Patents by Inventor Min Li

Min Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250128389
    Abstract: A control system for a power tool, comprising: a sensing unit configured to sense an operating characteristic of the power tool; a first control unit configured to determine whether the operating characteristic is within a safe operational range, and to output a first control signal at least partially based on said determination; a second control unit configured to determine whether the operating characteristic is within a safe operational range independently of the first control unit, and to output a second control signal at least partially based on said determination; and an output unit configured to receive the first and second control signals and to activate the power tool when the first and second control signals are received.
    Type: Application
    Filed: December 20, 2024
    Publication date: April 24, 2025
    Inventors: Yong Min LI, Li Hua XIE, Zhong Kang FANG, Ji Guang SUN
  • Publication number: 20250132161
    Abstract: A semiconductor integrated circuit (IC) device that includes an angled gate cut region, a first transistor associated with a first gate, and a second transistor associated with a second gate. The angled gate cut region may be angled such that its top surface area is nearest a boundary of the first transistor and its bottom surface area is nearest a boundary of the second transistor. The angled gate cut region may separate the first gate from the second gate and may further separate the source/drain regions of the first transistor from the source/drain regions of the second transistor. The angled gate cut region may provide for adequate frontside surface area of the first gate to which a frontside gate contact may connect and may further provide for adequate backside surface area of the second gate to which a backside gate contact may connect.
    Type: Application
    Filed: October 19, 2023
    Publication date: April 24, 2025
    Inventors: Min Gyu Sung, Juntao Li, Ruilong Xie, Julien Frougier, Chanro Park
  • Patent number: 12281285
    Abstract: This application discloses a detergent tablet free of SLS surfactant and its preparation method. The detergent tablet includes a film-forming agent, an anionic surfactant, a non-ionic surfactant, a chelating agent, an enzyme preparation, an auxiliary agent and a essence. The film-forming agent includes one or more of polyvinyl alcohol, cellulose, and dodecenyl succinate starch ester. The anionic surfactant includes at least two of sodium ?-olefin sulfonate, sodium fatty acid methyl ester sulfonate, and sodium hydroxyethyl sulfonate. The non-ionic surfactant includes at least two of fatty alcohol polyoxyethylene ethers, fatty acid methyl ester ethoxylate, and oil ethoxylate.
    Type: Grant
    Filed: October 9, 2024
    Date of Patent: April 22, 2025
    Assignee: Guangzhou Joyson Cleaning Products Co., Ltd.
    Inventors: Fenglei Li, Min Sun, Jieer Luo, Jieting Yan, Junli Li
  • Publication number: 20250125592
    Abstract: A distribution board system includes a chassis, a busway configuration, a first bridge switch and a first distribution device. The busway configuration is arranged outside the chassis and includes a first busway coupled to a first power supply and a second busway. The first bridge switch is arranged inside the chassis and configured to bridge the first busway and the second busway. The first distribution device is arranged inside the chassis and configured to be arranged at the second busway.
    Type: Application
    Filed: October 11, 2024
    Publication date: April 17, 2025
    Inventor: Min-Li Chen
  • Publication number: 20250125310
    Abstract: In some aspects, a package structure includes a substrate and semiconductor devices stacked over the substrate. The semiconductor devices are stacked along a first direction, and at least one of the semiconductor devices comprises one or more pads located on a side surface of the at least one of the semiconductor devices.
    Type: Application
    Filed: November 22, 2023
    Publication date: April 17, 2025
    Inventors: Daiyu LI, Mingkang ZHANG, Chengbao ZHOU, Min WEN, Zhen PAN, Shu WU
  • Publication number: 20250121082
    Abstract: An antibody or an antigen-binding fragment thereof that binds to CD228, and an antibody-drug conjugate containing the antibody or antigen-binding fragment thereof. The antibody or antigen-binding fragment thereof has a high affinity to a CD228 protein and an ability to mediate ADCC. The antibody-drug conjugate exhibits an inhibitory effect on various tumors. A nucleic acid encoding the antibody or antigen-binding fragment thereof; a cell containing the nucleic acid; a pharmaceutical composition containing the antibody or antigen-binding fragment thereof, the nucleic acid, the cell or the antibody-drug conjugate; and a kit. The use of the antibody or antigen-binding fragment thereof, the nucleic acid, the antibody-drug conjugate or the pharmaceutical composition in the prevention, treatment, detection or diagnosis of diseases related to CD228.
