Patents by Inventor Michael K. Gallagher

Michael K. Gallagher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TOUGHENED ARYLCYCLOBUTENE POLYMERS
    Publication number: 20160297985
    Abstract: Arylcyclobutene polymers having improved toughness are provided. Compositions and methods for coating arylcyclobutene polymers having improved toughness are also provided.
    Type: Application
    Filed: February 29, 2016
    Publication date: October 13, 2016
    Inventors: Zhifeng BAI, Michael K. GALLAGHER, Zidong WANG, Christopher J. TUCKER, Matthew T. BISHOP, Elissei IAGODKINE, Mark S. OLIVER
  • Arylcyclobutenes
    Patent number: 9441055
    Abstract: Arylclobutene-containing multi-functional monomers are useful in the preparation of arylcyclobutene-based polymer coatings. Compositions comprising one or more arylclobutene-containing multi-functional monomers and one or more oligomers comprising as polymerized units one or more arylcyclobutene monomer provide arylcyclobutene-based polymer coatings having reduced stress. Such compositions are useful in the manufacture of electronic devices.
    Type: Grant
    Filed: September 18, 2015
    Date of Patent: September 13, 2016
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC, Rohm and Haas Company
    Inventors: Duane R. Romer, Matthew M. Yonkey, Michael K. Gallagher, Kevin Y. Wang, Xiang Qian Liu, Raymond J. Thibault, Kim S. Ho, Gregory D. Prokopowicz, Corey O'Connor, Elissei Iagodkine, Robert K. Barr
  • EPHEMERAL BONDING
    Publication number: 20160257861
    Abstract: Compositions containing an adhesive material, a release additive and a copper passivation agent are suitable for temporarily bonding two surfaces, such as a semiconductor substrate active side and a carrier substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate having a copper surface is desired.
    Type: Application
    Filed: March 3, 2015
    Publication date: September 8, 2016
    Inventors: Mark S. OLIVER, Zhifeng BAI, Michael K. GALLAGHER
  • COATING COMPOSITIONS FOR PHOTOLITHOGRAPHY
    Publication number: 20160223911
    Abstract: In a first aspect, methods are provided that comprise: (a) applying a curable composition on a substrate; (b) applying a hardmask composition above the curable composition; (c) applying a photoresist composition layer above the hard mask composition, wherein one or more of the compositions are removed in an ash-free process. In a second aspect, methods are provided that comprise (a) applying an organic composition on a substrate; (b) applying a photoresist composition layer above the organic composition, wherein the organic composition comprises a material that produce an alkaline-soluble group upon thermal and/or radiation treatment. Related compositions also are provided.
    Type: Application
    Filed: April 13, 2016
    Publication date: August 4, 2016
    Inventors: Anthony Zampini, Michael K. Gallagher, Owendi Ongayi
  • EPHEMERAL BONDING
    Publication number: 20160122602
    Abstract: Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer.
    Type: Application
    Filed: January 12, 2016
    Publication date: May 5, 2016
    Inventors: Mark S. OLIVER, Michael K. GALLAGHER, Karen R. BRANTL
  • EPHEMERAL BONDING
    Publication number: 20160122601
    Abstract: Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.
    Type: Application
    Filed: January 11, 2016
    Publication date: May 5, 2016
    Inventors: Zhifeng BAI, Mark S. OLIVER, Michael K. GALLAGHER, Christopher J. TUCKER, Karen R. BRANTL, Elissei IAGODKINE, Zidong WANG
  • Coating compositions for photolithography
    Patent number: 9323154
    Abstract: In a first aspect, methods are provided that comprise: (a) applying a curable composition on a substrate; (b) applying a hardmask composition above the curable composition; (c) applying a photoresist composition layer above the hard mask composition, wherein one or more of the compositions are removed in an ash-free process. In a second aspect, methods are provided that comprise (a) applying an organic composition on a substrate; (b) applying a photoresist composition layer above the organic composition, wherein the organic composition comprises a material that produce an alkaline-soluble group upon thermal and/or radiation treatment. Related compositions also are provided.
    Type: Grant
    Filed: April 11, 2007
    Date of Patent: April 26, 2016
    Assignee: Rohm and Haas Electronic Materials, LLC
    Inventors: Anthony Zampini, Michael K. Gallagher, Owendi Ongayi
  • Ephemeral bonding
    Patent number: 9315696
    Abstract: Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: April 19, 2016
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Zhifeng Bai, Mark S. Oliver, Michael K. Gallagher, Christopher J. Tucker, Karen R. Brantl, Elissei Iagodkine, Zidong Wang
  • Toughened arylcyclobutene polymers
    Patent number: 9296915
    Abstract: Arylcyclobutene polymers having improved toughness are provided. Compositions and methods for coating arylcyclobutene polymers having improved toughness are also provided.
