Patents by Inventor Michael K. Gallagher

Michael K. Gallagher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polymer synthesis and films therefrom
    Patent number: 6903175
    Abstract: Disclosed are methods of preparing solution polymers and compositions derived therefrom.
    Type: Grant
    Filed: September 22, 2001
    Date of Patent: June 7, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Robert H. Gore, Michael K. Gallagher, Yujian You
  • Stable composition
    Patent number: 6852367
    Abstract: Disclosed are stable organo polysilica resin composition containing a B-staged organo polysilica resin and an organic acid, methods of stabilizing such B-staged organo polysilica resin compositions and methods of manufacturing electronic devices using such stable compositions.
    Type: Grant
    Filed: July 12, 2002
    Date of Patent: February 8, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Yujian You, Robert H. Gore, Michael K. Gallagher
  • Electronic device manufacture
    Publication number: 20040161922
    Abstract: Disclosed are methods of manufacturing electronic devices, particularly integrated circuits. Such methods include the use of low dielectric constant material prepared by using a removable porogen material.
    Type: Application
    Filed: February 19, 2004
    Publication date: August 19, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Michael K. Gallagher, Yujian You
  • Air gap formation
    Publication number: 20040137728
    Abstract: A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.
    Type: Application
    Filed: September 13, 2003
    Publication date: July 15, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Michael K. Gallagher, Dana A. Gronbeck, Timothy G. Adams, Jeffrey M. Calvert
  • Electronic device manufacture
    Publication number: 20040130032
    Abstract: A method for manufacturing electronic devices using multiple layers of pre-porous dielectric materials that are made porous subsequent to etching and metal filling of apertures is provided. The pre-porous layers may be made porous sequentially or during a single processing step. Such pre-porous dielectric layers are selected not only to provide low dielectric constants after being made porous, but also to provide a difference in etch rates. Structures having such multiple layers of pre-porous dielectric layers are also provided.
    Type: Application
    Filed: September 24, 2003
    Publication date: July 8, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Dana A. Gronbeck, Michael K. Gallagher, Jeffrey M. Calvert, Timothy G. Adams
  • Dielectric materials
    Publication number: 20040109950
    Abstract: Organic polysilica materials containing one or more silicon-containing cross-linking agents having improved modulus and low dielectric constants and methods of preparing such materials are provided. These materials are useful in the manufacture of devices, such as electronic or optoelectronic devices, requiring low dielectric constant materials having good mechanical properties.
    Type: Application
    Filed: September 13, 2003
    Publication date: June 10, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Timothy G. Adams, Gregory P. Prokopowicz, Dana A. Gronbeck, Michael K. Gallagher
  • Electronic device manufacture
    Publication number: 20040052948
    Abstract: Treatment procedures for organic polysilica layers are provided that improve the adhesion of layers of material that are subsequently applied to the treated organic polysilica layers. In particular, layers of organic polymeric material have improved adhesion to such treated organic polysilica layers. These treatment procedures are particularly useful in the manufacture of electronic devices, such as integrated circuits, wherein the organic polysilica layers are used as dielectric materials, cap layers, etch stops and the like.
    Type: Application
    Filed: June 3, 2003
    Publication date: March 18, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Dana A. Gronbeck, Michael K. Gallagher, Jeffrey M. Calvert, Christopher P. Sullivan
  • Electronic device manufacture
    Publication number: 20040033700
    Abstract: Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits.
    Type: Application
    Filed: June 3, 2003
    Publication date: February 19, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Dana A. Gronbeck, Michael K. Gallagher, Jeffrey M. Calvert, Gregory P. Prokopowicz, Timothy G. Adams
  • Electronic device manufacture
    Patent number: 6667147
    Abstract: Disclosed are methods of manufacturing electronic devices, particularly integrated circuits. Such methods include the use of low dielectric constant material prepared by using a removable porogen material.
    Type: Grant
    Filed: November 7, 2002
    Date of Patent: December 23, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Michael K. Gallagher, Yujian You
  • Test method
    Publication number: 20030224544
    Abstract: Methods for determining the extent and nature of porosity in dielectric materials, particularly in thin dielectric films, using electrochemical impedance spectroscopy are disclosed. Such methods are useful in the manufacture of integrated circuits having porous dielectric layers.
