Patents by Inventor Meng Ding

Meng Ding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7206172
    Abstract: An electrical lapping guide (ELG) incorporated into a shield of a magnetic head for measuring lapping process during construction of the magnetic head.
    Type: Grant
    Filed: February 20, 2004
    Date of Patent: April 17, 2007
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Meng Ding, Huey-Ming Tzeng
  • Patent number: 7199986
    Abstract: A magnetic sensor is provided, having two bias layers separated by a decoupling layer to eliminate exchange coupling between the bias layers. The two bias layers may have differing coercivities, such that the biases provided by the bias layers to the free layer are independently adjustable. The grain structures of the two bias layers may be substantially decorrelated by the decoupling layer.
    Type: Grant
    Filed: February 18, 2004
    Date of Patent: April 3, 2007
    Assignee: Hitachi Global Storage Technologies
    Inventors: Marie-Claire Cyrille, Meng Ding, Kuok-San Ho, Prakash Kasiraj, Ernesto Marinero, James Lamar Nix, Brian York
  • Publication number: 20060268593
    Abstract: According to one exemplary embodiment, a programmable ROM array includes at least one bitline situated in a substrate. The programmable ROM array further includes at least one wordline situated over the at least one bitline. The programmable ROM array further includes a memory cell situated at an intersection of the at least one bitline and the at least one wordline, where the memory cell includes a dielectric region situated between the at least one bitline and the at least one wordline. A programming operation causes the memory cell to change from a first logic state to a second logic state by causing the dielectric region to break down. The programming operation causes the memory cell to operate as a diode. A resistance of the memory cell can be measured in a read operation to determine if the memory cell has the first or second logic state.
    Type: Application
    Filed: May 25, 2005
    Publication date: November 30, 2006
    Inventors: Meng Ding, Zhizheng Liu, Yi He, Mark Randolph
  • Publication number: 20060196040
    Abstract: A method for making a magnetoresistive read head so that the pinned ferromagnetic layer is wider than the stripe height of the free ferromagnetic layer uses ion milling with the ion beam aligned at an angle to the substrate supporting the stack of layers making up the read head. The stack is patterned with photoresist to define a rectangular region with front and back long edges aligned parallel to the read head track width. After ion milling in two opposite directions orthogonal to the front and back long edges, the pinned layer width has an extension. The extension makes the width of the pinned layer greater than the stripe height of the free layer after the substrate and stack of layers are lapped. The length of the extension is determined by the angle between the substrate and the ion beam and the thickness of the photoresist.
    Type: Application
    Filed: March 3, 2005
    Publication date: September 7, 2006
    Inventors: Marie-Claire Cyrille, Meng Ding, Elizabeth Dobisz, Kuok Ho, Scott MacDonald
  • Patent number: 7072156
    Abstract: A magnetic sensor is provided, having two bias layers separated by a decoupling layer to eliminate exchange coupling between the bias layers. The two bias layers may have differing coercivities, such that the biases provided by the bias layers to the free layer are independently adjustable. The grain structures of the two bias layers may be substantially decorrelated by the decoupling layer.
    Type: Grant
    Filed: February 18, 2004
    Date of Patent: July 4, 2006
    Assignee: Hitachi Global Storage Technologies Netherlands B.V.
    Inventors: Marie-Claire Cyrille, Meng Ding, Kuok San Ho, Prakash Kasiraj, Ernesto Marinero, James Lamar Nix
  • Patent number: 7062838
    Abstract: A method of forming an embedded read element is used in the fabrication process of a magnetic head assembly including write and read heads. In this method, three photolithographic patterning steps are applied for defining the designed height of the embedded read element, defining its designed width, and connecting it with conducting layers, respectively. An in-line lapping guide is also formed with a spacing in front of the embedded read element. In this method, two mechanical lapping steps are applied, one monitored by measuring the resistance of a parallel circuit of the embedded read element and the in-line lapping guide, and the other monitored by measuring the GMR response of the embedded read element.
    Type: Grant
    Filed: September 19, 2003
    Date of Patent: June 20, 2006
    Assignee: Hitachi Global Storage Technologies Netherland B.V.
    Inventors: Meng Ding, Kuok San Ho, Tsann Lin, Huey-Ming Tzeng
  • Publication number: 20060044702
    Abstract: A method for shorting, unshorting, and reshorting an electronic component such as an MR sensor provides a repeatable ESD protection scheme. A conductive line of an electrically conductive first shorting material is created between electrical leads operatively coupled to an electronic component for creating a short therebetween. The short is severed using a laser. The short is recreated by applying a second shorting material, which may or may not be the same as the first shorting material.
