Abstract: A memory device includes a first memory cell array, a second memory cell array disposed in a first direction with respect to the first memory cell array, a first contact plug extending in the first direction through the first memory cell array, and a second contact plug extending in the first direction through the second memory cell array. The first memory cell array includes first electrode layers stacked in a first direction, and a first semiconductor pillar extending through the first electrode layers in the first direction. The second memory cell array including second electrode layers stacked in the first direction, and a second semiconductor pillar extending in the first direction through the second electrode layers. The first contact plug is electrically connected to the first semiconductor pillar, and the second contact plug is electrically connected to the second semiconductor pillar and the first contact plug.

Abstract: According to one embodiment, a semiconductor memory device includes a first memory chip, a circuit chip, and an external connection electrode on a surface of the first memory chip. The first memory chip comprises first conductors stacked via an insulator, and a first pillar passing the first conductors. The circuit chip comprises a substrate, a control circuit, and a second conductor connected to the control circuit, the circuit chip being attached to the first memory chip. The external connection electrode comprises a portion extending from a side of the surface of the first memory chip through the first memory chip and connected to the second conductor.

Abstract: An integrated circuit device includes a first insulating film, a second insulating film provided on the first insulating film, and having a composition different from a composition of the first insulating film, a first interconnect extending in a first direction crossing a vertical direction, and having a lower portion disposed in the first insulating film, and an upper portion disposed in the second insulating film, and a second interconnect extending in the first direction, and having a lower portion disposed in the first insulating film, and an upper portion disposed in the second insulating film. An air gap is formed in the first insulating film and in the second insulating film and also between the first interconnect and the second interconnect. A lower end of the air gap is located lower than a lower surface of the first interconnect and a lower surface of the second interconnect.

Abstract: According to one embodiment, a semiconductor memory device includes a first memory chip, a circuit chip, and an external connection electrode on a surface of the first memory chip. The first memory chip comprises first conductors stacked via an insulator, and a first pillar passing the first conductors. The circuit chip comprises a substrate, a control circuit, and a second conductor connected to the control circuit, the circuit chip being attached to the first memory chip. The external connection electrode comprises a portion extending from a side of the surface of the first memory chip through the first memory chip and connected to the second conductor. Part of the first conductors is between the external connection electrode and the substrate.

Abstract: According to one embodiment, a semiconductor device includes a stacked body, first, second, third, and fourth insulating bodies, first and second columnar portions. The stacked body includes a conductive layer and an insulating layer stacked alternately. The first, second, third and fourth insulating bodies, the first and second columnar portions are provided inside the stacked body. The second insulating body is at a position different from the first insulating body. The third insulating body is between the first and second insulating bodies. The fourth insulating body is between the first and second insulating bodies, and includes portions contacting the third insulating body and being separated from each other with the third insulating body interposed. The first columnar portion is between the first and fourth insulating bodies. The second columnar portion is between the second and fourth insulating bodies. The first and second columnar portions include a semiconductor layer.

Abstract: An integrated circuit device includes a first insulating film, a second insulating film provided on the first insulating film, and having a composition different from a composition of the first insulating film, a first interconnect extending in a first direction crossing a vertical direction, and having a lower portion disposed in the first insulating film, and an upper portion disposed in the second insulating film, and a second interconnect extending in the first direction, and having a lower portion disposed in the first insulating film, and an upper portion disposed in the second insulating film. An air gap is formed in the first insulating film and in the second insulating film and also between the first interconnect and the second interconnect. A lower end of the air gap is located lower than a lower surface of the first interconnect and a lower surface of the second interconnect.

Abstract: According to one embodiment, a semiconductor memory device includes a first memory chip, a circuit chip, and an external connection electrode on a surface of the first memory chip. The first memory chip comprises first conductors stacked via an insulator, and a first pillar passing the first conductors. The circuit chip comprises a substrate, a control circuit, and a second conductor connected to the control circuit, the circuit chip being attached to the first memory chip. The external connection electrode comprises a portion extending from a side of the surface of the first memory chip through the first memory chip and connected to the second conductor. Part of the first conductors is between the external connection electrode and the substrate.

