Abstract: Provided are a printed circuit board (PCB), and a manufacturing method thereof. The PCB includes a stacked structure including second and third insulation layers with a first insulation layer interposed therebetween, and a conductive via having first to fourth conductive vias. A second-layer circuit pattern and a third-layer circuit pattern are buried in the first insulation layer, a first-layer circuit pattern is formed on the second insulation layer, and a fourth-layer circuit pattern is formed on the third insulation layer. A first conductive via connects the first-layer circuit pattern and the second-layer circuit pattern, a second conductive via connects the first-layer circuit pattern and the third-layer circuit pattern, a third conductive via connects the second-layer circuit pattern and the fourth-layer circuit pattern, and a fourth conductive via connects the third-layer circuit pattern and the fourth-layer circuit pattern.

Abstract: A printed circuit board (PCB) and a fabrication method thereof are disclosed. The PCB includes: a dual-layered circuit pattern formed with a desired pattern on at least one of upper and lower surfaces of an insulation base member (i.e., an insulation substrate) and having metal layers each having a different thermal expansion coefficient; and an insulating layer formed on the insulation base member to cover the circuit pattern. Because the PCB includes an anti-warping unit, a processing rate and productivity can be improved.

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.

Abstract: There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided.

Abstract: Disclosed is a printed circuit board, which includes a first circuit layer embedded in one surface an insulating layer and including a bump pad and a wire bonding pad, thus realizing a high-density wire bonding pad. A semiconductor device including the printed circuit board and a method of manufacturing the printed circuit board are also provided.

Abstract: Disclosed herein is a printed circuit board including an outmost fine circuit pattern. In the board, an end of a via, which has the minimum diameter, is connected to the outmost circuit layer of a substrate. The end surface, having the minimum diameter, is positioned at the outmost layer, so that the outmost circuit layer of the substrate, which needs to have a relatively high density in order to mount chips, compared to other circuit layers, can be more finely formed.

Abstract: The printed circuit board includes the via formed with the electroplating layer unlike a conventional via formed with an electroless plating layer and an electroplating layer and having a cylindrical shape, and thus exhibits good interlayer electrical connection and high reliability of physical contact upon thermal stress caused by the variance in physical properties of material depending on changes in temperature. The via has no upper land, and thus a fine circuit pattern of the circuit layer can be formed on the via.

Abstract: This invention relates to a printed circuit board having a landless via hole, including a circuit pattern formed on a via made of a first metal and having a line width smaller than the diameter of the via hole, in which the circuit pattern includes a seed layer made of a second metal and a plating layer made of a third metal, which is different from the second metal, and to a method of manufacturing the same. In the printed circuit board, the via has no upper land, thus making it possible to finely form the circuit pattern which is connected to the via, thereby realizing a high-density circuit pattern.