Patents by Inventor Michael K. Gallagher

Michael K. Gallagher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COATING COMPOSITIONS FOR PHOTORESISTS
    Publication number: 20110143281
    Abstract: In one aspect, the present invention relates to coating compositions that comprise a resin component, wherein the predominant portion of the resin component comprising one or more resins that are at least substantially free of fluorine. Coating compositions of the invention are useful as photoresist overcoat layers, including in immersion lithography processing.
    Type: Application
    Filed: August 17, 2010
    Publication date: June 16, 2011
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Deyan WANG, Peter Trefonas, III, Michael K. Gallagher
  • Compositions and processes for photolithography
    Patent number: 7955778
    Abstract: Overcoating layer compositions are provided that are applied above a photoresist composition including for immersion lithography processing as well as non-immersion imaging.
    Type: Grant
    Filed: May 19, 2009
    Date of Patent: June 7, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Michael K. Gallagher, Deyan Wang
  • COMPOSITIONS AND PROCESSES FOR IMMERSION LITHOGRAPHY
    Publication number: 20110123937
    Abstract: The present invention relates to barrier layer compositions that are applied above a photoresist composition for immersion lithography processing. In a further aspect, new methods are provided for immersion lithography processing.
    Type: Application
    Filed: August 24, 2010
    Publication date: May 26, 2011
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Michael K. GALLAGHER, Gerald B. Wayton, Gregory P. Prokopowicz, Stewart A. Robertson
  • ANTIREFLECTIVE HARD MASK COMPOSITIONS
    Publication number: 20100297539
    Abstract: The invention includes new organic-containing compositions that can function as an antireflective layer for an overcoated photoresist. Compositions of the invention also can serve effectively as a hard mask layer by exhibiting a sufficient plasma etch selectivity from an undercoated layer. Preferred compositions of the invention have a high Si content and comprise a blend of distinct resins.
    Type: Application
    Filed: October 20, 2009
    Publication date: November 25, 2010
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C.
    Inventors: Dana A. Gronbeck, Amy M. Kwok, Chi Q. Truong, Michael K. Gallagher, Anthony Zampini
  • Compositions and processes for immersion lithography
    Patent number: 7781141
    Abstract: The present invention relates to barrier layer compositions that are applied above a photoresist composition for immersion lithography processing. In a further aspect, new methods are provided for immersion lithography processing.
    Type: Grant
    Filed: July 1, 2005
    Date of Patent: August 24, 2010
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Michael K. Gallagher, Gerald B. Wayton, Gregory P. Prokopowicz, Stewart A. Robertson
  • Coating compositions for photoresists
    Patent number: 7776506
    Abstract: In one aspect, the present invention relates to coating compositions that comprise a resin component, wherein the predominant portion of the resin component comprising one or more resins that are at least substantially free of fluorine. Coating compositions of the invention are useful as photoresist overcoat layers, including in immersion lithography processing.
    Type: Grant
    Filed: January 8, 2007
    Date of Patent: August 17, 2010
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Deyan Wang, Peter Trefonas, III, Michael K. Gallagher
  • Electronic devices having air gaps
    Patent number: 7723850
    Abstract: A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.
    Type: Grant
    Filed: August 13, 2007
    Date of Patent: May 25, 2010
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Michael K. Gallagher, Dana A. Gronbeck, Timothy G. Adams, Jeffrey M. Calvert
  • Antireflective hard mask compositions
    Patent number: 7605439
    Abstract: The invention includes new organic-containing compositions that can function as an antireflective layer for an overcoated photoresist. Compositions of the invention also can serve effectively as a hard mask layer by exhibiting a sufficient plasma etch selectivity from an undercoated layer. Preferred compositions of the invention have a high Si content and comprise a blend of distinct resins.
    Type: Grant
    Filed: August 29, 2006
    Date of Patent: October 20, 2009
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Dana A. Gronbeck, Amy M. Kwok, Chi Q. Truong, Michael K. Gallagher, Anthony Zampini
  • Compositions and processes for photolithography
    Publication number: 20090233224
    Abstract: Overcoating layer compositions are provided that are applied above a photoresist composition including for immersion lithography processing as well as non-immersion imaging.
    Type: Application
    Filed: May 19, 2009
    Publication date: September 17, 2009
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Michael K. Gallagher, Deyan Wang
  • Coating compositions for use with an overcoated photoresist
    Publication number: 20090148789
    Abstract: In one aspect, the invention relates to silicon-containing organic coating compositions, particularly antireflective coating compositions, that contain a repeat unit wherein chromophore moieties such as phenyl are spaced from Si atom(s). In another aspect, silicon-containing underlayer compositions are provided that are formulated as a liquid (organic solvent) composition, where at least one solvent of the solvent component comprise hydroxy groups.