Abstract: A memory device includes a first memory cell array, a second memory cell array disposed in a first direction with respect to the first memory cell array, a first contact plug extending in the first direction through the first memory cell array, and a second contact plug extending in the first direction through the second memory cell array. The first memory cell array includes first electrode layers stacked in a first direction, and a first semiconductor pillar extending through the first electrode layers in the first direction. The second memory cell array including second electrode layers stacked in the first direction, and a second semiconductor pillar extending in the first direction through the second electrode layers. The first contact plug is electrically connected to the first semiconductor pillar, and the second contact plug is electrically connected to the second semiconductor pillar and the first contact plug.

Abstract: According to an embodiment, a semiconductor memory device includes a substrate, a stacked body, a plurality of columnar portions, a plurality of interconnects, and a plurality of connection portions. The plurality of interconnects extends in a first direction parallel to an upper surface of the substrate. When viewed from a second direction perpendicular to the stacking direction and the first direction, a portion of a first connection portion overlaps a portion of a second connection portion. The first connection portion is connected to a first interconnect of the plurality of interconnects. The second connection portion is connected to a second interconnect of the plurality of interconnects adjacent to the first interconnect in the second direction.

Abstract: In one embodiment, a semiconductor device includes a first chip including a substrate, a first plug on the substrate, and a first pad on the first plug, and a second chip including a second plug and a second pad under the second plug. The second chip includes an electrode layer electrically connected to the second plug, a charge storage layer provided on a side face of the electrode layer via a first insulator, and a semiconductor layer provided on a side face of the charge storage layer via a second insulator. The first and second pads are bonded with each other, and the first and second plugs are disposed so that at least a portion of the first plug and at least a portion of the second plug do not overlap with each other in a first direction that is perpendicular to a surface of the substrate.

Abstract: According to one embodiment, a semiconductor memory device includes a first memory chip, a circuit chip, and an external connection electrode on a surface of the first memory chip. The first memory chip comprises first conductors stacked via an insulator, and a first pillar passing the first conductors. The circuit chip comprises a substrate, a control circuit, and a second conductor connected to the control circuit, the circuit chip being attached to the first memory chip. The external connection electrode comprises a portion extending from a side of the surface of the first memory chip through the first memory chip and connected to the second conductor. Part of the first conductors is between the external connection electrode and the substrate.

Abstract: A memory device includes a first memory cell array, a second memory cell array disposed in a first direction with respect to the first memory cell array, a first contact plug extending in the first direction through the first memory cell array, and a second contact plug extending in the first direction through the second memory cell array. The first memory cell array includes first electrode layers stacked in a first direction, and a first semiconductor pillar extending through the first electrode layers in the first direction. The second memory cell array including second electrode layers stacked in the first direction, and a second semiconductor pillar extending in the first direction through the second electrode layers. The first contact plug is electrically connected to the first semiconductor pillar, and the second contact plug is electrically connected to the second semiconductor pillar and the first contact plug.

Abstract: According to one embodiment, a semiconductor device includes a stacked body, first, second, third, and fourth insulating bodies, first and second columnar portions. The stacked body includes a conductive layer and an insulating layer stacked alternately. The first, second, third and fourth insulating bodies, the first and second columnar portions are provided inside the stacked body. The second insulating body is at a position different from the first insulating body. The third insulating body is between the first and second insulating bodies. The fourth insulating body is between the first and second insulating bodies, and includes portions contacting the third insulating body and being separated from each other with the third insulating body interposed. The first columnar portion is between the first and fourth insulating bodies. The second columnar portion is between the second and fourth insulating bodies. The first and second columnar portions include a semiconductor layer.