    Type: Application
    Filed: May 25, 2023
    Publication date: April 17, 2025
    Inventors: Deyong SONG, Jing HAN, Hong LIU, Nan SHEN, Jie JIAO, Qiaoping WANG, Jianxia FENG, Min LI, Mengqi ZONG, Ying LI, Changlin DOU
  • Publication number: 20250126768
    Abstract: A SRAM is provided that includes a first pull-up transistor having a first channel length, and a first pull-down transistor located adjacent to the first pull-up transistor and having a second channel length, wherein the second channel length is greater than the first channel length. The structure further includes a first backside contact structure contacting a first n-doped source/drain region of the first pull-down transistor, wherein the first backside contact structure has a first critical dimension that is constant throughout an entirety thereof, and a second backside contact structure having a vertical portion and a base portion. The vertical portion of the second backside contact structure directly contacts a first p-doped source/drain region of the first pull-up transistor and the base portion of the second backside contact structure has a second critical dimension that is greater than the first critical dimension.
    Type: Application
    Filed: October 11, 2023
    Publication date: April 17, 2025
    Inventors: Ruilong Xie, Chanro Park, Min Gyu Sung, Julien Frougier, Juntao Li
  • Publication number: 20250122640
    Abstract: The present disclosure provides a device and method for growing a crystal. A crystal preparation device includes a growth chamber, a heating component, and a filter component. The heating component includes at least one heating unit. The at least one heating unit is located in the growth chamber. The at least one heating unit is an inverted cone structure. An angle between a side surface of the inverted cone structure and an upper surface of the inverted cone structure is within a range of 5°-45°. The filter component is located in the growth chamber. An inner sidewall of the filter component is connected with the at least one heating unit. A gas phase channel is formed between an outer sidewall of the filter component and an inner sidewall of the growth chamber.
    Type: Application
    Filed: December 26, 2024
    Publication date: April 17, 2025
    Applicant: MEISHAN BOYA ADVANCED MATERIALS CO., LTD.
    Inventors: Yu WANG, Zhenxing LIANG, Min LI
  • Publication number: 20250126838
    Abstract: A method to co-integrate a metal trench cut for aggressively scaled contact tip-to-tip and wrap-around-contact formation is provided. A semiconductor device made from the method is also provided in which a metal trench cut region and wrap-around-contacts are present.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 17, 2025
    Inventors: Julien Frougier, Oleg Gluschenkov, Oscar van der Straten, Ruilong Xie, Juntao Li, Min Gyu Sung, Chanro Park
  • Patent number: 12276849
    Abstract: Disclosed is an optical module, including a circuit board, a thermally conductive substrate, a structural adhesive, a silicon photonic chip, a laser assembly, and a fiber array assembly coupled to the silicon photonic chip. The thermally conductive substrate includes a first surface, a second surface, and a first bearing seat, a second bearing seat and a third bearing seat disposed on the first surface and exposed from the opening of the circuit board. The area of the second surface is smaller than that of the first surface. Part of the first surface contacts the circuit board. The thermally conductive substrate is fixed to the circuit board by the structural adhesive. The silicon photonic chip is disposed on the first bearing seat, the laser assembly is disposed on the second bearing seat, and a joint of the fiber array assembly is disposed on the third bearing seat.
    Type: Grant
    Filed: December 5, 2022
    Date of Patent: April 15, 2025
    Assignee: DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
    Inventors: QianBing Yan, Min-Sheng Kao, ChunFu Wu, Yueh-Kuo Lin, LinChun Li, Chung-Hsin Fu
  • Patent number: 12279298
    Abstract: A service-level communication and computing collaborative resource allocation device and method for a large-scale satellite network are provided, the device includes: a network information management function module including a service request collection unit configured to collect service requests arriving at each satellite node in the network, and a network resource collection unit configured to collect available resource status information for each satellite node; a service preprocessing function module configured to preprocess service requests; a service feature extraction function module configured to perform feature extraction for preprocessed service requests to generate service demand features; a service order decision submodule configured to determine a service order of service requests; a service strategy decision submodule configured to output a service strategy of the service request.
