cyano group, a nitro group, a carboxyl group, a formyl group, a carbonyl group, an alkoxycarbonyl group, and a trifluoromethyl group.

Abstract: A method of producing a semiconductor device includes steps of: growing semiconductor layers to form a semiconductor stack on a semiconductor substrate; forming a first adhesive layer on the semiconductor stack; bonding a temporary support made of non-semiconductor material to the first adhesive layer; removing the semiconductor substrate from the semiconductor stack to expose a surface of the semiconductor stack; forming a second adhesive layer on the exposed surface of the semiconductor stack; bonding a support to the second adhesive layer; and removing the temporary support from the semiconductor stack. The support has a thermal conductivity greater than the thermal conductivities of the semiconductor layer in the semiconductor stack. In forming the first adhesive layer, this layer can cover the entire surface, or both the top and a side of the semiconductor stack. Before forming the first adhesive layer, a protective layer can be formed on the semiconductor stack.

Abstract: A semiconductor optical element is disclosed. The semiconductor optical element includes: a mesa-shaped optical waveguide formed on a substrate; a modulation electrode formed on the optical waveguide; a first resin layer that buries side surfaces of the optical waveguide; a bonding pad formed on the first resin layer; and a connecting wiring line that connects the modulation electrode and the bonding pad. In the semiconductor optical element, side surfaces of the bonding pad are partially covered with a second resin layer provided on the first resin layer, and the connecting wiring line extends on the second resin layer.

Abstract: A Mach-Zehnder modulator includes: a support having a principal surface, the principal surface having a first area, a second area, and a third area; a first structure including first and second semiconductor mesas disposed on the first and second areas, respectively; a second structure including a first strip-shaped semiconductor region on the second area, a second strip-shaped semiconductor region on the third area, and a first strip-shaped void and a second strip-shaped void defining the first and second strip-shaped semiconductor regions; a first electrode disposed on the first semiconductor mesa in the first area, the first strip-shaped semiconductor region of the second structure being disposed between the support and the second semiconductor mesa of the first structure in the second area, and the first and second semiconductor mesas, and the first and second strip-shaped semiconductor regions being arranged to constitute a first arm waveguide of the Mach-Zehnder modulator.

Abstract: A Mach-Zehnder modulator includes: a support having a principal surface, the principal surface having a first area, a second area, and a third area; a first structure including first and second semiconductor mesas disposed on the first and second areas, respectively; a second structure including a first strip-shaped semiconductor region on the second area, a second strip-shaped semiconductor region on the third area, and a first strip-shaped void and a second strip-shaped void defining the first and second strip-shaped semiconductor regions; a first electrode disposed on the first semiconductor mesa in the first area, the first strip-shaped semiconductor region of the second structure being disposed between the support and the second semiconductor mesa of the first structure in the second area, and the first and second semiconductor mesas, and the first and second strip-shaped semiconductor regions being arranged to constitute a first arm waveguide of the Mach-Zehnder modulator.

Abstract: A semiconductor device includes: a semiconductor element disposed on a semiconductor substrate; a first insulating film disposed on the semiconductor substrate, the first insulating film having an upper surface and an edge; a resin layer disposed on the semiconductor substrate, the resin layer covering the semiconductor element; and a second insulating film disposed on the semiconductor substrate, the second insulating film covering the upper and side surfaces of the resin layer, wherein the second insulating film has an edge arranged apart from the side surface of the resin layer by a distance, and the distance between the edge of the second insulating film and the side surface of the resin layer is greater than a film thickness of the second insulating film.

Abstract: A semiconductor device provided with a substrate made of material except for semiconductors and having thermal conductivity greater than that of the semiconductor material. The semiconductor device provides, on the support, a metal layer, a primary mesa, and electrodes formed on the primary mesa. The metal layer, which is in contact with the primary mesa, may be made of at least one of tungsten (W), molybdenum (Mo), and tantalum (Ta) with a thickness of the 10 to 60 nm.

