Abstract: The present invention relates to novel silicon-based polymers, particularly silicon-based polymers having citrate groups, and their use as chelating agents, for forming and as stabilizers.

Abstract: A photo-responsive delivery system useful to deliver a compound to a target site is provided. The system includes a physiologically compatible matrix crosslinked with a photo-responsive matrix cross-linking agent. A method of making the delivery system and a method of delivering a compound to a target site using the system are also provided.

Abstract: A cable routing device for installation on a post of a computing system board, includes a tube shaped main body having a hollow inner cavity. The main body includes a lower generally cylindrical portion having a first inner diameter sized to achieve a clearance fit over the post, and a flexible upper portion having a general shape of a truncated cone when in an unflexed condition, the flexible upper portion having slits arranged approximately opposite to each other thereby defining two sides to the flexible upper portion, the flexible upper portion having a second inner diameter proximate to a top of the flexible upper portion. When the flexible upper portion is in the unflexed condition, the second inner diameter is smaller than the first inner diameter and smaller than an effective diameter of the post, and when the two sides are flexed in an outward direction the device achieves a clearance fit over the post.

Abstract: Signal modules and methods for electrically interfacing with an electronic device are provided. The signal module includes a dielectric and a conductor extending through a surface of the dielectric. The surface of the dielectric is located away from perpendicular relative to an axis of the conductor and is located based on an electromagnetic field produced as a result of a signal flowing through the conductor.

Abstract: A video of a virtual world is created utilizing stored gameplay data and game states. The gameplay data is used to re-create a given gameplay sequence in order to create video of the gameplay sequence. The gameplay sequence may be re-created using enhanced graphics to create new video files from any number of visual perspectives.

Abstract: The present invention relates to methods of immobilizing membrane-associated molecules within a sol-gel matrix. The membrane-associated molecule is embedded in the bilayer of a liposome. The molecule-liposome assembly remains functionally intact when it is immobilized within a protein and membrane-compatible sol-gel derived from polyol silane precursors or sodium silicate. The activity and stability of the entrapped membrane-associated molecule was significantly improved in macroporous silica.

Abstract: A silicone polymer having a modified surface is described, wherein said modification consists of a covalently attached water soluble polymer bearing an activating group, wherein said activating group reacts with reactive functionalities on one or more biological molecules so that said one or more biological molecules become covalently attached to said silicone polymer. The modified silicones are reacted with biological molecules to make them more biocompatible for use in biodiagnostic, biosensor or bioaffinity applications, or for coatings for in vivo transplantation or for liners exposed to biological broths.

Abstract: Packaged semiconductor components, apparatus for packaging semiconductor devices, methods of packaging semiconductor devices, and methods of manufacturing apparatus for packaging semiconductor devices. One embodiment of an apparatus for packaging semiconductor devices comprises a first board having a front side, a backside, arrays of die contacts, arrays of first backside terminals electrically coupled to the die contacts, arrays of second backside terminals, and a plurality of individual package areas that have an array of the die contacts, an array of the first backside terminals, and an array of the second backside terminals.

Abstract: Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.

Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a method for forming a microelectronic device includes attaching a microelectronic die to a support member by forming an attachment feature on at least one of a back side of the microelectronic die and the support member. The attachment feature includes a volume of solder material. The method also includes contacting the attachment feature with the other of the microelectronic die and the support member, and reflowing the solder material to join the back side of the die and the support member via the attachment feature. In several embodiments, the attachment feature is not electrically connected to internal active structures of the die.

Abstract: A packaged insulation product is provided comprising at least one insulation product oriented for storage or transportation and disposed in a package, wherein the package comprises a vapor-permeable membrane.

Abstract: Siliceous materials were prepared by adding one or more additives, including one or more water soluble polymers, and derivatives thereof, as well as trifunctional silanes, to sols containing tetraalkoxysilanes derived from polyols. The polymers facilitate phase separation of the growing silica gel matrix, leading to high surface area self-supporting silica gels with cure occurring at ambient temperatures. The materials also show a significant reduction in shrinkage properties and significant protein stabilization abilities.