    Type: Grant
    Filed: October 31, 2024
    Date of Patent: April 15, 2025
    Assignee: Xidian University
    Inventors: Di Zhou, Chenxi Bao, Min Sheng, Jiandong Li, Yan Shi, Weigang Bai, Sijing Ji, Yan Zhu
  • Patent number: 12279538
    Abstract: The present invention disclosures a phase change memory unit, wherein comprising from bottom to top: a bottom electrode, a heating electrode, a phase change unit and a top electrode, the phase change unit is a longitudinally arranged column, which comprises: a cylindrical selector layer, a circular barrier layer and a circular phase change material layer form inside to outside; wherein, the bottom electrode, the heating electrode and the circular phase change material layer are sequentially connected, and the selector layer is connected to the top electrode. The present invention using trench sidewall deposition or via filling, forming the cylindrical phase change unit which is a circular nested structure, which can improve reliability of a device, greatly reduce volume of a phase change operation area and heat energy required, thus heating efficiency is improved obviously, the power consumption of the device is reduced, and high-density storage is realized.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: April 15, 2025
    Assignees: Shanghai Integrated Circuit Equipment & Materials Industry Innovation Center Co., Ltd, SHANGHAI IC R&D CENTER CO., LTD.
    Inventors: Min Zhong, Ming Li, Shoumian Chen, Gaoming Feng
  • Publication number: 20250118666
    Abstract: A semiconductor structure and method of manufacturing a semiconductor structure are provided. The semiconductor structure includes a substrate and at least one contact plug. The substrate has an epi-layer. The contact plug is formed on the epi-layer and includes a silicide cap disposed on the epi-layer; a conductive pillar disposed on the silicide cap such that the conductive pillar electrically connects to the epi-layer via the silicide cap; and a hybrid liner. The hybrid liner surrounds the conductive pillar and includes a lower portion abutting the silicide cap and having a nitride material and an upper portion abutting the conductive pillar and having an oxidized nitride material. Due to the hybrid liner, a semiconductor structure with increased capacitance and decreased resistivity can be obtained.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 10, 2025
    Inventors: TZU PEI CHEN, MIN-HSUAN LU, HAO-HENG LIU, YUTING CHENG, HSU-KAI CHANG, PO-CHIN CHANG, OLIVIA PEI-HUA LEE, SHENG-TSUNG WANG, HUAN-CHIEH SU, SUNG-LI WANG, PINYEN LIN
  • Publication number: 20250114473
    Abstract: Disclosure is a compound with one or more arm(s) for drug conjugation and a conjugate including the compound so as to provide high drug-to-moiety ratio and conjugate more drugs to the conjugate.
    Type: Application
    Filed: October 4, 2024
    Publication date: April 10, 2025
    Applicant: Formosa Laboratories, Inc.
    Inventors: ChihHau CHEN, WunHuei LIN, HaoYu HSIEH, JianXun ZHAO, HungYi HSU, ShihHsun SU, ShuoEn TSAI, Yi-Shan LI, TzuHan LIAO, ChienHsun WU, Pohui HUANG, Bao Rong JUO, Yu-Min JUANG, Chao-Yi LI, Yi-Shiuan CHOU, Cheng-Yu CHUNG
  • Publication number: 20250114102
    Abstract: A biomimetic desert beetle self-transporting bone microgrinding head and a preparation process thereof, and relates to the field of medical instruments. The microgrinding head includes a hydrophobic matrix or a matrix having a hydrophobic plating layer. The matrix has a hydrophobic surface on which several hydrophilic abrasive particles are uniformly distributed. A process for preparing the microgrinding head is: selecting diamond abrasive particles and conducting oxidization treatment of the diamond abrasive particles; forming a hydrophobic matrix by scanning a surface of the matrix with a laser; or alternatively obtaining a hydrophobic plating layer by a chemical modification method; and combining the oxidized diamond abrasive particles with the hydrophobic matrix or the hydrophobic plating layer by electroplating to obtain a microgrinding head.