Abstract: According to one embodiment, a semiconductor memory device includes a first memory chip, a circuit chip, and an external connection electrode on a surface of the first memory chip. The first memory chip comprises first conductors stacked via an insulator, and a first pillar passing the first conductors. The circuit chip comprises a substrate, a control circuit, and a second conductor connected to the control circuit, the circuit chip being attached to the first memory chip. The external connection electrode comprises a portion extending from a side of the surface of the first memory chip through the first memory chip and connected to the second conductor. Part of the first conductors is between the external connection electrode and the substrate.

Abstract: According to an embodiment, a template includes a flat plate-shaped first member, a flat plate-shaped second member including a pattern arrangement face, and a flat plate-shaped third member provided with an opening at a position corresponding to an arrangement position of the second member. The template is dividable at a position of at least one of a first boundary between the first member and the second member and a second boundary between the first member and the third member.

Abstract: A memory device includes a first memory cell array, a second memory cell array disposed in a first direction with respect to the first memory cell array, a first contact plug extending in the first direction through the first memory cell array, and a second contact plug extending in the first direction through the second memory cell array. The first memory cell array includes first electrode layers stacked in a first direction, and a first semiconductor pillar extending through the first electrode layers in the first direction. The second memory cell array including second electrode layers stacked in the first direction, and a second semiconductor pillar extending in the first direction through the second electrode layers. The first contact plug is electrically connected to the first semiconductor pillar, and the second contact plug is electrically connected to the second semiconductor pillar and the first contact plug.

Abstract: A semiconductor device includes a semiconductor layer and a first insulating film provided on the semiconductor layer. The first insulating film has a surface opposite to the semiconductor layer, the surface including a first portion, a second portion and a third portion between the first portion and the second portion. The device includes a first interconnection provided on a first portion and a second interconnection provided on the second portion. The first interconnection and the second interconnection extend in a first direction. The device further includes a conductor and a nitride layer. The conductor extends through the first insulating film in a second direction from each of the first interconnection and the second interconnection toward the semiconductor layer, and the conductor electrically connects the first interconnection to the semiconductor layer. The nitrided layer is provided at least on the third surface.

Abstract: An integrated circuit device includes a first insulating film, a second insulating film provided on the first insulating film, and having a composition different from a composition of the first insulating film, a first interconnect extending in a first direction crossing a vertical direction, and having a lower portion disposed in the first insulating film, and an upper portion disposed in the second insulating film, and a second interconnect extending in the first direction, and having a lower portion disposed in the first insulating film, and an upper portion disposed in the second insulating film. An air gap is formed in the first insulating film and in the second insulating film and also between the first interconnect and the second interconnect. A lower end of the air gap is located lower than a lower surface of the first interconnect and a lower surface of the second interconnect.

Abstract: According to one embodiment, a semiconductor device includes a semiconductor layer, an insulating film, a first interconnect, a conductor, and a frame-shaped portion. The insulating film is provided on the semiconductor layer. The first interconnect is provided on the insulating film. The conductor extends through the insulating film and electrically connects the semiconductor layer and the first interconnect. The frame-shaped portion extends through the insulating film and is provided in a second region different from a first region, the conductor being provided in the first region. The frame-shaped portion protrudes from a surface of the insulating film on which the first interconnect is provided.

Abstract: A semiconductor device includes a semiconductor layer, a first insulating film provided on the semiconductor layer, a second insulating film provided on the first insulating film and including a material different from a material of the first insulating film, a first interconnect extending in a first direction along a surface of the semiconductor layer on the second insulating film, a second interconnect disposed side by side with the first interconnect on the second insulating film, and a third insulating film covering the first interconnect and the second interconnect, the third insulating film including a first gap between the first interconnect and the second interconnect. An upper surface of the second insulating film directly below the first gap is located at a level equal to or below a lower end of the first interconnect and a lower end of the second interconnect.