Patents by Inventor Mi Sun Hwang
Mi Sun Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160381794Abstract: A multilayered substrate includes unit substrates laminated in a direction of thickness thereof, and the unit substrates include a photosensitive insulating layer, a conductive pattern disposed in the photosensitive insulating layer, and a bump penetrating into the photosensitive insulating layer and providing an interlayer connection to the conductive pattern.Type: ApplicationFiled: June 29, 2016Publication date: December 29, 2016Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seok-Hwan AHN, Mi-Sun HWANG, Young-Gwan KO, Jong-Seok BAE, Myung-Sam KANG
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Publication number: 20150136446Abstract: Embodiments of the invention provide a printed circuit board having a structure in which a plurality of insulating layers having a metal wiring formed on one surface thereof are stacked, wherein a metal layer is interposed in the insulating layers, in order to improve warpage property of the board.Type: ApplicationFiled: March 14, 2014Publication date: May 21, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Joung Gul RYU, Sung Taek LIM, Mi Sun HWANG
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Patent number: 8928234Abstract: A lighting apparatus is disclosed. The lighting apparatus is capable of achieving improved aesthetics by irradiating mood lighting into a storage container and also, of functioning to display a variety of status information about the storage container to the outside and to sterilize the interior of the storage container.Type: GrantFiled: December 13, 2010Date of Patent: January 6, 2015Assignee: LG Electronics Inc.Inventors: Ji Young Kim, Eun Seok Choi, Ji Hye Hwang, Mi Sun Hwang, Hae Rim Park, Min Su Park
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Patent number: 8881381Abstract: Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.Type: GrantFiled: December 4, 2009Date of Patent: November 11, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Mi Sun Hwang, Myung Sam Kang, Ok Tae Kim, Seon Ha Kang, Gil Yong Shin, Kil Yong Yun, Min Jung Cho
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Patent number: 8720048Abstract: A method of manufacturing a printed circuit board includes arranging a core layer in which a bending prevention portion of at least two layers that are metal layers having different thermal expansion coefficients is disposed between a plurality of insulating members; forming a circuit pattern so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and forming an insulating layer including an opening portion that exposes the circuit pattern on the core layer.Type: GrantFiled: September 18, 2013Date of Patent: May 13, 2014Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Mi Sun Hwang, Jae Joon Lee, Myung Sam Kang
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Publication number: 20140090245Abstract: In accordance with various embodiments, there is provided a method of manufacturing a printed circuit board, the method including the steps of preparing a first carrier including a first pattern formed on one side thereof, preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof, pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates, attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other, and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.Type: ApplicationFiled: December 6, 2013Publication date: April 3, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Sun HWANG, Myung Sam KANG, Ok Tae KIM, Seon Ha Kang, Gil Yong SHIN, Kil Yong YUN, Min Jung CHO
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Publication number: 20140089841Abstract: Disclosed is a device and method for providing an application interface based on a writing input. The method for providing an application interface based on a writing input includes providing a writing interface including a writing input interface in a first area of the writing interface and a function input interface in a second area of the writing interface, the writing input interface being configured to receive and display a first writing input, and the function input interface being configured to receive a second writing input; based on the first writing input and/or the second writing input, determining a function of an application; and executing the determined function of the application in association with the first writing input.Type: ApplicationFiled: September 24, 2013Publication date: March 27, 2014Applicant: Pantech Co., Ltd.Inventors: Jong Gon KIM, Jin Young ROH, Mi Sun HWANG
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Publication number: 20140089855Abstract: A method and device for executing a specific operation based on a writing input are described. A method utilizing a processor, the method including: recognizing writing input to obtain writing data; extracting feature information from the writing data; searching for applications that operate with the writing data based on the feature information to form an application candidate group; and displaying icons corresponding to applications included in the application candidate group.Type: ApplicationFiled: September 24, 2013Publication date: March 27, 2014Applicant: Pantech Co., Ltd.Inventors: Jong-Gon KIM, Jin-Young Roh, Mi-Sun Hwang