    Type: Grant
    Filed: April 10, 2015
    Date of Patent: March 29, 2016
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Zhifeng Bai, Michael K. Gallagher, Zidong Wang, Christopher J. Tucker, Matthew T. Bishop, Elissei Lagodkine, Mark S. Oliver
  • Adhesion promoter
    Patent number: 9273215
    Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: March 1, 2016
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Zidong Wang, Michael K. Gallagher, Kevin Y. Wang, Gregory P. Prokopowicz
  • Ephemeral bonding
    Patent number: 9269623
    Abstract: Compositions containing an adhesive material and a release additive are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a component, such as an active wafer, is temporarily bonded to a substrate, followed by further processing of the active wafer.
    Type: Grant
    Filed: October 22, 2013
    Date of Patent: February 23, 2016
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Mark S. Oliver, Michael K. Gallagher, Karen R. Brantl
  • ADHESION PROMOTER
    Publication number: 20160040021
    Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate.
    Type: Application
    Filed: October 26, 2015
    Publication date: February 11, 2016
    Inventors: Zidong WANG, Michael K. GALLAGHER, Kevin Y. WANG, Gregory P. PROKOPOWICZ
  • Adhesion promoter
    Patent number: 9153357
    Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed amino-alkoxysilane having a protected amino moiety. These compositions are useful in methods of improving the adhesion of coating compositions to a substrate, such as an electronic device substrate.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: October 6, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Michael K. Gallagher, Joseph F. Lachowski, Gregory P. Prokopowicz, Zidong Wang
  • ADHESION PROMOTER
    Publication number: 20150279512
    Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed amino-alkoxysilane having a protected amino moiety. These compositions are useful in methods of improving the adhesion of coating compositions to a substrate, such as an electronic device substrate.
    Type: Application
    Filed: March 2, 2015
    Publication date: October 1, 2015
    Inventors: Michael K. GALLAGHER, Joseph F. LACHOWSKI, Gregory P. PROKOPOWICZ, Zidong WANG
  • ADHESION PROMOTER
    Publication number: 20150279511
    Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed amino-alkoxysilane having a protected amino moiety. These compositions are useful in methods of improving the adhesion of coating compositions to a substrate, such as an electronic device substrate.
    Type: Application
    Filed: March 27, 2014
    Publication date: October 1, 2015
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Michael K. GALLAGHER, Joseph F. LACHOWSKI, Gregory P. PROKOPOWICZ, Zidong WANG
  • Adhesion promoter
    Patent number: 9136037
    Abstract: Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed amino-alkoxysilane having a protected amino moiety. These compositions are useful in methods of improving the adhesion of coating compositions to a substrate, such as an electronic device substrate.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: September 15, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Michael K. Gallagher, Joseph F. Lachowski, Gregory P. Prokopowicz, Zidong Wang
  • EPHEMERAL BONDING
    Publication number: 20150118488
    Abstract: Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.
    Type: Application
    Filed: October 31, 2013
    Publication date: April 30, 2015
    Inventors: Zhifeng BAI, Mark S. OLIVER, Michael K. GALLAGHER, Christopher J. TUCKER, Karen R. BRANTL, Elissei IAGODKINE, Zidong WANG
  • COATING COMPOSITIONS
    Publication number: 20150072290
    Abstract: In one aspect, coating compositions are provided that comprise a component a component that comprises one or more silicon, antimony, aluminum, yttrium, cerium, lanthanum, tin, titanium, zirconium, hafnium, indium or zinc compounds. In another aspect, coating compositions are provided that comprise a plurality of discrete particles. Preferred coating compositions of the invention are useful for antireflective purposes, particularly with an underlaying photoresist coating layer, as well as for a barrier layer in immersion lithography.
    Type: Application
    Filed: November 17, 2014
    Publication date: March 12, 2015
    Inventors: Gregory P. Prokopowicz, Michael K. Gallagher
  • PRE-APPLIED UNDERFILL
    Publication number: 20150064851
    Abstract: Underfill structures useful as pre-applied underfill materials comprise a polymer layer having a first polymer region and a second polymer region, wherein the second polymer region comprises inorganic filler. Electronic assemblies comprising a chip or die and a substrate are formed using such multi-layer structured pre-applied underfill.
    Type: Application
    Filed: September 3, 2013
    Publication date: March 5, 2015
    Inventors: Michael K. GALLAGHER, Edgardo ANZURES, David FLEMING, Avin V. DHOBLE, Chi Q. TRUONG, Anupam CHOUBEY, Jeffrey M. CALVERT
  • Compositions and processes for immersion lithography
    Patent number: 8911927
    Abstract: The present invention relates to barrier layer compositions that are applied above a photoresist composition for immersion lithography processing. In a further aspect, new methods are provided for immersion lithography processing.
    Type: Grant
    Filed: August 24, 2010
    Date of Patent: December 16, 2014
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Michael K. Gallagher, Gerald B. Wayton, Gregory P. Prokopowicz, Stewart A. Robertson