Abstract: Embodiments of the present invention provide an electromagnetic suppressive structure. The electromagnetic suppressive structure comprises a cover portion and an integrally formed conductive portion.

Abstract: The present invention relates to methods of immobilizing membrane-associated molecules within a sol-gel matrix. The membrane-associated molecule is embedded in the bilayer of a liposome. The molecule-liposome assembly remains functionally intact when it is immobilized within a protein and membrane-compatible sol-gel derived from polyol silane precursors or sodium silicate.

Abstract: The present invention provides a baffle for use with an electronic system including a wall, a first edge guide, and a second edge guide. The wall has a first edge and a second edge opposite the first. The first edge guide is connected to the wall and extends beyond the first edge of the wall. The second edge guide is connected to the wall and extends beyond the second edge of the wall. The first edge guide and the second edge guide are adapted to selectively associate with a first card guide and a second card guide of the modular electronic system. The baffle is adapted to manage airflow within the modular electronic system.

Abstract: The present invention provides a baffle for use with an electronic system including a wall, a first edge guide, and a second edge guide. The wall has a first edge and a second edge opposite the first. The first edge guide is connected to the wall and extends beyond the first edge of the wall. The second edge guide is connected to the wall and extends beyond the second edge of the wall. The first edge guide and the second edge guide are adapted to selectively associate with a first card guide and a second card guide of the modular electronic system. The baffle is adapted to manage airflow within the modular electronic system.

Abstract: The invention relates to the preparation of monolithic silica under mild conditions from alkoxysilanes derived from sugars, sugar acids, sugar alcohols and polysaccharides including glycerol, sorbitol, mannose and dextran. Unlike the commonly used silica starting material TEOS (Si(OEt)4), the sol-gel hydrolysis and cure of the sugar derivatives are not very sensitive to pH as similar rates of gelation were observed over a pH range of about 5.5-11. The morphology of the resulting silicas could be varied using specific additives, including multivalent ions and hydrophilic polymers.

Abstract: A vibration weld fixture assembly provides a three-piece component joined together with two separate welding operations. The vibration weld fixture assembly includes fixed upper and lower tools that support first and second component pieces, respectively. A center tool, movable relative to the upper and lower tools, moves a third component piece into engagement with one of the first or second component pieces for a first vibration weld operation. The center tool then moves the third component piece into engagement with the other of the first or second component pieces for a second vibration weld operation. A linear actuator assembly moves the center tool back and forth between the upper and lower tools.

Abstract: A semiconductor structure includes flip chips or other semiconductor devices that are mounted on printed circuit boards. The printed circuit boards are stacked to increase the circuit density of the semiconductor structure. The printed circuit boards include cavities or openings to accommodate the flip chips or semiconductor devices and thus reduce the overall size of the semiconductor structure. The flip chips or semiconductor devices from adjacent printed circuit boards may extend into the cavities or openings or simply occupy the cavities or openings from the same printed circuit board.

Abstract: A substrate cover assembly is disclosed. In one embodiment, the present invention is comprised of a cover element adapted to be removably-coupleable with a substrate. The present embodiment is further comprised of at least one openable portion coupled with the cover element. Beneficially, the openable portion is adapted to allow access to a portion of the substrate.

Abstract: A keyed filler panel with removably-coupleable airflow resistive filler card assembly is disclosed. In one embodiment, the present invention is comprised of a filler panel body. The present embodiment is further comprised of an airflow resistive filler portion removably-coupleable with said filler panel body. The airflow resistive filler portion adapted to couple with the filler panel body without additional hardware.

Abstract: An improved stacked-die package includes an interposer which improves the manufacturability of the package. A semiconductor package includes a package substrate having a plurality of bond pads; a first semiconductor device mounted on the package substrate, the first semiconductor device having a plurality of bond pads provided thereon; an interposer mounted on the first semiconductor device, the interposer having a first interposer bond pad and a second interposer bond pad, wherein the first and second interposer bond pads are electrically coupled; a second semiconductor device mounted on the interposer, the second semiconductor device having a plurality of bond pads provided thereon; a first bond wire connected to one of the plurality of bond pads on said first semiconductor and to the first interposer bond pad; and a second bond wire connected to the second interposer bond pad and to one of the plurality of bond pads on the semiconductor device.