    Type: Application
    Filed: December 21, 2022
    Publication date: April 10, 2025
    Applicant: QINGDAO UNIVERSITY OF TECHNOLOGY
    Inventors: Min YANG, Ming KONG, Yuying YANG, Changhe LI, Zongming ZHOU, Naiqing ZHANG, Runze LI
  • Patent number: 12268617
    Abstract: Methods for forming an expandable tubular body having a plurality of braided filaments including a first filament including platinum or platinum alloy and a second filament including cobalt-chromium alloy. The methods include applying a first phosphorylcholine material directly on the platinum or platinum alloy of the first filament and applying a silane material on the second filament followed by a second phosphorylcholine material on the silane material on the second filament. The first and second phosphorylcholine materials each define a thickness of less than 100 nanometers.
    Type: Grant
    Filed: February 19, 2024
    Date of Patent: April 8, 2025
    Assignee: Covidien LP
    Inventors: Xiaodong Ma, Min-Shyan Sheu, Lincoln Eramo, John Wainwright, Junwei Li
  • Patent number: 12269139
    Abstract: An intelligent production line for turning tool bit cavities and an application method are provided, which solve the problem that a production line in the prior art has low working efficiency. The intelligent production line has the beneficial effects of a compact arrangement structure, higher safety and improved working efficiency. The intelligent production line for turning tool bit cavities includes a robot. Material tables and at least one machining center are arranged around the robot. A transfer station used for transferring materials is arranged between the machining center and the robot. A protective fence is arranged between a position above the material tables and the robot, and between the transfer station and the robot. The robot is provided with a mechanical arm including a base plate. The base plate is provided with at least one clamping jaw and fixed with a laser detecting unit for detecting the materials.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: April 8, 2025
    Assignees: Qingdao University of Technology, Ningbo Sanhan Alloy Material Co., Ltd.
    Inventors: Changhe Li, Haogang Li, Liang Luo, Weixi Ji, Binhui Wan, Shuo Yin, Huajun Cao, Bingheng Lu, Lizhi Tang, Xin Cui, Mingzheng Liu, Yanbin Zhang, Jie Xu, Huiming Luo, Haizhou Xu, Min Yang, Huaping Hong, Teng Gao, Yuying Yang, Wuxing Ma, Shuai Chen
  • Patent number: 12270807
    Abstract: A reacting device of dual path synchronous immunochromatographic platform includes a seat, an upper housing, and a fluid dividing funnel. The seat contains two immunochromatographic carriers. The hollow pipe portion has two sloped structures. A force bearing portion of the fluid dividing funnel can be pressed down, so two fluid exits of the fluid dividing funnel move towards these two sloped structures. The specimen drops and is guided into these two immunochromatographic carriers respectively. A reaction result can be observable. The fluid dividing funnel can divide the specimen into two immunochromatographic carriers evenly. The sloped structure can increase the accuracy of specimen supply. Excess specimen can be scraped off for enhancing the solving accuracy. In addition, it can decrease the possibility of false positive problem.
    Type: Grant
    Filed: July 4, 2021
    Date of Patent: April 8, 2025
    Assignee: TAICHUNG VETERANS GENERAL HOSPITAL
    Inventors: Ming-Feng Wu, Hui-Chun Chang, Jing-Lian Jheng, Yi-Yun Hung, Jen-Ying Li, Hui-Chen Chen, Jiunn-Min Wang
  • Patent number: 12273298
    Abstract: Aspects of the present disclosure provide techniques for transmitting an uplink preemption indication in an integrated access and backhaul (IAB) system identifying the resources or symbols that may be punctured by the IAB in order to minimize self-interference at an IAB node when an ultra-reliable-low latency communications (URLLC) packet is received at the IAB node from one of a child IAB node or a user equipment (UE) during an on-going uplink transmission from an IAB node to a parent backhaul node.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: April 8, 2025
    Assignee: QUALCOMM Incorporated
    Inventors: Qiaoyu Li, Yu Zhang, Min Huang, Chao Wei
  • Patent number: D1070131
    Type: Grant
    Filed: August 1, 2023
    Date of Patent: April 8, 2025
    Assignee: Sichuan Jamie Charming Technology Co., Ltd.
    Inventors: Min Li, Xin Zhang, Yanhong Gui