Abstract: A connection component for a microelectronic element includes a body of dielectric material having opposing first and second surfaces. A plurality of elongated leads extend through the body between the first and second surfaces. The leads have a first end accessible at the first surface and a second end accessible at the second surface. A layer of anisotropic conductive material overlies the first ends and the first surface of the body for electrical connection of the leads to a microelectronic element.

Abstract: A method is disclosed for making a microelectronic package. A material is applied to a first major surface of a microelectronic element to reduce the heights of protrusions projecting from the first major surface. The microelectronic element is assembled to a microelectronic component. A method of forming protrusions and an assembly incorporating the microelectronic element having protrusions is also disclosed.

Abstract: A method of manufacturing a plurality of microelectronic packages including electrically and/or thermally conductive elements. The method includes providing a support structure having a plurality of protrusions and depressions extending outwardly from the support. A conductive element is then mated to the support structure in a male-to-female relationship. The depressions formed in the support structure and conductive element are used to house a microelectronic element such as a semiconductor chip. A substrate is provided so as to cover substantially each depression located in the conductive element. Leads interconnect contacts to the chip to terminals on the substrate. A curable encapsulant material may be deposited into the depression so as to protect and support the leads and the microelectronic element. Additionally, the curable encapsulant material forms part of the exterior of a single resulting chip package once the assembly is diced and cut into individual packages.

Abstract: An electrical circuit tester for allowing a user to efficiently test electrical fixtures and switches. The electrical circuit tester includes a housing that has a plurality of prongs that extend from the housing. The prongs are adapted for engaging an electrical outlet of a building. A plurality of lights is coupled to the housing. The lights are lit in a pattern indicating a state of the electrical outlet. A speaker is coupled to the housing. The speaker is for creating an audible tone when the prongs engage the electrical outlet.

Abstract: Inductors are provided in chip assemblies such as in packaged semiconductor chips. The inductors may be incorporated in a chip carrier which forms part of the package, and may include, for example, spiral or serpentine inductors formed from traces on the chip carrier. The chip carrier may include a flap bearing the inductive element, and this flap may be bent to tilt the inductive element out of the plane of the chip carrier to reduce electromagnetic interaction between the inductive element and surrounding electrical components. Other inductors include solenoids formed in part by leads on the chip carrier as, for example, by displacing leads out of the plane of the chip carrier to form loops in vertically-extensive planes transverse to the plane of the chip carrier. Additional features provide trimming of the inductor to a desired inductance value during by breaking or connecting leads during assembly.

Abstract: A stacked microelectronic assembly comprises a plurality of subassemblies including folded substrates and at least one microelectronic element. The subassemblies are stacked substantially vertically.

Abstract: A connection component for a microelectronic element includes a body of dielectric material having opposing first and second surfaces. A plurality of elongated leads extend through the body between the first and second surfaces. The leads have a first end accessible at the first surface and a second end accessible at the second surface. A layer of anisotropic conductive material overlies the first ends and the first surface of the body for electrical connection of the leads to a microelectronic element.

Abstract: A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit board so as to provide enhanced thermal conductivity to the circuit board and electromagnetic shielding and a conductive enclosure which partially or completely surrounds the packaged chip to provide additional heat dissipation and shielding. The packaged unit may include both an active semiconductor chip and a passive element, desirably in the form of a chip, which includes resistors and capacitors. Inductors may be provided in whole or in part on the chip carrier. A module includes two circuits and an enclosure with a medial wall between the circuits to provide electromagnetic shielding between the circuits.

Abstract: A microelectronic assembly has a first microelectronic element, a second microelectronic element, and a structure which projects downwardly from the second microelectronic element and at least partially encompassing the first microelectronic element. The structure is at least partially flexible. A method of making a microelectronic assembly with a structure that is at least partially flexible is also disclosed.

Abstract: The subject of the invention is a load handling device for an industrial truck having a lift frame, a lift carriage which can be displaced along the lift frame, and a reach carriage guided so as to move on the lift carriage. A load pick-up device is arranged on the reach carriage. According to the invention, the lift carriage is guided on the outer sides of the lift frame by rollers, and the reach carriage is guided on the outer sides of the lift carriage. In order to displace the reach carriage, a hydraulic reach cylinder is provided on each side of the lift frame and is fixed at one end to the lift carriage and at the other end to the reach carriage.

Abstract: There is disclosed a co-oxidation method and a reagent system of co-oxidation agents for removing from a contaminated zone below the ground surface a water-immiscible organic compound having a density greater than that of water from a contaminated zone below the ground surface, comprising the steps of (a) injecting into the contaminated zone a solution of at least one inorganic permanganate salt, (b) injecting into the zone a cosolvent compatible with the inorganic permanganate salt, (c) causing reaction of the permanganate salt with the water-immiscible organic compound, and (d) extracting co-oxidant from the contaminated zone, thereby diminishing the level of water-immiscible organic compound present in the contaminated zone.