Abstract: A semiconductor structure includes flip chips or other semiconductor devices that are mounted on printed circuit boards. The printed circuit boards are stacked to increase the circuit density of the semiconductor structure. The printed circuit boards include cavities or openings to accommodate the flip chips or semiconductor devices and thus reduce the overall size of the semiconductor structure. The flip chips or semiconductor devices from adjacent printed circuit boards may extend into the cavities or openings or simply occupy the cavities or openings from the same printed circuit board.

Abstract: Disclosed are silicone polymer based compounds, which include a hydrophobic silicone polymer backbone and a hydrophilic component. The hydrophilic component may act as a chelating agent to bind a metal. The hydrophilic component may be hydrophilic prior to binding with a metal or after binding. Also disclosed are methods of making these compounds. The compounds are useful in a variety of applications.

Abstract: A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and a deformable structure connected to said substrate.

Abstract: A flow switch for use in tankless water heaters. The present invention is an activation flow switch for tankless water heaters. More specifically, the flow switch is comprised of polypropylene balls through which is inserted a magnet. The balls have a specific gravity less than water and are therefore buoyant. When flow through the water pipe commences, the flow switch raises in the flow switch cylinder thereby bringing the magnet into operative connection with a relay switch. The relay switch, once activated, signals to the water heater that hot water is required which in turn activates the heating elements of the water heater. Once the flow in the pipe subsides, the flow switch returns to its inactive position, thereby deactivating the water heater.

Abstract: A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and a deformable structure connected to said substrate. Also disclosed is a device comprising a circuit having an active side and a non-active side, a package enclosing the active side of the circuit and not enclosing a portion of the non-active side of the circuit, and a lead having a first end connected to the active side of the circuit via a lead-over-chip connection, and having a second end extending from the package. Also disclosed is a device comprising a circuit and a lead formed from a flexible conductor, with the lead having a first end connected to the circuit.

Abstract: A semiconductor structure includes flip chips or other semiconductor devices that are mounted on printed circuit boards. The printed circuit boards are stacked to increase the circuit density of the semiconductor structure. The printed circuit boards include cavities or openings to accommodate the flip chips or semiconductor devices and thus reduce the overall size of the semiconductor structure. The flip chips or semiconductor devices from adjacent printed circuit boards may extend into the cavities or openings or simply occupy the cavities or openings from the same printed circuit board.

Abstract: A semiconductor structure includes flip chips or other semiconductor devices that are mounted on printed circuit boards. The printed circuit boards are stacked to increase the circuit density of the semiconductor structure. The printed circuit boards include cavities or openings to accommodate the flip chips or semiconductor devices and thus reduce the overall size of the semiconductor structure. The flip chips or semiconductor devices from adjacent printed circuit boards may extend into the cavities or openings or simply occupy the cavities or openings from the same printed circuit board.

Abstract: A method of controlling connection of a transformer of an electric vehicle, such as a train locomotive, to an alternating voltage supply carried by a trolley wire, the object being to reduce the transformer inrush current on connection of the transformer to the supply. Movement of a pantograph of the vehicle is judiciously controlled from its lowered position to a raised position so that as the pantograph approaches the trolley wire an arc bridges the air gap between them to consistently connect the electrical transformer of the vehicle to the trolley wire when the voltage present on the wire is at or near its peak.

Abstract: Disclosed is a device comprising a circuit having an active side and a non-active side, a package enclosing the active side of the circuit and not enclosing a portion of the non-active side of the circuit, and a lead having a first end connected to the active side of the circuit via a lead-over-chip connection, and having a second end extending from the package. Also disclosed is a device comprising a circuit and a lead formed from a flexible conductor, with the lead having a first end connected to the circuit.

Abstract: A device comprising a circuit, a lead having a first end connected to the circuit and having a second end, and a deformable structure connected to the second end of the lead. The invention may be embodied on a circuit board, so that the circuit board includes a substrate and a deformable structure connected to said substrate. Also disclosed is a device comprising a circuit having an active side and a non-active side, a package enclosing the active side of the circuit and not enclosing a portion of the non-active side of the circuit, and a lead having a first end connected to the active side of the circuit via a lead-over-chip connection, and having a second end extending from the package. Also disclosed is a device comprising a circuit and a lead formed from a flexible conductor, with the lead having a first end connected to the circuit.