    Type: Application
    Filed: August 31, 2004
    Publication date: March 2, 2006
    Inventors: Meng Ding, Surya Pattanaik, Chie Poon, Neil Robertson
  • Publication number: 20060000079
    Abstract: One illustrative method of fabricating a read sensor of a magnetic head includes the steps of forming a plurality of read sensor layers on a wafer; etching the read sensor layers to form a read sensor structure with a trench in front of the read sensor structure; forming a highly porous material within the trench; and slicing the wafer and lapping the sliced wafer through the highly porous material until an air bearing surface (ABS) of the magnetic head is reached. Advantageously, the highly porous material in front of the read sensor structure reduces mechanical stress on the read sensor during the lapping process. This reduces the likelihood that the amplitude of the read sensor will be degraded or set in a “flipped” or reversed orientation, as well as reduces the likelihood that electrostatic discharge (ESD) damage to the read sensor will occur.
    Type: Application
    Filed: June 30, 2004
    Publication date: January 5, 2006
    Inventors: Meng Ding, Kuok Ho, Tsann Lin, Huey-Ming Tzeng
  • Publication number: 20050241138
    Abstract: A method of making a read sensor while protecting it from electrostatic discharge (ESD) damage involves forming a severable shunt during the formation of the read sensor. The method may include forming a resist layer over a plurality of read sensor layers; performing lithography with use of a mask to form the resist layer into a patterned resist which exposes left and right side regions over the read sensor layers as well as a shunt region; etching, with the patterned resist in place, to remove materials in the left and right side regions and in the shunt region; and depositing, with the patterned resist in place, left and right hard bias and lead layers in the left and right side regions, respectively, and in the shunt region for forming a severable shunt which electrically couples the left and right hard bias and lead layers together for ESD protection.
    Type: Application
    Filed: April 30, 2004
    Publication date: November 3, 2005
    Inventors: Frederick Dill, Meng Ding, Kuok Ho, Jordan Katine, Scott MacDonald, Huey-Ming Tzeng
  • Publication number: 20050185345
    Abstract: An electrical lapping guide (ELG) incorporated into a shield of a magnetic head for measuring lapping process during construction of the magnetic head.
    Type: Application
    Filed: February 20, 2004
    Publication date: August 25, 2005
    Inventors: Meng Ding, Huey-Ming Tzeng
  • Publication number: 20050180061
    Abstract: A self pinned magnetoresistive sensor that has a relatively thick compressive material at either side to assist with self pinning. A shield having recessed portions at either side of the sensor area allows room for a thicker compressive layer than would otherwise be possible.
    Type: Application
    Filed: February 18, 2004
    Publication date: August 18, 2005
    Inventors: Meng Ding, Robert Fontana, Kuok Ho, Neil Robertson, Ching Tsang
  • Publication number: 20050180063
    Abstract: A magnetic sensor is provided, having two bias layers separated by a decoupling layer to eliminate exchange coupling between the bias layers. The two bias layers may have differing coercivities, such that the biases provided by the bias layers to the free layer are independently adjustable. The grain structures of the two bias layers may be substantially decorrelated by the decoupling layer.
    Type: Application
    Filed: February 18, 2004
    Publication date: August 18, 2005
    Inventors: Marie-Claire Cyrille, Meng Ding, Kuok Ho, Prakash Kasiraj, Ernesto Marinero, James Nix
  • Publication number: 20050180064
    Abstract: A magnetic sensor is provided, having two bias layers separated by a decoupling layer to eliminate exchange coupling between the bias layers. The two bias layers may have differing coercivities, such that the biases provided by the bias layers to the free layer are independently adjustable. The grain structures of the two bias layers may be substantially decorrelated by the decoupling layer.
    Type: Application
    Filed: February 18, 2004
    Publication date: August 18, 2005
    Inventors: Marie-Claire Cyrille, Meng Ding, Kuok-San Ho, Prakash Kasiraj, Ernesto Marinero, James Nix, Brian York
  • Publication number: 20050063103
    Abstract: A method of forming an embedded read element is used in the fabrication process of a magnetic head assembly including write and read heads. In this method, three photolithographic patterning steps are applied for defining the designed height of the embedded read element, defining its designed width, and connecting it with conducting layers, respectively. An in-line lapping guide is also formed with a spacing in front of the embedded read element. In this method, two mechanical lapping steps are applied, one monitored by measuring the resistance of a parallel circuit of the embedded read element and the in-line lapping guide, and the other monitored by measuring the GMR response of the embedded read element.
    Type: Application
    Filed: September 19, 2003
    Publication date: March 24, 2005
    Inventors: Meng Ding, Kuok Ho, Tsann Lin, Huey-Ming Tzeng