Abstract: A method for correcting or hammering a deformation which occurs in the multi-channel optoelectronic module and is caused by a post welding shift. The multi-channel optoelectronic module has an optical fiber support member for supporting an optical fiber array. The method includes the steps of: assembling the multi-channel optoelectronic module by using a laser welding process; and forming at least one welded portion on a predetermined position of said optical fiber supporting member corresponding to the deformation to thereby recover the deformation by using a shrinkage effect of the welded portion.

Abstract: A bidirectional optical communication module using a single optical fiber is disclosed. The module includes an optical fiber having a cut-away surface polished to have an acute angle between the cut-away surface and an axis of the optical fiber, a semiconductor laser emitting a transmission light coupled with a light fiber core, and a bidirectional optical device having a light receiving portion absorbing a receiving light outputted from the light fiber core for thereby optically coupling a bidirectional optical device in which a light receiving device is integrated into a light transmitting semiconductor laser as a single chip and an optical fiber when fabricating an optical module for implementing a light signal transmission and receiving operation using one optical fiber.

Abstract: Disclosed is an integrated pass-transistor logic circuit which includes a conditional sum adder. This sum adder has seven sum generation blocks of module form and two carry generation blocks. With the sum adder, before carry propagation which is generated through multiplexer chain in respective sum generation blocks arrives at the final stage of the multiplexer chain, the final stage is driven by block carry signals BC.sub.i and /BC.sub.i provided from the respective carry generation blocks. The carry generation and the sum generation occur individually in the conditional sum adder. The sum generation blocks are constituted with pass-transistor logic and the carry generation blocks with Complementary Metal Oxide Semiconductor (CMOS) logic, the sum adder has a more faster operation speed and a more lower power dissipation, as compared with the prior art conditional sum adder having either the pass-transistor logic or the CMOS logic.

Abstract: Disclosed is a micromirror for a hybrid optoelectronic integrated circuit, a method for manufacturing the same, a micromirror-photodetector assembly and an assembly of hybrid optoelectronic integrated circuit for receiving light. The micromirror the present invention comprises a silicon substrate and at least one V-shaped groove formed in the silicon substrate and the V-shaped groove has an inclined surface reflecting light emitted from an optical waveguide to a photodetector. The alignment of the photodetector and the optical fibers is achieved without an additional attachment equipment, by inserting the optical fibers into the V-groove.

Abstract: A CMOS output buffer circuit includes a predriving circuit which generates two predriving signals, a main driving circuit which has a plurality of parallel connected pull-up transistors and a plurality of parallel connected pull-down transistors, and a sequential driving circuit which provides sequential pull-up and pull-down driving signals to the pull-up and pull-down transistors, respectively. The main driving circuit generates the output signal according to the sequential pull-up or pull-down driving signals, whereby the output signal is developed step by step into either the power supply potential or the ground potential. In the manner, any spike in the switching current is considerably mitigated, thereby reducing switching noise.

Abstract: An improved optical module having lenses aligned on a lens-positioning V-groove and a fabrication method thereof which includes a silicon substrate, which defines a light transfer path below a surface thereof, including light transferring V-grooves and a light receiving V-groove, and lens-positioning V-groove for determining the position of a lens, wherein two lens-positioning V-grooves are formed therein, an optical transmitter module including a laser which is a light source and is flip-chip-bonded to the substrate by a solder bump after an optical waveguide is previously aligned with the V-groove by using an alignment mark behind the vertical portion of the light transferring v-groove.

Abstract: The present invention relates to an accurate method using laser welding for mounting an optical focusing lens utilized in a semi-conductor laser module for optical transmission and optical amplification through an optical fiber and a laser module so produced. The laser module includes an aligned laser diode, a lens fixture mounting the laser diode, a focusing lens mounted within a lens housing which in turn is mounted by a lens ring to the lens fixture. In the method, the steps include aligning mutual positions between the laser diode and the optical focusing lens in the vertical and horizontal directions so that the magnitude of the optical signal output from the optical fiber is maximized after the distance between the optical focusing lens and the optical fiber is adjusted and fixed to obtain a maximum optical coupling efficiency between the laser diode and the optical fiber. Next a laser-welding step is performed at an interval between the lens housing and the lens ring.

Abstract: A package for a power semiconductor device is made using the method comprising the steps of preparing a lead frame including a blade or paddle for providing a semiconductor chip on a top surface thereof, tie bars for supporting said paddle, wherein said paddle being provided lower in horizontal surface than the leads; attaching a heat radiating plate on a bottom surface of the paddle by cladding; attaching a Kovar plate on the top surface of the paddle by soldering, said Kovar plate having similar heat expansion coefficient to that of the chip; providing the chip on the Kovar plate by soldering; wire-bonding terminals of said semiconductor chip to the corresponding leads of the lead frame, respectively; coating polyimide over the semiconductor chip by spin-coating; curing the polyimide coated thus; forming a metal cap above the said paddle by soldering, and injecting a molding material into a molder for enclosing the paddle and curing the molding material injected thus.

Abstract: A method of packaging a power semiconductor device is disclosed, comprising the steps of preparing a lead frame including a paddle for providing a semiconductor chip on a top surface thereof, tie bars for supporting said paddle, wherein said paddle being provided lower in horizontal surface than the leads; attaching a heat radiating plate on a bottom surface of the paddle by cladding; attaching a Kovar plate on the top surface of the paddle by soldering, said Kovar plate having similar heat expansion coefficient to that of the chip; providing the chip on the Kovar plate by soldering; wire-bonding terminals of said semiconductor chip to the corresponding leads of the lead frame, respectively; coating polyimide over the semiconductor chip by spin-coating; curing the polyimide coated thus; forming a metal cap above the said paddle by soldering, and injecting a molding material into a molder for enclosing the paddle and curing the molding material injected thus the method can be applied to produce a plastic packa

Abstract: A flat display device has a plurality of pixels and a plurality of micro light valves which correspond to each of the pixels thereof, and has a plurality of selection lines and data lines disposed in a matrix the micro light valves each comprise a data electrode to be connected with each of the data lines through a via, a selection electrode to be connected with each of the selection lines, a common electrode formed between the selection and data electrodes, a frame, and a shifting element capable of being moved in the frame by driving signals to be applied to the data and selection electrodes, so as to pass or shut off a light beam. A first driving means is connected to the respective selection lines, for supplying a predetermined selection signal for said light valves; and a second driving means is connected to the respective data lines, for supplying a predetermined data signal for said light valve.