Abstract: An airflow baffle apparatus for a forced-air cooled computer system is comprised of a linearly inflating airflow baffle bladder with a fixable surface and a topologically self-adjusting compliant surface. The linearly inflating airflow baffle bladder is couplable with the computer system. The fixable surface of the linearly inflating airflow baffle bladder is fixedly couplable to a first interior surface of the computer system. The topologically self-adjusting compliant surface of the linearly inflating airflow baffle bladder is couplable to an internal topology of the computer system in response to inflation of said linearly inflating airflow baffle bladder.

Abstract: Packaged microelectronic devices and methods for packaging microelectronic devices are disclosed herein. In one embodiment, a method of packaging a microelectronic device including a microelectronic die having a first side with a plurality of bond-pads and a second side opposite the first side includes forming a recess in a substrate, placing the microelectronic die in the recess formed in the substrate with the second side facing toward the substrate, and covering the first side of the microelectronic die with a dielectric layer after placing the microelectronic die in the recess. The substrate can include a thermal conductive substrate, such as a substrate comprised of copper and/or aluminum. The substrate can have a coefficient of thermal expansion at least approximately equal to the coefficient of thermal expansion of the microelectronic die or a printed circuit board.

Abstract: An individual single use capsule provides a tooth care product, such as toothpaste. The device comprises a non-resealable opening at one end to permit the product to be opened so that the tooth care product can be dispensed. The device preferably is made of a material that is compressible by the user so that the user can squeeze the tooth care product out of the device.

Abstract: A microelectronic device and method for manufacture. In one embodiment, two microelectronic substrates are directly bonded to each other without an intermediate adhesive material. For example, each microelectronic substrate can include a first surface, a second surface opposite the first surface, and a functional microelectronic feature coupled to a connection terminal of the microelectronic substrate. The connection terminals can be coupled to a support member, such as a leadframe or a printed circuit board, with the bond plane between the microelectronic substrates either aligned with or transverse to the support member. The microelectronic substrates can be enclosed in a protective packaging material that can include a transparent window to allow selected radiation to strike one or the other of the microelectronic substrates.

Abstract: The invention relates to the preparation of monolithic silica under mild conditions from alkoxysilanes derived from sugars, sugar acids, sugar alcohols and polysaccharides including glycerol, sorbitol, mannose and dextran. Unlike the commonly used silica starting material TEOS (Si(OEt)4), the sol-gel hydrolysis and cure of the sugar derivatives are not very sensitive to pH as similar rates of gelation were observed over a pH range of about 5.5-11. The morphology of the resulting silicas could be varied using specific additives, including multivalent ions and hydrophilic polymers.

Abstract: A microelectronic device and method for manufacture. In one embodiment, two microelectronic substrates are directly bonded to each other without an intermediate adhesive material. For example, each microelectronic substrate can include a first surface, a second surface opposite the first surface, and a functional microelectronic feature coupled to a connection terminal of the microelectronic substrate. The connection terminals can be coupled to a support member, such as a leadframe or a printed circuit board, with the bond plane between the microelectronic substrates either aligned with or transverse to the support member. The microelectronic substrates can be enclosed in a protective packaging material that can include a transparent window to allow selected radiation to strike one or the other of the microelectronic substrates.

Abstract: Embodiments of the present invention provide an electro-magnetic suppressive structure. The electro-magnetic suppressive structure comprises a cover portion and an integrally formed conductive portion.

Abstract: A vent apparatus is adapted to be mounted in an aperture formed in a fuel tank. The vent apparatus includes a vent controller sized to extend through the fuel tank aperture and an outer cover coupled to the vent controller and welded to the fuel tank to support the vent controller in the fuel tank aperture.