Abstract: A Mach-Zehnder modulator comprises first to third semiconductor structures provided on first to third areas of a primary surface of a conductive semiconductor region, respectively. The second semiconductor structure includes a semiconductor laminate and a first contact portion thereon. The third semiconductor structure includes the semiconductor laminate and a second contact portion thereon. The first and second contact portions constitute a contact layer. The second semiconductor structure has first and second waveguide sides. The first contact portion has an edge which terminates the contact layer and extends in a direction of a first reference plane on the top of the semiconductor laminate to reach the first waveguide side. The first reference plane and a top of the second semiconductor structure intersect with each other to define a line of intersection obliquely-crossed with an upper edge of the first waveguide side at a first angle different from a right angle.

Abstract: A traveling-wave amplifier includes a plurality of amplifier cells, an insulating layer, an input line, and an output line. The plurality of amplifier cells is provided on a semiconductor substrate. Each of the amplifier cells receives an input signal and generates a part of an output signal from the input signal. The insulating layer is provided on the semiconductor substrate. The input line is used to externally receive an input signal and to transmit the input signal to the amplifier cells respectively. The output line is used to transmit the output signal generated by the amplifier cells and to externally output the output signal. The thickness of the input line is smaller than the thickness of the output line, and the input line and the output line are provided on the same insulating layer.

Abstract: A semiconductor device and a process to form the same are disclosed. The semiconductor device includes a support, an active semiconductor stack including a first semiconductor layer, a second semiconductor layer, and a third semiconductor layer, the first to third semiconductor layers being sequentially stacked on the support, and an electrode on the third semiconductor layer. The first semiconductor layer and the second semiconductor layer provide a buried region in a portion under the electrode, the buried region being filled with a material having a first dielectric constant smaller than a second dielectric constant of the first semiconductor layer and a third dielectric constant of the second semiconductor layer.

Abstract: A semiconductor optical modulator includes a substrate having a principal surface; a waveguide disposed on the principal surface of the substrate, the waveguide extending in a first direction; a first electrode disposed on the waveguide, the first electrode being in contact with an upper surface of the waveguide; a first wiring connected to the first electrode, the first wiring extending in a second direction intersecting the first direction; a build-up portion connected to the first wiring; a second wiring connected to the build-up portion, the second wiring extending in a plane parallel to the principal surface of the substrate; and a resin layer disposed on the substrate, the resin layer embedding the first wiring and the build-up portion. The build-up portion extends along a third direction, the third direction intersecting perpendicularly to the principal surface of the substrate. The second wiring is disposed on the resin layer.

Abstract: A semiconductor device and a process to form the same are disclosed. The semiconductor device includes a support, an active semiconductor stack including a first semiconductor layer, a second semiconductor layer, and a third semiconductor layer, the first to third semiconductor layers being sequentially stacked on the support, and an electrode on the third semiconductor layer. The first semiconductor layer and the second semiconductor layer provide a buried region in a portion under the electrode, the buried region being filled with a material having a first dielectric constant smaller than a second dielectric constant of the first semiconductor layer and a third dielectric constant of the second semiconductor layer.

Abstract: A Mach-Zehnder modulator comprises first to third semiconductor structures provided on first to third areas of a primary surface of a conductive semiconductor region, respectively. The second semiconductor structure includes a semiconductor laminate and a first contact portion thereon. The third semiconductor structure includes the semiconductor laminate and a second contact portion thereon. The first and second contact portions constitute a contact layer. The second semiconductor structure has first and second waveguide sides. The first contact portion has an edge which terminates the contact layer and extends in a direction of a first reference plane on the top of the semiconductor laminate to reach the first waveguide side. The first reference plane and a top of the second semiconductor structure intersect with each other to define a line of intersection obliquely-crossed with an upper edge of the first waveguide side at a first angle different from a right angle.

Abstract: A semiconductor device provided with a substrate made of material except for semiconductors and having thermal conductivity greater than that of the semiconductor material. The semiconductor device provides, on the support, a metal layer, a primary mesa, and electrodes formed on the primary mesa. The metal layer, which is in contact with the primary mesa, may be made of at least one of tungsten (W), molybdenum (Mo), and tantalum (Ta) with a thickness of the 10 to 60 nm.

