Abstract: In a dynamic flip-flop circuit with a data selection function, for example, when data having an H value has been selected using a selection signal S0, a first node N1 is L and a second node N2 of a second dynamic circuit 1B is H, so that an output signal Q has an H level. In this case, when none of a plurality of pieces of data D0 to D2 is selected using selection signals S0 to S2, the first node N1 is H, so that the electric charge of the second node N2 is discharged and the output signal Q erroneously has an L level. However, in this case, an output node N3 is H and a fourth node N4 is L, so that an n-type transistor Tr6 of the second dynamic circuit 1B is turned OFF, thereby preventing the second node N2 from being discharged. Therefore, a normal operation is performed while securing a satisfactorily high-speed operation even when none of the pieces of data is selected.

Abstract: Logic circuit information in which flip-flops of a semiconductor integrated circuit subjected to designing and a logic circuit between flip-flops are defined is input. The logic circuit information is analyzed to detect a logic circuit sandwiched by two flip-flops. The number of logic stages of the detected logic circuit is counted. It is determined, according to the counted number of logic stages, to which substrate potential a cell used for the logic circuit is to be connected.

Abstract: Source voltage and substrate voltage are supplied to a semiconductor integrated circuit 1E from the regulator circuits 11C and 21C of a power supply circuit 1C via a power detection compensating circuit 1D. The power efficiency value of a regulator is stored in the resistor file 13D, various detection information and power values are input to an operator 14D, the power values and the power efficiency values of the regulator circuits 11C and 21C are accumulated, and the power sum of a semiconductor integrated circuit 1E and a power supply circuit 1C are output. Minimum power implementation information corresponding to the various detection information of the semiconductor integrated circuit 1E is stored in an LUT 15D. Variable resistances R1a and R2a are controlled for determining the reference voltage values of the regulator circuits 11C and 21C so that the power sum is the minimum power value by comparing the minimum power implementation information with the output 14D.

Abstract: A semiconductor device according to the present invention comprises a first semiconductor integrated circuit 11 having a predetermined function, the first semiconductor integrated circuit outputting a required output signal, a second semiconductor integrated circuit 12 in which a plurality of MOS elements (PMOS transistor or NMOS transistor) for independently switching to and from a conducted state and a non-conducted state in accordance with a plurality of gate signals each having a different timing is provided and the plurality of MOS elements is connected in parallel to an output or an input of the first semiconductor integrated circuit, and a pulse generating circuit 13 for generating and outputting the plurality of gate signals ?i (i=1, 2, 3) each having a different timing with respect to the plurality of MOS elements in the second semiconductor integrated circuit.

Abstract: A semiconductor integrated circuit design method includes a step (L) of providing layout information for laying out elements making up a logical circuit on a semiconductor substrate; a step (P) of providing logical circuit information; a step (a) of classifying logical circuits in response to the logical circuit propagation route of a signal based on the logical circuit information and a step (b) of isolating the logical circuits forming the route obtained in the classifying step (a) for each number of stages; a step (c) of classifying the elements making up the logical circuit according to substrate voltage for each number of stages of the logical circuit; and a layout correction step (d) of correcting the layout information so that each element with the larger stage number of the logical circuit is placed at a point closer to a substrate contact.

Abstract: It is an object of the present invention to provide a semiconductor integrated circuit having a chip layout that reduces line length to achieve faster processing. A cache comprises a TAG memory module and a cache data memory module. The cache data memory module is divided into first and second cache data memory modules which are disposed on both sides of the TAG memory module, and input/output circuits of a data TLB are opposed to the input/output circuit of the TAG memory module and the input/output circuits of the first and second cache data memory modules across a bus area to reduce the line length to achieve faster processing.

Abstract: A semiconductor device according to the present invention comprises a first semiconductor integrated circuit 11 having a predetermined function, the first semiconductor integrated circuit outputting a required output signal, a second semiconductor integrated circuit 12 in which a plurality of MOS elements (PMOS transistor or NMOS transistor) for independently switching to and from a conducted state and a non-conducted state in accordance with a plurality of gate signals each having a different timing is provided and the plurality of MOS elements is connected in parallel to an output or an input of the first semiconductor integrated circuit, and a pulse generating circuit 13 for generating and outputting the plurality of gate signals ?i (i=1, 2, 3) each having a different timing with respect to the plurality of MOS elements in the second semiconductor integrated circuit.