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Publication number: 20140017397Abstract: A method of manufacturing a printed circuit board includes arranging a core layer in which a bending prevention portion of at least two layers that are metal layers having different thermal expansion coefficients is disposed between a plurality of insulating members; forming a circuit pattern so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and forming an insulating layer including an opening portion that exposes the circuit pattern on the core layer.Type: ApplicationFiled: September 18, 2013Publication date: January 16, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Sun HWANG, Jae Joon Lee, Myung Sam Kang
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Patent number: 8541096Abstract: There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided.Type: GrantFiled: December 18, 2009Date of Patent: September 24, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Mi Sun Hwang, Jae Joon Lee, Myung Sam Kang
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Patent number: 8418361Abstract: Method of manufacturing printed circuit board, including: providing a substrate including a first circuit layer having a lower land of a via; forming an insulating layer on the first circuit layer; forming a via hole in the insulating layer; filling the via hole with a first metal, thus forming a via; forming a seed layer with a second metal on the insulating layer and an exposed surface of the via; applying a resist film on the seed layer, and forming a resist pattern having an opening for a second circuit layer with a width formed on the via being smaller than a width of the via; plating a circuit region defined by the opening with a third metal, thus forming a plating layer formed of the third metal; and removing the resist film, and selectively removing an exposed portion of the seed layer, thus forming a second circuit layer.Type: GrantFiled: November 18, 2011Date of Patent: April 16, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Suk Won Lee, Chang Gun Oh, Mi Sun Hwang
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Patent number: 8415200Abstract: Disclosed herein is a method for manufacturing a semiconductor package which uses a base member 120 in which a first metal layer 113, a barrier layer 115, and a second metal layer 117 are stacked on both surface thereof in sequence based on an adhesive member 111 to simultaneously manufacture two printed circuit boards through a single sheet process, thereby making it possible to improve manufacturing efficiency; electrically connects a semiconductor chip 300 to a printed circuit board through a solder bump 250, thereby making it possible to implement a high-density package substrate; and forms a metal post 140 instead of a through hole to required in an interlayer circuit connection, thereby making it possible to reduce costs required in the processing/plating of the through hole.Type: GrantFiled: January 14, 2011Date of Patent: April 9, 2013Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Mi Sun Hwang, Keung Jin Sohn, Eung Suek Lee, Myung Sam Kang
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Publication number: 20120225521Abstract: A single-layer board on chip package substrate and a method of manufacturing the same are disclosed. The single-layer board on chip package substrate in accordance with an embodiment of the present invention includes an insulator, which has a window perforated therethrough, a wiring pattern, a wire bonding pad and a solder ball pad, which are embedded in one surface of the insulator, and a solder resist layer, which is formed on the one surface of the insulator such that the solder resist layer covers the wiring pattern but at least portions of the wire bonding pad and the solder ball pad are exposed.Type: ApplicationFiled: May 15, 2012Publication date: September 6, 2012Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Mi-Sun Hwang, Myung-Sam Kang
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Publication number: 20120103671Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same capable of implementing a slim and small semiconductor package by the printed circuit board configured to include a circuit layer and an insulating layer as a single layer and shortening a process time and reducing processing costs by forming a bump using a screen printing method. Further, disclosed herein is a method for manufacturing a printed circuit board capable of improving a warpage problem of the printed circuit board that occurs during a polishing process by adopting a coining process instead of a polishing process.Type: ApplicationFiled: January 14, 2011Publication date: May 3, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Eung Suek LEE, Kwang Seop YOUM, Keung Jin SOHN, Mi Sun HWANG