Abstract: A traveling-wave amplifier includes a plurality of amplifier cells, an insulating layer, an input line, and an output line. The plurality of amplifier cells is provided on a semiconductor substrate. Each of the amplifier cells receives an input signal and generates a part of an output signal from the input signal. The insulating layer is provided on the semiconductor substrate. The input line is used to externally receive an input signal and to transmit the input signal to the amplifier cells respectively. The output line is used to transmit the output signal generated by the amplifier cells and to externally output the output signal. The thickness of the input line is smaller than the thickness of the output line, and the input line and the output line are provided on the same insulating layer.

Abstract: A semiconductor optical modulator includes a substrate having a principal surface; a waveguide disposed on the principal surface of the substrate, the waveguide extending in a first direction; a first electrode disposed on the waveguide, the first electrode being in contact with an upper surface of the waveguide; a first wiring connected to the first electrode, the first wiring extending in a second direction intersecting the first direction; a build-up portion connected to the first wiring; a second wiring connected to the build-up portion, the second wiring extending in a plane parallel to the principal surface of the substrate; and a resin layer disposed on the substrate, the resin layer embedding the first wiring and the build-up portion. The build-up portion extends along a third direction, the third direction intersecting perpendicularly to the principal surface of the substrate. The second wiring is disposed on the resin layer.

Abstract: The present invention is to provide a method of favorably forming an organic EL device with the inverted structure by the wet process. On that account, an organic EL device includes a cathode, an electron injection layer, a light emitting layer, a hole transport layer, a hole injection layer, an anode are formed in this order on a substrate. The electron injection layer is formed by applying ink between banks and drying the ink. The ink is formed by dissolving a polymer compound having an organic phosphine oxide skeleton in an alcohol solvent. The light emitting layer is formed by applying ink between components of the bank and the drying the ink. The ink is formed by dissolving material for light emitting layer such as polyphenylene vinylene (PPV) derivative or polyfluorene derivative in a nonpolar solvent.

Abstract: The present invention provides a method for manufacturing a nitride semiconductor self-supporting substrate and a nitride semiconductor self-supporting substrate manufactured by this manufacturing method, the method including at least: a step of preparing a nitride semiconductor self-supporting substrate serving as a seed substrate; a step of epitaxially growing the same type of nitride semiconductor as the seed substrate on the seed substrate; and a step of slicing an epitaxially grown substrate subjected to the epitaxial growth into two pieces in parallel to an epitaxial growth surface. As a result, there is provided a method for manufacturing a large-diameter nitride semiconductor self-supporting substrate having an excellent crystal quality and small warp with good productivity at a low cost, etc.

Abstract: This invention is intended to discover a fraction having strong anti-influenza virus activity via M? activation in the Grifola frondosa extract or an active substance distributed therein to develop a simple and effective production method and to use such fraction for food and beverage products, pharmaceutical products, feeds or feed additives, and the like. This is realized by treatment of maitake mushrooms with a molecular sieve apparatus, such as an ultrafiltration apparatus or gel filtration apparatus, to isolate glycoprotein-containing fractions or sugar-protein complex-containing fractions having molecular weights of 30,000 to 100,000, so as to minimize the influence on substances having strong anti-influenza virus activity and contaminants.

Abstract: A method for manufacturing a compound semiconductor substrate includes at least the processes of epitaxially growing a quaternary light emitting layer composed of AlGaInP on a GaAs substrate; vapor-phase growing a p-type GaP window layer on a first main surface of the quaternary light emitting layer, the first main surface being opposite to the GaAs substrate; removing the GaAs substrate; and epitaxially growing an n-type GaP window layer on a second main surface of the light emitting layer, the second main surface being located at a side where the GaAs substrate is removed. The method includes the process of performing a heat treatment under a hydrogen atmosphere containing ammonia after the process of removing the GaAs substrate and before the process of epitaxially growing the n-type GaP window layer.