    Type: Application
    Filed: December 5, 2002
    Publication date: December 4, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Alfred John Prisco, Carleton James Barbour, Yujian You, Michael K. Gallagher, Kai Hu
  • Electronic device manufacture
    Publication number: 20030186168
    Abstract: Disclosed are methods of manufacturing electronic devices, particularly integrated circuits. Such methods include the use of low dielectric constant material prepared by using a removable porogen material.
    Type: Application
    Filed: March 22, 2003
    Publication date: October 2, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Michael K. Gallagher, Yujian You
  • Electronic device manufacture
    Publication number: 20030186169
    Abstract: Disclosed are methods of manufacturing electronic devices, particularly integrated circuits. Such methods include the use of low dielectric constant material prepared by using a removable porogen material.
    Type: Application
    Filed: March 22, 2003
    Publication date: October 2, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Michael K. Gallagher, Yujian You
  • Porous materials
    Patent number: 6602804
    Abstract: Porous dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous dielectric materials. Also disclosed are methods of forming integrated circuits containing such porous dielectric materials.
    Type: Grant
    Filed: July 1, 2002
    Date of Patent: August 5, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Craig S. Allen, Nikoi Annan, Robert M. Blankenship, Michael K. Gallagher, Robert H. Gore, Angelo A. Lamola, Yujian You
  • Antireflective porogens
    Patent number: 6599951
    Abstract: Disclosed are organo polysilica dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous organo polysilica dielectric materials. Also disclosed are methods of forming electronic devices containing such porous organo polysilica dielectric materials without the use of antireflective coatings.
    Type: Grant
    Filed: May 24, 2002
    Date of Patent: July 29, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Anthony Zampini, Michael K. Gallagher
  • Antireflective porogens
    Patent number: 6596405
    Abstract: Disclosed are organo polysilica dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous organo polysilica dielectric materials. Also disclosed are methods of forming electronic devices containing such porous organo polysilica dielectric materials without the use of antiretlective coatings.
    Type: Grant
    Filed: July 11, 2002
    Date of Patent: July 22, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Anthony Zampini, Michael K. Gallagher
  • Electronic device manufacture
    Patent number: 6596467
    Abstract: Disclosed are methods of manufacturing electronic devices, particularly integrated circuits. Such methods include the use of low dielectric constant material prepared by using a removable porogen material.
    Type: Grant
    Filed: September 8, 2001
    Date of Patent: July 22, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Michael K. Gallagher, Yujian You
  • Antireflective porogens
    Patent number: 6576681
    Abstract: Disclosed are organo polysilica dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous organo polysilica dielectric materials. Also disclosed are methods of forming electronic devices containing such porous organo polysilica dielectric materials without the use of antireflective coatings.
    Type: Grant
    Filed: October 11, 2001
    Date of Patent: June 10, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Anthony Zampini, Michael K. Gallagher
  • Stable composition
    Publication number: 20030100644
    Abstract: Disclosed are stable organo polysilica resin composition containing a B-staged organo polysilica resin and an organic acid, methods of stabilizing such B-staged organo polysilica resin compositions and methods of manufacturing electronic devices using such stable compositions.
    Type: Application
    Filed: July 12, 2002
    Publication date: May 29, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Yujian You, Robert H. Gore, Michael K. Gallagher
  • Electronic device manufacture
    Publication number: 20030059723
    Abstract: Disclosed are methods of manufacturing electronic devices, particularly integrated circuits. Such methods include the use of low dielectric constant material prepared by using a removable porogen material.
    Type: Application
    Filed: November 7, 2002
    Publication date: March 27, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Michael K. Gallagher, Yujian You
  • Antireflective porogens
    Publication number: 20030022953
    Abstract: Disclosed are organo polysilica dielectric materials having low dielectric constants useful in electronic component manufacture are disclosed along with methods of preparing the porous organo polysilica dielectric materials. Also disclosed are methods of forming electronic devices containing such porous organo polysilica dielectric materials without the use of antiretlective coatings.
    Type: Application
    Filed: July 11, 2002
    Publication date: January 30, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Anthony Zampini, Michael K. Gallagher