Patents by Inventor Mike Brooks
Mike Brooks has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978162Abstract: Systems and methods applicable, for instance, to using continuous levels of detail (CLODs) in connection with computer graphic models. Distinct levels of detail (LODs) can be generated, floating point LOD (fLOD) values can be calculated, and interpolated LODs can be generated. Further, LOD display can occur.Type: GrantFiled: December 17, 2021Date of Patent: May 7, 2024Assignee: Take-Two Interactive Software, Inc.Inventors: John Brooks, Shawn Best, Alex Pepper, Mike Krazanowski, Douglas E. Snyder
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Patent number: 11070625Abstract: Dynamic management of concurrent client connections to a server is achieved by a server, in that the server monitors its load state and when the server's maximum permitted number of concurrent requests has been exceeded it reduces the clients' maximum numbers of permitted concurrent requests until such time as the overloading situation no longer persists. In this way, the capacity of each of multiple connections can be controlled by the server individually or as a group, wherein the control is dynamic, so that the client-server connections do not have to be accurately configured in advance.Type: GrantFiled: January 8, 2020Date of Patent: July 20, 2021Assignee: International Business Machines CorporationInventors: Mike Brooks, Alan Hollingshead, Julian Horn, Philip Wakelin
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Publication number: 20200145497Abstract: Dynamic management of concurrent client connections to a server is achieved by a server, in that the server monitors its load state and when the server's maximum permitted number of concurrent requests has been exceeded it reduces the clients' maximum numbers of permitted concurrent requests until such time as the overloading situation no longer persists. In this way, the capacity of each of multiple connections can be controlled by the server individually or as a group, wherein the control is dynamic, so that the client-server connections do not have to be accurately configured in advance.Type: ApplicationFiled: January 8, 2020Publication date: May 7, 2020Inventors: Mike Brooks, Alan Hollingshead, Julian Horn, Philip Wakelin
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Patent number: 10616346Abstract: Dynamic management of concurrent client connections to a server is achieved by a server, in that the server monitors its load state and when the server's maximum permitted number of concurrent requests has been exceeded it reduces the clients' maximum numbers of permitted concurrent requests until such time as the overloading situation no longer persists. In this way, the capacity of each of multiple connections can be controlled by the server individually or as a group, wherein the control is dynamic, so that the client-server connections do not have to be accurately configured in advance.Type: GrantFiled: July 28, 2017Date of Patent: April 7, 2020Assignee: International Business Machines CorporationInventors: Mike Brooks, Alan Hollingshead, Julian Horn, Philip Wakelin
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Patent number: 10574758Abstract: Dynamic management of concurrent client connections to a server is achieved by a server, in that the server monitors its load state and when the server's maximum permitted number of concurrent requests has been exceeded it reduces the clients' maximum numbers of permitted concurrent requests until such time as the overloading situation no longer persists. In this way, the capacity of each of multiple connections can be controlled by the server individually or as a group, wherein the control is dynamic, so that the client-server connections do not have to be accurately configured in advance.Type: GrantFiled: December 15, 2017Date of Patent: February 25, 2020Assignee: International Business Machines CorporationInventors: Mike Brooks, Alan Hollingshead, Julian Horn, Philip Wakelin
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Publication number: 20190037026Abstract: Dynamic management of concurrent client connections to a server is achieved by a server, in that the server monitors its load state and when the server's maximum permitted number of concurrent requests has been exceeded it reduces the clients' maximum numbers of permitted concurrent requests until such time as the overloading situation no longer persists. In this way, the capacity of each of multiple connections can be controlled by the server individually or as a group, wherein the control is dynamic, so that the client-server connections do not have to be accurately configured in advance.Type: ApplicationFiled: July 28, 2017Publication date: January 31, 2019Inventors: Mike Brooks, Alan Hollingshead, Julian Horn, Philip Wakelin
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Publication number: 20190037027Abstract: Dynamic management of concurrent client connections to a server is achieved by a server, in that the server monitors its load state and when the server's maximum permitted number of concurrent requests has been exceeded it reduces the clients' maximum numbers of permitted concurrent requests until such time as the overloading situation no longer persists. In this way, the capacity of each of multiple connections can be controlled by the server individually or as a group, wherein the control is dynamic, so that the client-server connections do not have to be accurately configured in advance.Type: ApplicationFiled: December 15, 2017Publication date: January 31, 2019Inventors: Mike Brooks, Alan Hollingshead, Julian Horn, Philip Wakelin
