Abstract: A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.

Abstract: A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.

Abstract: A printed circuit board includes an insulating layer, a pad, and a via fill. The insulating layer includes a via hole. The pad is formed in the insulating layer such that an intermediate portion thereof is exposed by the via hole. The pad includes a through hole formed in the intermediate portion. The via fill is formed in the via hole, configured to fill the through hole, and coupled to the intermediate portion.

Abstract: A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.

Abstract: A printed circuit board is provided. The printed circuit board includes an insulating material, and a circuit comprising a first region that partially penetrates the insulating material, and a second region formed on the first region and that protrudes from an upper portion of the insulating material, the first region includes a first electroplating layer and a first electroless plating layer that are formed between the insulating material and the first electroplating layer.

Abstract: A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.

Abstract: A coil electronic component includes a body portion and an external electrode. The body portion includes a coil layer and a reinforcing layer disposed on at least one of an upper portion and a lower portion of the coil layer. The external electrode is disposed on an outer surface of the body portion. The coil layer includes an insulating layer, a coil pattern, and a first conductivity type via penetrating through the insulating layer to be connected to the coil pattern, and the reinforcing layer has a higher degree of rigidity than the insulating layer.

Abstract: A multilayered substrate in accordance with an aspect of the present disclosure may include an insulating layer, a conductive pattern embedded, at least partially, in the insulating layer, and a bump being electrically connected to the conductive pattern and penetrating the insulating layer. The bump may include a low melting point metal layer having a melting point lower than a melting point of the conductive pattern and a high melting point metal layer having a melting point higher than the melting point of the low melting point metal layer and having a latitudinal cross-sectional area smaller than a latitudinal cross-sectional area of the low melting point metal layer.

Abstract: An inductor includes a body in which a plurality of insulating layers on which a plurality of coil patterns are arranged are stacked, and first and second external electrodes disposed inside the body, wherein the plurality of coil patterns are connected by coil connecting portions and form a coil in which opposing ends thereof are connected to the first and second external electrodes, and the first and second external electrodes are directly connected to the opposing ends of the plurality of coil patterns inside the body.

Abstract: An inductor includes a body structure, a first external electrode and a second external electrode disposed externally on the body structure and spaced apart from each other, and a conductive structure disposed inside the body structure and including a first end portion in contact with the first external electrode and a second end portion in contact with the second external electrode, wherein each of the first and second external electrodes includes an electroless plated layer and an electrolytic plated layer formed of a material different from that of the electroless plated layer and covering the electroless plated layer.

Abstract: A multilayer capacitor includes a body including dielectric layers and first and second internal electrodes alternately disposed with dielectric layers interposed therebetween. First and second external electrodes are on the body and connected to the first and second internal electrodes, respectively. The first and second internal electrodes are plating layers. A manufacturing method of a multilayer capacitor includes preparing a plurality of laminated sheets including internal electrodes, dummy electrodes, and dielectric layers. The plurality of laminated sheets, and covers on and below the laminated sheets, are simultaneously stacked and then cured to prepare a cured product. The cured product is then diced depending on the size of the capacitor to prepare a body where the internal electrodes and the dummy electrodes are partially exposed. External electrodes are formed on external surfaces of the body using the dummy electrodes as seeds in a plating method.

Abstract: The present invention relates to a bio-link composition having improved physical and biological properties and, more specifically to a bio-link composition, which exhibits, through a combination of specific contents of components, high viscosity, strong shear-thinning tendencies, formations of fast cross linkages, and appropriate mechanical properties after printing. The bio-ink composition of the present invention is capable of being used very usefully in the preparation of three-dimensional bio-printed tissue-like organs and internal transplantable tissue structures.

Abstract: A multilayer capacitor includes a body including dielectric layers and first and second internal electrodes alternately disposed with dielectric layers interposed therebetween. First and second external electrodes are on the body and connected to the first and second internal electrodes, respectively. The first and second internal electrodes are plating layers. A manufacturing method of a multilayer capacitor includes preparing a plurality of laminated sheets including internal electrodes, dummy electrodes, and dielectric layers. The plurality of laminated sheets, and covers on and below the laminated sheets, are simultaneously stacked and then cured to prepare a cured product. The cured product is then diced depending on the size of the capacitor to prepare a body where the internal electrodes and the dummy electrodes are partially exposed. External electrodes are formed on external surfaces of the body using the dummy electrodes as seeds in a plating method.

Abstract: A multilayered substrate in accordance with an aspect of the present disclosure may include an insulating layer, a conductive pattern embedded, at least partially, in the insulating layer, and a bump being electrically connected to the conductive pattern and penetrating the insulating layer. The bump may include a low melting point metal layer having a melting point lower than a melting point of the conductive pattern and a high melting point metal layer having a melting point higher than the melting point of the low melting point metal layer and having a latitudinal cross-sectional area smaller than a latitudinal cross-sectional area of the low melting point metal layer.

Abstract: A coil component includes a body portion, a coil portion, and an electrode portion. The body portion includes a magnetic material, the coil portion is disposed in the body portion, and the electrode portion is disposed on the body portion and electrically connected to the coil portion. The coil portion includes a first coil layer in which a plurality of conductors having a planar spiral shape are stacked, a second coil layer in which a plurality of conductors having a planar spiral shape are stacked, and a first bump disposed between the first and second coil layers to electrically connect the first and second coil layers to each other. The first coil layer and the second coil layer are electrically connected to each other through the first bump to form a single coil having coil turns adjacent to each other in horizontal and vertical directions.

Abstract: A multilayered substrate includes unit substrates laminated in a direction of thickness thereof, and the unit substrates include a photosensitive insulating layer, a conductive pattern disposed in the photosensitive insulating layer, and a bump penetrating into the photosensitive insulating layer and providing an interlayer connection to the conductive pattern.

Abstract: A coil component includes a body portion, a coil portion, and an electrode portion. The body portion includes a magnetic material, the coil portion is disposed in the body portion, and the electrode portion is disposed on the body portion and electrically connected to the coil portion. The coil portion includes a first coil layer in which a plurality of conductors having a planar spiral shape are stacked, a second coil layer in which a plurality of conductors having a planar spiral shape are stacked, and a first bump disposed between the first and second coil layers to electrically connect the first and second coil layers to each other. The first coil layer and the second coil layer are electrically connected to each other through the first bump to form a single coil having coil turns adjacent to each other in horizontal and vertical directions.

Abstract: A coil electronic component includes a body portion and an external electrode. The body portion includes a coil layer and a reinforcing layer disposed on at least one of an upper portion and a lower portion of the coil layer. The external electrode is disposed on an outer surface of the body portion. The coil layer includes an insulating layer, a coil pattern, and a first conductivity type via penetrating through the insulating layer to be connected to the coil pattern, and the reinforcing layer has a higher degree of rigidity than the insulating layer.

Abstract: A printed circuit board and a method of manufacturing the same is provided. The printed circuit board includes an insulating substrate, a circuit disposed on the insulating substrate, a pair of first reinforcements spatially separated in the insulating substrate, the first reinforcements extending parallel to a surface of the insulating substrate, and a second reinforcement configured to connect the pair of first reinforcements.

Abstract: A printed circuit board and a method of manufacturing the same is provided. The printed circuit board includes an insulating substrate, a circuit disposed on the insulating substrate, a pair of first reinforcements spatially separated in the insulating substrate, the first reinforcements extending parallel to a surface of the insulating substrate, and a second reinforcement configured to connect the pair of first reinforcements.