Abstract: A semiconductor device includes a non-single-crystal semiconductor film, a support substrate that supports the non-single-crystal semiconductor film, and an active device having a part of the non-single-crystal semiconductor film as a channel region. In particular, the channel region has an oxygen concentration not higher than 1×1018 atoms/cm3 and a carbon concentration not higher than 1×1018 atoms/cm3.

Abstract: A method of manufacturing a thin-film semiconductor device substrate includes a step of forming a non-single crystalline semiconductor thin film on a base layer, and an annealing step of irradiating the non-single crystalline semiconductor thin film with an energy beam to enhance crystallinity of a non-single crystalline semiconductor constituting the non-single crystalline semiconductor thin film. The annealing step includes simultaneously irradiating the non-single crystalline semiconductor thin film with a plurality of energy beams to form a plurality of unit regions each including at least one irradiated region irradiated with the energy beam and at least one non-irradiated region that is not irradiated with the energy beam.

Abstract: The semiconductor device according to the present invention has a semiconductor layer having not smaller than two types of crystal grains different in size within a semiconductor circuit on a same substrate.

Abstract: A rotation balance control mechanism controlling a rotation balance of a rotary head drum apparatus comprising a fixed drum and a rotary drum and a drum motor unit urging the rotary drum, the rotation balance control mechanism comprising a rotor plate mounted on a shaft mount of the drum motor, the rotor plate capable of mounting a balance weight for controlling the rotation balance of the rotary head drum apparatus.

Abstract: There are disclosed a method and apparatus for forming a semiconductor film having an excellent crystallinity on a base layer made of an insulating material.

Abstract: A method for producing a thin film semiconductor device is described. In the method, a thin film layer of non-single-crystalline semiconductor, which is deposited on a base layer of glass, is processed to an island-shaped thin film layer at the time prior to the layer irradiation step. The laser irradiation to the thin film layer of non-single-crystalline semiconductor is carried out after forming an insulation film layer and a gate electrode over the island-shaped thin film layer, by using the gate electrode as the irradiation mask, whereby the center area of the island-shaped thin film layer masked by the gate electrode is crystallized, and simultaneously, the both side areas thereof which is not masked by the gate electrode are annealed. Next, a source electrode and a drain electrode is formed in the annealed areas. The implantation of impurity ion may be carried out either before or after the laser irradiation.

Abstract: The present invention provides a method for manufacturing a crystalline semiconductor thin film and is characterized in that it includes forming an amorphous semiconductor thin film on an insulated substrate, providing a single crystal semiconductor substrate primarily composed of the same material as that of the amorphous semiconductor thin film, including a catalytic metal on the surface thereof, putting the surface of the single crystal semiconductor substrate into contact with the amorphous semiconductor thin film, and performing a thermal process on the single crystal semiconductor substrate and amorphous semiconductor thin film in contact with each other at a temperature lower than the natural crystallizing temperature of the amorphous semiconductor thin film to crystallize the amorphous semiconductor thin film.

Abstract: An inverted stagger thin film transistor includes an insulating substrate, a silicon active layer formed thereon, source and drain ohmic contact layers, source and drain electrodes respectively contacting the source and drain ohmic contact layers, and a gate electrode opposite to the channel region of the active layer through a gate insulating film. An auxiliary film consisting of a silicon film doped with nitrogen is formed in the surface of the active layer, and the ohmic contact layers contact the auxiliary film. The auxiliary film can be continuously formed from the active layer to the ohmic contact layers, thereby improving a junction state between the active layer and the ohmic contact layers.