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Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers
Patent number: 8092734Abstract: Methods for forming and attaching covers to microelectronic imaging units, packaging microelectronic imagers at the wafer level, and microelectronic imagers having covers that protect the image sensor are disclosed herein. In one embodiment, a method includes providing a first substrate having a plurality of covers, the covers including windows comprising regions of the first substrate and stand-offs projecting from the windows. The method continues by providing a second substrate having a plurality of microelectronic dies with image sensors, integrated circuits electrically coupled to the image sensors, and terminals electrically coupled to the integrated circuits. The method includes assembling the covers with corresponding dies so that the windows are aligned with corresponding image sensors and stand-offs contact corresponding dies inboard of the terminals and outboard of the image sensors.Type: GrantFiled: May 13, 2004Date of Patent: January 10, 2012Assignee: Aptina Imaging CorporationInventors: Tongbi Jiang, J. Mike Brooks -
Patent number: 7600314Abstract: A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.Type: GrantFiled: September 1, 2005Date of Patent: October 13, 2009Assignee: Micron Technology, Inc.Inventors: Larry Kinsman, Mike Brooks, Warren M. Farnworth, Walter Moden, Terry Lee
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Publication number: 20080132006Abstract: Packaged microelectronic devices and methods for packaging microelectronic devices are disclosed herein. In one embodiment, a method of packaging a microelectronic device including a microelectronic die having a first side with a plurality of bond-pads and a second side opposite the first side includes forming a recess in a substrate, placing the microelectronic die in the recess formed in the substrate with the second side facing toward the substrate, and covering the first side of the microelectronic die with a dielectric layer after placing the microelectronic die in the recess. The substrate can include a thermal conductive substrate, such as a substrate comprised of copper and/or aluminum. The substrate can have a coefficient of thermal expansion at least approximately equal to the coefficient of thermal expansion of the microelectronic die or a printed circuit board.Type: ApplicationFiled: February 8, 2008Publication date: June 5, 2008Applicant: Micron Technology, Inc.Inventors: Tongbi Jiang, J. Mike Brooks
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Patent number: 7312101Abstract: Packaged microelectronic devices and methods for packaging microelectronic devices are disclosed herein. In one embodiment, a method of packaging a microelectronic device including a microelectronic die having a first side with a plurality of bond-pads and a second side opposite the first side includes forming a recess in a substrate, placing the microelectronic die in the recess formed in the substrate with the second side facing toward the substrate, and covering the first side of the microelectronic die with a dielectric layer after placing the microelectronic die in the recess. The substrate can include a thermal conductive substrate, such as a substrate comprised of copper and/or aluminum. The substrate can have a coefficient of thermal expansion at least approximately equal to the coefficient of thermal expansion of the microelectronic die or a printed circuit board.Type: GrantFiled: April 22, 2003Date of Patent: December 25, 2007Assignee: Micron Technology, Inc.Inventors: Tongbi Jiang, J. Mike Brooks
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Patent number: 7151013Abstract: A high density semiconductor package with thermally enhanced properties is described. The semiconductor package includes a pair of lead frames, each being attached to a respective semiconductor die. The dies are attached to respective lead frames via an adhering material, such as a tape. Further, the dies are each electrically connected to fingers of each lead frame. In one illustrated embodiment, the dies and portions of the fingers are encapsulated in such a way as to leave one surface of each die exposed. In another illustrated embodiment, heat dissipation for the semiconductor package occurs through exposed fingers of the lead frames which adhere semiconductor dies within a cavity located therebetween.Type: GrantFiled: October 1, 2002Date of Patent: December 19, 2006Assignee: Micron Technology, Inc.Inventors: David J. Corisis, Mike Brooks, Mark S. Johnson, Larry D. Kinsman
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Patent number: 7065868Abstract: A method is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.Type: GrantFiled: December 29, 2003Date of Patent: June 27, 2006Assignee: Micron Technology, Inc.Inventors: Larry Kinsman, Mike Brooks, Warren M. Farnworth, Walter Moden, Terry Lee
