Abstract: A writing pen, a signature recognition method, and a signature recognition system are provided. A non-writing end of the writing pen is equipped with a motion sensing device. The writing pen records a motion trajectory of the non-writing end when the writing pen writes on a plane writing trajectory generating device. When the motion trajectory and/or a plane writing trajectory pass a comparison, a signature comparison device determines that a signature is from a specific person.

Abstract: The present invention relates to an attachment device for micro devices, comprising a main body and an attachment member seat in connection with the main body. The main body provides a receiving space to accommodate a functional module element. The attachment member seat provides a cavity to accommodate at least one attachment member to attach the attachment device to an article. A wearable micro device comprising the functional module element and the attachment device is also disclosed.

Abstract: The present invention relates to an attachment device for micro devices, comprising a main body and an attachment member seat in connection with the main body. The main body provides a receiving space to accommodate a functional module element. The attachment member seat provides a cavity to accommodate at least one attachment member to attach the attachment device to an article. A wearable micro device comprising the functional module element and the attachment device is also disclosed.

Abstract: A local detection processing system includes a local detection processing device and at least two types of detectors. The detectors are disposed in an area for detecting properties or property changes of a specific target to generate a detection signal. The local detection processing device analyzes the detection signals and transmits the detection result to a processing center. The local detection processing device includes a detection information receiving unit receiving the detection signals generated by the at least two types of detectors; a memory unit recording codes of the at least two types of detectors, a format of the detection signal, information of the corresponding processing center and values of the detection signals; an information processing unit analyzing the received detection signals, determining a detection result whether to transmit the detection result and the processing center; and a communication unit connecting at least two processing centers.

Abstract: A portable information detection and processing device includes an information detection unit, for detecting information recorded by at least one functional element; a memory unit, for recording recognition data of the at least one functional element and information detected by the functional element; a display unit, for displaying the recognition data of the functional element and the information recorded by the functional element; and an information processing unit, connected to the information detection unit, the memory unit and the display unit, for processing the recognition data of the functional element and the information detected by the functional element, and controlling the information detection unit, the memory unit and the display unit.

Abstract: A manufacturing method of a wafer level chip scale package of an image-sensing module is provided. The method includes providing a wafer having a plurality of die regions, and a plurality of sensing units is formed on a surface of the wafer in each die region. A plurality of lens units is formed on the sensing units, wherein each lens unit includes a lens and an edge wall that are integrally formed. A light-shielding film is also formed on a surface of at least one edge wall of at least one lens units. A dicing process is then performed on the wafer to form a plurality of image sensor chips.

Abstract: A portable information detection and processing device includes an information detection unit, for detecting information recorded by at least one functional element; a memory unit, for recording recognition data of the at least one functional element and information detected by the functional element; a display unit, for displaying the recognition data of the functional element and the information recorded by the functional element; and an information processing unit, connected to the information detection unit, the memory unit and the display unit, for processing the recognition data of the functional element and the information detected by the functional element, and controlling the information detection unit, the memory unit and the display unit.

Abstract: A local detection processing system includes a local detection processing device and at least two types of detectors. The detectors are disposed in an area for detecting properties or property changes of a specific target to generate a detection signal. The local detection processing device analyzes the detection signals and transmits the detection result to a processing center. The local detection processing device includes a detection information receiving unit receiving the detection signals generated by the at least two types of detectors; a memory unit recording codes of the at least two types of detectors, a format of the detection signal, information of the corresponding processing center and values of the detection signals; an information processing unit analyzing the received detection signals, determining a detection result whether to transmit the detection result and the processing center; and a communication unit connecting at least two processing centers.

Abstract: The invented hybrid keyboard comprises: a main body, to provide an enclosing space; an input key assembly including at least one input key and a corresponding encoder, to generate predetermined signals in response to striking operations of said at least one input key; and an output module, to pick up said signals generated by said input key assembly and to output said signals; characterized in that said input key assembly further comprises a motion sensor, to generate predetermined signals in response to motions detected by said motion sensor.

Abstract: The hand-held displaying device comprises a displaying panel to display at least one color and its brightness, a motion sensor to detect motions of the motion sensor and a controller to control contents of displays in the displaying panel according to motions detected by the motion sensor. The displaying panel may include a plurality of displaying regions, each being able to display at least one color and its brightness and respectively controlled by the controller. The displaying device may provide a sound generating element and a loudspeaker. The controller may provide a memory space to record a series of displayed to be played back in a later time.

Abstract: An image-sensing module is provided. The image-sensing module includes a substrate, a plurality of image-sensing units, a plurality of micro lenses and a focusing unit. The image-sensing units are disposed on the substrate and the micro lenses are respectively disposed on one of the image-sensing units. The focusing unit is disposed on the substrate and covers the micro lenses. A top surface of the focusing unit is a curved surface. Furthermore, a method of manufacturing the image-sensing module and an image capture apparatus are provided.