Abstract: A method of making a microelectronic package includes providing a substrate having a plurality of conductive leads at a first surface of the substrate. The conductive leads may have first ends permanently attached to the substrate and second ends remote from the terminal ends, the second ends being movable relative to the first ends of the leads. One or more microelectronic elements having contact bearing surfaces and back surfaces remote therefrom may be juxtaposed with the substrate and the contacts connected with the first ends of the leads. A substantially rigid plate may be attached to the back surfaces of the microelectronic elements. The substantially rigid plate may be moved to a precise height above the substrate to vertically extend the leads. While the plate is maintained at the precise height above the substrate, a spacer material is dispensed between the plate and the substrate. The spacer material is then at least partially cured for holding the plate at the precise height above the substrate.

Abstract: An industrial truck has a driving part, a load-receiving device, and at least one battery block located in the region of the driving part. At least one battery block can be removed from the driving part in the direction of one main driving direction of the industrial truck. Preferably, the battery block can be moved out of the driving part in the direction of the load-receiving device. Where the industrial truck incorporates a lifting framework, the battery block can be moved through a free space located between two pillars of the lifting framework. The industrial truck can be in the form of a reach truck.

Abstract: An improved bond ribbon design, said bond ribbon having a dual taper that functions to localize the bending along a predetermined distribution of the bond ribbon during the bonding of the bond ribbon to an associated contact of a semiconductor chip. Use of the dual-tapered bond ribbons during bonding provides a bonded bond ribbon having a form that is substantially s-shaped. The radii of curvature making out the curves of the s-shaped configuration can be predetermined and controlled by the length and taper of the individual tapered section. The improved bond ribbon further comprises an anchor pad, said anchor pad characterized by a large surface area that decreases the likelihood of delamination of it from a supporting dielectric structure.

Abstract: A process is provided for enhancing the reliability and consistency of effectiveness of an exogenous chemical substance applied to foliage of a plant, involving application of a phenyl-substituted olefin compound to the foliage, either sequentially or simultaneously with the exogenous chemical substance. Also provided are plant treatment and concentrate compositions comprising an exogenous chemical substance and a phenyl-substituted olefin compound.

Abstract: An enhanced subscriber line interface circuit for a digital switching system which includes a line configuration and protection circuit connection tot he subscriber line and to a thick-film hybrid module. The thick-film hybrid module comprises a high voltage interface circuit and a PCM conversion circuit. The high voltage interface circuit provides power to the subscriber line, converts received analog voice signals transmitted from the subscriber instrument into differential voltage voice signals and detects the subscriber lines status. The PCM conversion circuit is connected to the high voltage interface circuit and is disposed to convert received differential voice signals into PCM digital signals.

Abstract: A hybrid balance and combination codec filter circuit used in a subscriber line interface circuit over which a connection is established between a digital switching network and a subscriber instrument. The hybrid balance and combination codec filter circuit in combination includes a transmit section that converts differential voltage audio signals representing voice transmissions transmitted from the subscriber instrument into Pulse Code Modulated (PCM) encoded digital data, for transmission to the digital switching network. A receive section converts PCM encoded digital data representing voice signals switched through the digital switching network into differential voltage audio signals for transmission to the subscriber instrument. An included hybrid balance and echo cancellation section connected between the transmit section and the receive section reshapes the audio band signals output by the receive section.

Abstract: A ringing signal control circuit used in a Subscriber Line Interface Circuit (SLIC) for connecting a ringing signal bus to a subscriber loop. The ringing signal bus transmits ringing signals along the subscriber loop to a subscriber instrument. The SLIC includes a High Voltage Line Interface (HVLI) circuit connected to the subscriber loop and the ringing signal bus is connected to a ringing generator that provides a source of ringing signals. The ringing signal control circuit comprises a logic interface circuit connected via an address/data bus to a central controller that is arranged to receive ringing connection signals from the central controller and to generate a ringing activation signal. A ring timing circuit receives the ringing activation signal and generates a first and second output signals. The second output signal is transmitted from the ring timing circuit at a specific time interval subsequent to the first output signal.

Abstract: An enhanced high voltage line interface circuit for a digital switching system over which a connection is established between a digital switching system and a subscriber instrument via a subscriber loop. The high voltage line interface circuit includes in combination circuits that provide power to the subscriber loop and convert received analog voice signals transmitted from the subscriber instrument into differential voltage voice signals for subsequent conversion to digital data for use by the digital switching system. Additionally, differential voltage voice signals from the digital switching system are converted to analog voice signals for transmission along the subscriber loop to the subscriber instrument. The high voltage line interface circuit further includes circuits that detect and monitor the subscriber loop status and develop digital logic output signals that are used to report the status of the loop to a digital switching system controller.

Abstract: An over-current verifier circuit used in a Subscriber Line Interface Circuit (SLIC) for validating an over-current condition on a subscriber loop comprising a first counter connected to the SLIC disposed to receive an oversense signal from the SLIC. The first counter begins counting when the oversense signal is received and produces an output signal when the oversense signal is still active after the counter finishes, denoting a dc over-current in the subscriber loop. A timer circuit connected to the SLIC also receives the oversense signal. The timer is arranged to begin counting when the oversense signal is received. A second counter further receives the oversense signal and is advanced by one count on the high to low transition of the oversense signal. The second counter produces an output signal when three counter advances are produced before the timer times out, denoting an ac over-current condition.