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Patent number: 7041537Abstract: A semiconductor component includes a semiconductor die, and an on board capacitor on the die for filtering transient voltages, spurious signals and power supply noise in signals transmitted to the die. The capacitor includes a first electrode in electrical communication with a first terminal contact for the component, and a second electrode in electrical communication with a second terminal contact for the component. The electrodes are separated by a dielectric layer and protected by an outer protective layer of the component. The capacitor can be fabricated using redistribution layers on a wafer containing multiple dice. The component can be used to construct systems such as multi chip packages and multi chip modules.Type: GrantFiled: November 25, 2003Date of Patent: May 9, 2006Assignee: Micron Technology, Inc.Inventors: Salman Akram, Mike Brooks
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Publication number: 20060048382Abstract: A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.Type: ApplicationFiled: September 1, 2005Publication date: March 9, 2006Inventors: Larry Kinsman, Mike Brooks, Warren Farnworth, Walter Moden, Terry Lee
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Patent number: 7002248Abstract: A semiconductor component includes a semiconductor die, and an on board capacitor on the die for filtering transient voltages, spurious signals and power supply noise in signals transmitted to the die. The capacitor includes a first electrode in electrical communication with a first terminal contact for the component, and a second electrode in electrical communication with a second terminal contact for the component. The electrodes are separated by a dielectric layer and protected by an outer protective layer of the component. The capacitor can be fabricated using redistribution layers on a wafer containing multiple dice. The component can be used to construct systems such as multi chip packages and multi chip modules.Type: GrantFiled: July 7, 2004Date of Patent: February 21, 2006Assignee: Micron Technology, Inc.Inventors: Salman Akram, Mike Brooks
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Patent number: 6975037Abstract: A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in electrical communication with the external contacts. The package also includes interconnects configured to provide separate electrical paths between die contacts (e.g., bond pads), and the conductors on the flex circuit.Type: GrantFiled: June 18, 2004Date of Patent: December 13, 2005Assignee: Micron Technology, Inc.Inventors: Warren M. Farnworth, Alan G. Wood, Mike Brooks
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Publication number: 20050189623Abstract: A computer system, a printed circuit board assembly, and a multiple die semiconductor assembly are provided comprising first and second semiconductor dies and an intermediate substrate. The first semiconductor die defines a first active surface including at least one conductive bond pad. The second semiconductor die defines a second active surface including at least one conductive bond pad. The intermediate substrate is positioned between the first active surface of the first semiconductor die and the second active surface of the second semiconductor die such that a first surface of the intermediate substrate faces the first active surface and such that a second surface of the intermediate substrate faces the second active surface. The first semiconductor die is electrically coupled to the intermediate substrate by at least one topographic contact extending from the first active surface to the first surface of the intermediate substrate. The intermediate substrate defines a passage there through.Type: ApplicationFiled: May 3, 2005Publication date: September 1, 2005Inventors: Salman Akram, Mike Brooks
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Patent number: 6924550Abstract: Packaged microelectronic devices and methods for assembling microelectronic devices are disclosed herein. In one embodiment, a method of assembling a microelectronic device having a die and an interposer substrate includes depositing a solder ball onto a ball-pad on the interposer substrate and molding a compound to form a casing around at least a portion of the die and the solder ball. The method can further include forming a first cover over a first surface of the interposer substrate with the compound and forming a second cover over a second surface opposite the first surface of the interposer substrate with the compound. The first cover can have a first volume and a first surface area and the second cover can have a second volume and a second surface area. The first and second volumes and the first and second surface areas can be at least approximately equal.Type: GrantFiled: April 5, 2004Date of Patent: August 2, 2005Assignee: Micron Technology, Inc.Inventors: David J. Corisis, Mike Brooks
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Publication number: 20050156297Abstract: A chip scale semiconductor package and a method for fabricating the package are provided. The package includes a semiconductor die and a flex circuit bonded to the face of the die. The flex circuit includes a polymer substrate with a dense array of external contacts, and a pattern of conductors in electrical communication with the external contacts. The package also includes interconnects configured to provide separate electrical paths between die contacts (e.g., bond pads), and the conductors on the flex circuit.Type: ApplicationFiled: January 21, 2005Publication date: July 21, 2005Inventors: Warren Farnworth, Alan Wood, Mike Brooks