Abstract: Microelectronic devices and methods for manufacturing microelectronic devices are described herein. An embodiment of one such method includes attaching a plurality of singulated microelectronic dies to a removable support member with an active side of the individual dies facing toward the support member, depositing a flowable material onto the dies and a portion of the removable support member such that the flowable material covers a back side of the individual dies and is disposed between adjacent dies, and removing the support member from the active sides of the dies.

Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a method for forming a microelectronic device includes attaching a microelectronic die to a support member by forming an attachment feature on at least one of a back side of the microelectronic die and the support member. The attachment feature includes a volume of solder material. The method also includes contacting the attachment feature with the other of the microelectronic die and the support member, and reflowing the solder material to join the back side of the die and the support member via the attachment feature. In several embodiments, the attachment feature is not electrically connected to internal active structures of the die.

Abstract: An amperometric probe suitable for monitoring chlorine levels in water is described. The probe has low power consumption and maintenance requirements rendering it particularly suitable for long periods of operation in remote locations with portable power supplies.

Abstract: The disclosure includes methods for preparing organosilicon-containing 1,2,3-triazoles by reacting an organosilicon containing azide with an alkyne compound or an organosilicon containing alkyne with an azide compound under thermal reaction conditions.

Abstract: Microelectronic devices and methods for manufacturing microelectronic devices are described herein. An embodiment of one such method includes attaching a plurality of singulated microelectronic dies to a removable support member with an active side of the individual dies facing toward the support member, depositing a flowable material onto the dies and a portion of the removable support member such that the flowable material covers a back side of the individual dies and is disposed between adjacent dies, and removing the support member from the active sides of the dies.

Abstract: Signal modules and methods for electrically interfacing with an electronic device are provided. The signal module includes a dielectric and a conductor extending through a surface of the dielectric. The surface of the dielectric is located away from perpendicular relative to an axis of the conductor and is located based on an electromagnetic field produced as a result of a signal flowing through the conductor.

Abstract: Packaged semiconductor components, apparatus for packaging semiconductor devices, methods of packaging semiconductor devices, and methods of manufacturing apparatus for packaging semiconductor devices. One embodiment of an apparatus for packaging semiconductor devices comprises a first board having a front side, a backside, arrays of die contacts, arrays of first backside terminals electrically coupled to the die contacts, arrays of second backside terminals, and a plurality of individual package areas that have an array of the die contacts, an array of the first backside terminals, and an array of the second backside terminals.

Abstract: Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.

Abstract: The present invention includes polyol modified titanium compounds, their preparation and use in methods to make biomolecule compatible monolithic titania. The invention also includes the use of the biomolecule compatible monolithic titania in bioanalytic applications, for example in biosensors, chromatographic columns, microarrays and bioaffinity columns.

Abstract: Packaged semiconductor components, apparatus for packaging semiconductor devices, methods of packaging semiconductor devices, and methods of manufacturing apparatus for packaging semiconductor devices. One embodiment of an apparatus for packaging semiconductor devices comprises a first board having a front side, a backside, arrays of die contacts, arrays of first backside terminals electrically coupled to the die contacts, arrays of second backside terminals, and a plurality of individual package areas that have an array of the die contacts, an array of the first backside terminals, and an array of the second backside terminals.

Abstract: The present disclosure relates to water-soluble stable gold nanoparticles (AuNPs) and methods for making the same. The present disclosure also includes the use of AuNPs, for example, in biological, medical and environmental assays for the detection of analytes, as well as biological and medical imaging.

Abstract: Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.

Abstract: A cable routing device for installation on a post of a computing system board, includes a tube shaped main body having a hollow inner cavity. The main body includes a lower generally cylindrical portion having a first inner diameter sized to achieve a clearance fit over the post, and a flexible upper portion having a general shape of a truncated cone when in an unflexed condition, the flexible upper portion having slits arranged approximately opposite to each other thereby defining two sides to the flexible upper portion, the flexible upper portion having a second inner diameter proximate to a top of the flexible upper portion. When the flexible upper portion is in the unflexed condition, the second inner diameter is smaller than the first inner diameter and smaller than an effective diameter of the post, and when the two sides are flexed in an outward direction the device achieves a clearance fit over the post.

Abstract: A first router is configured for monitoring prescribed attributes of an active path connected to the first router, and supplying an update message to a second router, according to a prescribed routing protocol such as Enhanced Interior Gateway Routing Protocol (EIGRP), that specifies a detected change by the first router in at least one of the prescribed attributes of the connected active path. Hence, the second router, in response to receiving the update message, can update an internal topology table based on the detected change in the active path connected to the first router, and selectively adjust an internal routing table based on the detected change relative to queuing policies for prescribed data flows.

Abstract: Packaged microelectronic devices and methods for packaging microelectronic devices are disclosed herein. In one embodiment, a method of packaging a microelectronic device including a microelectronic die having a first side with a plurality of bond-pads and a second side opposite the first side includes forming a recess in a substrate, placing the microelectronic die in the recess formed in the substrate with the second side facing toward the substrate, and covering the first side of the microelectronic die with a dielectric layer after placing the microelectronic die in the recess. The substrate can include a thermal conductive substrate, such as a substrate comprised of copper and/or aluminum. The substrate can have a coefficient of thermal expansion at least approximately equal to the coefficient of thermal expansion of the microelectronic die or a printed circuit board.

Abstract: The present invention relates to a two-step method of preparing methylsilsequixane (MSQ) materials suitable for chromatographic applications comprising treating a MSQ precursor with a suitable acid followed by treatment with a suitable base under conditions to form a MSQ monolith suitable for chromatographic applications.

Abstract: Packaged microelectronic devices and methods for packaging microelectronic devices are disclosed herein. In one embodiment, a method of packaging a microelectronic device including a microelectronic die having a first side with a plurality of bond-pads and a second side opposite the first side includes forming a recess in a substrate, placing the microelectronic die in the recess formed in the substrate with the second side facing toward the substrate, and covering the first side of the microelectronic die with a dielectric layer after placing the microelectronic die in the recess. The substrate can include a thermal conductive substrate, such as a substrate comprised of copper and/or aluminum. The substrate can have a coefficient of thermal expansion at least approximately equal to the coefficient of thermal expansion of the microelectronic die or a printed circuit board.

Abstract: Infrared (IR) absorbing layers and microelectronic imaging units that employ such layers are disclosed herein. In one embodiment, a method of manufacturing a microelectronic imaging unit includes attaching an IR-absorbing lamina having a filler material to a backside die surface of an imager workpiece. An individual imaging die is singulated from the workpiece such that a section of the infrared-absorbing lamina remains attached to the individual imaging die. The individual imaging die is coupled to an interposer substrate with a portion of the IR-absorbing lamina positioned therebetween. In another embodiment, the IR-absorbing lamina is a die attach film and the filler material is carbon black.

Abstract: The present invention relates to novel silicon-based polymers, particularly silicon-based polymers having citrate groups, and their use as chelating agents, for forming and as stabilizers.