Abstract: In a semiconductor integrated circuit having a register file of a multiport configuration, a first holding circuit 20A is dedicated to a first functional block having one first write port section 21AW and two first read port sections 21AR1 and 21AR2. A second holding circuit 30B is dedicated to a second functional block having one second write port section 31AW and one second read port section 31BR. When it is necessary to read data held in the first holding circuit 20A from the second read port section 31BR, for example, a data interchange operation is performed as follows. After the data of the second holding circuit 30B is latched in a latch circuit 40, the data of the first holding circuit 20A is transferred to the second holding circuit 30B, and then the data of the second holding circuit 30B latched in the latch circuit 40 is transferred to the first holding circuit 20A. Thus, the area necessary to provide a register file is significantly reduced.

Abstract: In a dynamic flip-flop circuit with a data selection function, for example, when data having an H value is selected using a selection signal, a first node N1 is L, a second node N2 of a second dynamic circuit is H, so that an output signal has an H level. In this case, when none of a plurality of pieces of data is selected using a selection signal, the first node N1 is H, so that the electric charge of the second node N2 is discharged and the output signal erroneously has an L level. However, in this case, an output node N3 is H and a fourth node N4 is L, so that an n-type transistor of the second dynamic circuit is turned OFF, thereby preventing the second node N2 from being discharged. Therefore, a normal operation is performed while securing a satisfactorily high-speed operation even when none of the pieces of data is selected.

Abstract: Provided is a semiconductor integrated circuit apparatus capable of controlling the substrate voltage of a MOSFET so that the drain current for an arbitrary gate voltage value in a subthreshold region or a saturated region will be free from temperature dependence and process variation dependence, thereby enhancing the stable operation thereof. The semiconductor integrated circuit apparatus includes: an integrated circuit main body having a plurality of MOSFETs on a semiconductor substrate; a monitor unit for monitoring at least one of the drain currents of the plurality of MOSFETs; and a substrate voltage regulating unit for controlling the substrate voltage of the semiconductor substrate so as to keep constant the drain current.

Abstract: A semiconductor integrated circuit (1) comprises a substrate voltage control circuit (10A), a drain current adjuster (E1), a MOS device characteristic detection circuit (20), and a drain current compensator (E2). The substrate voltage control circuit (10A) has at least one substrate voltage supply MOS device (m1) for controlling the supply of the substrate voltage of the semiconductor integrated circuit (1). The drain current adjuster (E1) adjusts the drain current of the substrate voltage supply MOS device (m1) by controlling the substrate voltage of the substrate voltage supply MOS device (m1). The MOS device characteristic detection circuit (20) has a characteristic detection device (m2) for detecting the characteristics of the substrate voltage supply MOS device (m1).

Abstract: To save power consumption in a semiconductor integrated circuit 2A increased due to a leak current caused by a variation in a manufacturing process, temperature, and a power supply voltage. A semiconductor integrated circuit 2A, a leak current detection circuit 3, a comparison operation circuit 4 and an applied voltage output circuit 5A are provided. The semiconductor integrated circuit 2A has a circuit body 21 including a plurality of functional MOSFETs for performing predetermined functional operations, and a monitor circuit 22A including a plurality of monitor NMOSFETs 23 for monitoring properties of the functional MOSFETs. The leak current detection circuit 3 detects leak data corresponding to leak currents from the monitor NMOSFETs 23, and outputs the detected leak data. The comparison operation circuit 4 extracts, from a plurality of pieces of leak data, one piece of leak data minimizing a leak current in the circuit body 21, and outputs the extracted leak data as applied voltage data.