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Publication number: 20120088334Abstract: Disclosed herein is a method for manufacturing a semiconductor package which uses a base member 120 in which a first metal layer 113, a barrier layer 115, and a second metal layer 117 are stacked on both surface thereof in sequence based on an adhesive member 111 to simultaneously manufacture two printed circuit boards through a single sheet process, thereby making it possible to improve manufacturing efficiency; electrically connects a semiconductor chip 300 to a printed circuit board through a solder bump 250, thereby making it possible to implement a high-density package substrate; and forms a metal post 140 instead of a through hole to required in an interlayer circuit connection, thereby making it possible to reduce costs required in the processing/plating of the through hole.Type: ApplicationFiled: January 14, 2011Publication date: April 12, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Sun HWANG, Keung Jin SOHN, Eung Suek LEE, Myung Sam KANG
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Publication number: 20120060369Abstract: Method of manufacturing printed circuit board, including: providing a substrate including a first circuit layer having a lower land of a via; forming an insulating layer on the first circuit layer; forming a via hole in the insulating layer; filling the via hole with a first metal, thus forming a via; forming a seed layer with a second metal on the insulating layer and an exposed surface of the via; applying a resist film on the seed layer, and forming a resist pattern having an opening for a second circuit layer with a width formed on the via being smaller than a width of the via; plating a circuit region defined by the opening with a third metal, thus forming a plating layer formed of the third metal; and removing the resist film, and selectively removing an exposed portion of the seed layer, thus forming a second circuit layer.Type: ApplicationFiled: November 18, 2011Publication date: March 15, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Suk Won LEE, Chang Gun Oh, Mi Sun Hwang
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Publication number: 20120011716Abstract: A method of manufacturing a printed circuit board including: preparing a first double-sided substrate including a first insulating layer, a first lower copper layer, a second circuit layer including a first lower land, and a first via; preparing a second double-sided substrate including a second insulating layer, a third lower copper layer, a fourth circuit layer including a second lower land, and a second via; disposing a third insulating layer between the second circuit layer and the fourth circuit layer such that the first lower land and the second lower land are electrically connected to each other though a conductive bump; and forming a first circuit layer including a first circuit pattern connected to the first via on the first lower copper layer and forming a third circuit layer including a third circuit pattern connected to the second via on the third lower copper layer.Type: ApplicationFiled: September 2, 2011Publication date: January 19, 2012Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Han Kim, Mi Sun Hwang, Suk Won Lee, Chang Gun Oh
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Publication number: 20110186997Abstract: A single-layer board on chip package substrate and a method of manufacturing the same are disclosed. The single-layer board on chip package substrate in accordance with an embodiment of the present invention includes an insulator, which has a window perforated therethrough, a wiring pattern, a wire bonding pad and a solder ball pad, which are embedded in one surface of the insulator, and a solder resist layer, which is formed on the one surface of the insulator such that the solder resist layer covers the wiring pattern but at least portions of the wire bonding pad and the solder ball pad are exposed.Type: ApplicationFiled: June 23, 2010Publication date: August 4, 2011Inventors: Mi-Sun HWANG, Myung-Sam Kang
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Publication number: 20110138905Abstract: A lighting apparatus is disclosed. The lighting apparatus is capable of achieving improved aesthetics by irradiating mood lighting into a storage container and also, of functioning to display a variety of status information about the storage container to the outside and to sterilize the interior of the storage container.Type: ApplicationFiled: December 13, 2010Publication date: June 16, 2011Inventors: Ji Young KIM, Eun Seok Choi, Ji Hye Hwang, Mi Sun Hwang, Hae Rim Park, Min Su Park
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Publication number: 20110067233Abstract: A method of fabricating a printed circuit board, the method including: providing an insulating base body having a first surface on which a first circuit pattern is formed, and a second surface opposite to the first surface; pressing the first surface of the insulating base body onto at least one surface of an insulating layer such that the first circuit pattern is embedded in the insulating layer; forming a resist having a desired pattern on the second surface of the insulating base body; forming a trench by performing a plasma treatment on the second surface of the insulating base body on which the resist is formed; and forming a second circuit pattern by filling the trench with a conductive material. Accordingly, the conductive patterns can be formed using a simple process, thereby enhancing a process rate and productivity.Type: ApplicationFiled: December 29, 2009Publication date: March 24, 2011Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seon Ha Kang, Myung Sam Kang, Mi Sun Hwang, Kil Yong Yun, Min Jung Cho, Gil Yong Shin, Ok Tae Kim