    Type: Application
    Filed: November 12, 2008
    Publication date: June 11, 2009
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: John P. Amara, Nicola Pugliano, Jin Wuk Sung, Michael K. Gallagher, Michael S. Castorano
  • Coating composition
    Publication number: 20080248331
    Abstract: The invention relates to organic coating compositions useful for photolithographic processes including the manufacture of semiconductors and other electronic devices. Compositions of the invention comprise component that comprise a nitrile-containing component, such as a resin component that contains nitrile moieties. Compositions of the invention are particularly useful as an underlayer material in two, three, four or more layer pattern forming processes.
    Type: Application
    Filed: April 7, 2008
    Publication date: October 9, 2008
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Michael K. Gallagher, Anthony Zampini
  • Coating compositions for photolithography
    Publication number: 20080073754
    Abstract: Underlying coating compositions are provided that comprise one or more resins comprising one or more modified imide groups. These coating compositions are particularly useful as antireflective layers for an overcoated photoresist layer. Preferred systems can be thermally treated to increase hydrophilicity of the composition coating layer to inhibit undesired intermixing with an overcoated organic composition layer, while rendering the composition coating layer removable with aqueous alkaline photoresist developer.
    Type: Application
    Filed: September 25, 2007
    Publication date: March 27, 2008
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Anthony Zampini, Michael K. Gallagher, Vipul Jain, Owendi Ongayi
  • Electronic device manufacture
    Patent number: 7294453
    Abstract: Disclosed are methods of manufacturing electronic devices, particularly integrated circuits. Such methods include the use of low dielectric constant material prepared by using a removable porogen material.
    Type: Grant
    Filed: February 19, 2004
    Date of Patent: November 13, 2007
    Assignee: Shipley Company, L.L.C.
    Inventors: Michael K. Gallagher, Yujian You
  • Coating compositions for photolithography
    Publication number: 20070238052
    Abstract: In a first aspect, methods are provided that comprise: (a) applying a curable composition on a substrate; (b) applying a hardmask composition above the curable composition; (c) applying a photoresist composition layer above the hard mask composition, wherein one or more of the compositions are removed in an ash-free process. In a second aspect, methods are provided that comprise (a) applying an organic composition on a substrate; (b) applying a photoresist composition layer above the organic composition, wherein the organic composition comprises a material that produce an alkaline-soluble group upon thermal and/or radiation treatment. Related compositions also are provided.
    Type: Application
    Filed: April 11, 2007
    Publication date: October 11, 2007
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Anthony Zampini, Michael K. Gallagher, Owendi Ongayi
  • Compositions and processes for photolithography
    Publication number: 20070212646
    Abstract: Overcoating layer compositions are provided that are applied above a photoresist composition including for immersion lithography processing as well as non-immersion imaging.
    Type: Application
    Filed: March 12, 2007
    Publication date: September 13, 2007
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Michael K. Gallagher, Deyan Wang
  • Air gap formation
    Patent number: 7256127
    Abstract: A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.
    Type: Grant
    Filed: September 13, 2003
    Date of Patent: August 14, 2007
    Assignee: Shipley Company, L.L.C.
    Inventors: Michael K. Gallagher, Dana A. Gronbeck, Timothy G. Adams, Jeffrey M. Calvert
  • Electronic device manufacture
    Patent number: 7163780
    Abstract: Disclosed are methods of manufacturing electronic devices, particularly integrated circuits. Such methods include the use of low dielectric constant material prepared by using a removable porogen material.
    Type: Grant
    Filed: March 22, 2003
    Date of Patent: January 16, 2007
    Assignee: Shipley Company, L.L.C.
    Inventors: Michael K. Gallagher, Yujian You
  • Electronic device manufacture
    Publication number: 20060073423
    Abstract: Electronic devices having a metal line-containing layer including an air gap region and a low-k dielectric material region where the air gap region includes a dense packing of metal lines is provided. Methods of forming such electronic devices are also provided.
    Type: Application
    Filed: October 3, 2005
    Publication date: April 6, 2006
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventor: Michael K. Gallagher
  • Electronic device manufacture
    Patent number: 7018678
    Abstract: Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits.
    Type: Grant
    Filed: June 3, 2003
    Date of Patent: March 28, 2006
    Assignee: Shipley Company, L.L.C.
    Inventors: Dana A. Gronbeck, Michael K. Gallagher, Jeffrey M. Calvert, Gregory P. Prokopowicz, Timothy G. Adams
  • Porous materials
    Patent number: 6998148
    Abstract: Porous thermoset dielectric materials having low dielectric constants useful in electronic component manufacture are provided along with methods of preparing the porous thermoset dielectric materials. Also provided are methods of forming integrated circuits containing such porous thermoset dielectric material.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: February 14, 2006
    Assignee: Shipley Company, L.L.C.
    Inventors: Yujian You, Nikoi Annan, Michael K. Gallagher, Robert H. Gore