Abstract: In a semiconductor integrated circuit having a register file of a multiport configuration, a first holding circuit 20A is dedicated to a first functional block having one first write port section 21AW and two first read port sections 21AR1 and 21AR2. A second holding circuit 30B is dedicated to a second functional block having one second write port section 31AW and one second read port section 31BR. When it is necessary to read data held in the first holding circuit 20A from the second read port section 31BR, for example, a data interchange operation is performed as follows. After the data of the second holding circuit 30B is latched in a latch circuit 40, the data of the first holding circuit 20A is transferred to the second holding circuit 30B, and then the data of the second holding circuit 30B latched in the latch circuit 40 is transferred to the first holding circuit 20A. Thus, the area necessary to provide a register file is significantly reduced.

Abstract: Provided is a semiconductor integrated circuit apparatus capable of controlling the substrate voltage of a MOSFET so that the drain current for an arbitrary gate voltage value in a subthreshold region or a saturated region will be free from temperature dependence and process variation dependence, thereby enhancing the stable operation thereof. The semiconductor integrated circuit apparatus includes: an integrated circuit main body having a plurality of MOSFETs on a semiconductor substrate; a monitor unit for monitoring at least one of the drain currents of the plurality of MOSFETs; and a substrate voltage regulating unit for controlling the substrate voltage of the semiconductor substrate so as to keep constant the drain current.

Abstract: In an electronic device according to the present invention, a source of the first signal-wire drive transistor is connected to a first power supply, a drain of the first signal-wire drive transistor is connected to a signal wire, and a control circuit controls a gate voltage so that a current flowing in the signal wire is amplified toward a voltage to which a potential of the signal wire transits during the potential transition in the signal wire and further controls the gate voltage so that a voltage value obtained after the potential transition in the signal wire is retained after the potential transition in the signal wire.

Abstract: A semiconductor integrated circuit is provided with a voltage level detector which detects a voltage level of a signal wire, and a transition time detector which detects a time length of a transition period during which the signal wire changes from an inactive voltage state to an active voltage state based on the voltage level detected by the voltage level detector. The voltage level detector detects the voltage level of the signal wire during the transition period.

Abstract: In a dynamic flip-flop circuit with a data selection function, for example, when data having an H value has been selected using a selection signal S0, a first node N1 is L and a second node N2 of a second dynamic circuit 1B is H, so that an output signal Q has an H level. In this case, when none of a plurality of pieces of data D0 to D2 is selected using selection signals S0 to S2, the first node N1 is H, so that the electric charge of the second node N2 is discharged and the output signal Q erroneously has an L level. However, in this case, an output node N3 is H and a fourth node N4 is L, so that an n-type transistor Tr6 of the second dynamic circuit 1B is turned OFF, thereby preventing the second node N2 from being discharged. Therefore, a normal operation is performed while securing a satisfactorily high-speed operation even when none of the pieces of data is selected.

Abstract: A semiconductor integrated circuit has a first substrate of a first polarity to which a first substrate potential is given, a second substrate of the first polarity to which a second substrate potential different from the first substrate potential is given, and a third substrate of a second polarity different from the first polarity. The first substrate is insulated from a power source or ground to which a source of a MOSFET formed on the substrate is connected. The third substrate is disposed between the first and second substrates in adjacent relation to the first and second substrates. A circuit element is formed on the third substrate.

Abstract: A semiconductor integrated circuit has a first substrate of a first polarity to which a first substrate potential is given, a second substrate of the first polarity to which a second substrate potential different from the first substrate potential is given, and a third substrate of a second polarity different from the first polarity. The first substrate is insulated from a power source or ground to which a source of a MOSFET formed on the substrate is connected. The third substrate is disposed between the first and second substrates in adjacent relation to the first and second substrates. A circuit element is formed on the third substrate.

Abstract: In a dynamic flip-flop circuit with a data selection function, for example, when data having an H value has been selected using a selection signal S0, a first node N1 is L and a second node N2 of a second dynamic circuit 1B is H, so that an output signal Q has an H level. In this case, when none of a plurality of pieces of data D0 to D2 is selected using selection signals S0 to S2, the first node N1 is H, so that the electric charge of the second node N2 is discharged and the output signal Q erroneously has an L level. However, in this case, an output node N3 is H and a fourth node N4 is L, so that an n-type transistor Tr6 of the second dynamic circuit 1B is turned OFF, thereby preventing the second node N2 from being discharged. Therefore, a normal operation is performed while securing a satisfactorily high-speed operation even when none of the pieces of data is selected.