Abstract: A manufacturing method of a wafer level chip scale package of an image-sensing module is provided. The method includes providing. a wafer having a plurality of die regions, and a plurality of sensing units is formed on a surface of the wafer in each die region. A plurality of lens units is formed on the sensing units, wherein each lens unit includes a lens and an edge wall that are integrally formed. A light-shielding film is also formed on a surface of at least one edge wall of at least one lens units. A dicing process is then performed on the wafer to form a plurality of image sensor chips.

Abstract: A chip package is disclosed. The chip package comprises a chip, a plurality of bond pads, a plurality of connecting lines and a rigid cover. The chip has a plurality of recesses arranged along at least an edge of the chip and also has an active surface and a backside. The bond pads are disposed on the active surface and the bond pads are arranged to be corresponding to the recesses respectively. The connecting lines are disposed on surfaces of the recesses respectively at the edge of the chip. For each of the connecting lines, a first end of the connecting line is connected to one of the bond pads and a second end of the connecting line extends to the backside to be a terminal pad. The rigid cover is located on the active surface without covering the bond pads on the active surface.

Abstract: A controlling system for illumination of a golf course and a controlling method thereof are provided. The illumination controlling system is used for a golf course that has multiple holes. The illumination controlling system has multiple groups of lighting modules respectively corresponding to the multiple holes. Each group of lighting module comprises a plurality of light-emitting devices, a plurality of power devices having control circuit units and chargeable batteries, a plurality of solar panels, and a plurality of motion sensors. Each chargeable battery provides a first working voltage for each light-emitting device. Each control circuit unit connects electrically to utility power to supplies a second working voltage for each light-emitting device. Each motion sensor connects electrically with the control circuit unit of each power device for switching each light-emitting device. The controlling system and method are provided for saving energy of golf course.

Abstract: A chip packaging process includes providing a wafer, having an active surface and a backside. The wafer has a first chip area and a second chip area adjacent to the first chip area. The wafer has several first and second bond pads on the active surface in the first and second chip areas respectively. Several through holes are formed on the wafer. The through holes pass through the wafer and connect the active surface and the backside. The through. holes are arranged between the first chip area and the second chip area. Several connecting lines are formed on peripheral surfaces of the through holes. Each of the connecting lines has a first end portion extending on the active surface and a second portion extending on the backside. Each the first end portion is electrically connected to one of the first bond pads and one of the second bond pads.

Abstract: A processing unit includes a processing core and a wireless module directly connected to the processing core, wherein the wireless module is for providing wireless communications to the processing core. A multi-processor system includes a first processing unit having a first processing core and a first wireless module directly connected to the first processing core, the first wireless module for providing wireless communications to the first processing core; a second processing unit having a second processing core and a second wireless module directly connected to the second processing core, the second wireless module for providing wireless communications to the second processing core; and a wireless link between the first and second wireless modules; wherein the first processing unit is for communicating with the second processing unit via the wireless link.

Abstract: An integrated audio/video sensor is provided. The integrated sensor comprises an image-receiving module for sensing a light of an image, a sound-receiving module for sensing a sound and a signal-transforming module for integrating image and sound signals into an audio/video signal. The integrated sensor integrates image and sound together simultaneously and synchronously. Furthermore, the integrated sensor can be connected directly to an image-processing system. The integrated sensor not only provides excellent synchronization of audio and video signals, but also reduces the size and cost of producing the integrated sensor as well.

Abstract: An image-sensing module is provided. The image-sensing module includes a substrate, a plurality of image-sensing units, a plurality of micro lenses and a focusing unit. The image-sensing units are disposed on the substrate and the micro lenses are respectively disposed on one of the image-sensing units. The focusing unit is disposed on the substrate and covers the micro lenses. A top surface of the focusing unit is a curved surface. Furthermore, a method of manufacturing the image-sensing module and an image capture apparatus are provided.

Abstract: The chip package and the process thereof are disclosed. The chip package comprises a chip and a rigid cover. The chip has a plurality of bond pads formed thereon. The rigid cover is located on the chip and has a plurality of openings formed therein, wherein the openings expose the bond pads on the chip respectively.

Abstract: A chip packaging process includes providing a wafer, having an active surface and a backside. The wafer has a first chip area and a second chip area adjacent to the first chip area. The wafer has several first and second bond pads on the active surface in the first and second chip areas respectively. Several through holes are formed on the wafer. The through holes pass through the wafer and connect the active surface and the backside. The through. holes are arranged between the first chip area and the second chip area. Several connecting lines are formed on peripheral surfaces of the through holes. Each of the connecting lines has a first end portion extending on the active surface and a second portion extending on the backside. Each the first end portion is electrically connected to one of the first bond pads and one of the second bond pads.