Patents by Inventor Min Liang

Min Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SURGICAL NAVIGATION SYSTEM, AND IMAGING METHOD OF THE SAME
    Publication number: 20210298835
    Abstract: A surgical navigation system includes a first tracking unit, a second tracking unit and a processing unit. The first tracking unit captures a first infrared image of a position identification unit that includes a reference target fixed on a patient and an instrument target disposed on a surgical instrument. The second tracking unit captures a second infrared image of the position identification unit. The processing unit performs image recognition on the first and second infrared images with respect to the position identification unit, and uses, based on a result of the image recognition, a pathological image and one of the first and second infrared images to generate an augmented reality image.
    Type: Application
    Filed: March 25, 2021
    Publication date: September 30, 2021
    Inventor: Min-Liang WANG
  • METHOD AND SYSTEM FOR PERFORMING SURGICAL IMAGING BASED ON MIXED REALITY
    Publication number: 20210290336
    Abstract: A method for performing surgical imaging based on mixed reality (MR) includes: obtaining a 3D virtual model of a body part of a subject, the 3D virtual model including a plurality of model reference points; continuously capturing IR images of the body part, including a plurality of IR reference points; calculating a first projection matrix based on the IR images; continuously capturing color images of the body part; calculating a second projection matrix based on the color images; in response to a calibration operation, calculating a third projection matrix; and generating a to-be-projected model using the 3D virtual model and the projection matrices.
    Type: Application
    Filed: March 18, 2021
    Publication date: September 23, 2021
    Inventor: Min-Liang WANG
  • Planarization of semiconductor packages and structures resulting therefrom
    Patent number: 11127644
    Abstract: An embodiment method includes encapsulating a semiconductor die in an encapsulant, planarizing the encapsulant, and depositing a polymer material on the encapsulant. The method further includes planarizing the polymer material and forming a metallization pattern on the polymer material. The metallization pattern electrically connects a die connector of the semiconductor die to a conductive feature disposed outside of the semiconductor die.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: September 21, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Yang Yu, Hai-Ming Chen, Yu-Min Liang, Jung Wei Cheng, Chien-Hsun Lee
  • Substrate and Package Structure
    Publication number: 20210288012
    Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.
    Type: Application
    Filed: May 28, 2021
    Publication date: September 16, 2021
    Inventors: Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu
  • LINEAR ACTUATOR
    Publication number: 20210281157
    Abstract: The disclosure relates to a linear actuator including a base, a linear motor, a load cell and a rotary motor. The linear motor is disposed on the base and includes a fixed coil module and a movable magnetic backplane. The fixed coil module is fixed on the base, and the movable magnetic backplane is configured to slide relative to the fixed coil module along a first direction. The rotary motor is rotated around a central axis in parallel with the first direction. The load cell has two opposite sides parallel to the first direction, respectively. The movable magnetic backplane of the linear motor and the rotary motor are connected to the two opposite sides of the load cell, respectively. The load cell is subjected to a force applied thereto by the rotary motor and parallel to the first direction, and configured to convert the force into an electrical signal.
    Type: Application
    Filed: December 10, 2020
    Publication date: September 9, 2021
    Inventors: Yu-Han Hsu, Zi-Xuan Huang, Yu-Xian Huang, Yi-Min Liang, You-Chyau Tsai, Tsung-En Chan, Hong-Chih Chen
  • NOVEL AUTOMOTIVE RADAR USING 3D PRINTED LUNEBURG LENS
    Publication number: 20210278518
    Abstract: A high performance, low-cost automotive radar is designed by mounting receivers around a 3D printed Luneburg lens. With this configuration, the antenna radiation pattern is maintained for all angles, (which means no beam deformation). Further, the present radar is capable of performing detection at all azimuth and elevation angles with high angle resolution and broadband operation. The radar adaptively adjusts its spatial sensing pattern, sweeping frequency band, pulse repetition frequency and coherent processing interval according to the environment. This is accomplished by initially performing a rough scan, which updates sensing results via a narrow bandwidth waveform and wide beam scanning. When interested objects are identified, a high-resolution detailed scan is performed in a specific region of interest. In this way, a much more effective detection can be obtained.
    Type: Application
    Filed: August 15, 2017
    Publication date: September 9, 2021
    Inventors: Hao Xin, Min Liang, Siyang Cao
  • Redistribution structures in semiconductor packages and methods of forming same
    Patent number: 11101209
    Abstract: An embodiment semiconductor package includes a bare semiconductor chip, a packaged semiconductor chip adjacent the bare semiconductor chip, and a redistribution structure bonded to the bare semiconductor chip and the packaged semiconductor chip. The redistribution structure includes a first redistribution layer having a first thickness; a second redistribution layer having a second thickness; and a third redistribution layer between the first redistribution layer and the second redistribution layer. The third redistribution layer has a third thickness greater than the first thickness and the second thickness. The package further includes an underfill disposed between the bare semiconductor chip and the redistribution structure and a molding compound encapsulating the bare semiconductor chip, the packaged semiconductor chip, and the underfill.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: August 24, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chung-Shi Liu, Chien-Hsun Lee, Jiun Yi Wu, Hao-Cheng Hou, Hung-Jen Lin, Jung Wei Cheng, Tsung-Ding Wang, Yu-Min Liang, Li-Wei Chou
  • SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20210242119
    Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a redistribution structure, a circuit substrate, and an insulating encapsulation. The redistribution structure includes a first under-bump metallization (UBM) pattern covered by a first dielectric layer, and the first UBM pattern includes a surface substantially leveled with a surface of the first dielectric layer. The circuit substrate is electrically coupled to the redistribution structure through a conductive joint disposed on the surface of the first UBM pattern. The insulating encapsulation is disposed on the redistribution structure to cover the circuit substrate.
    Type: Application
    Filed: June 29, 2020
    Publication date: August 5, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kuan-Lin Ho, Chin-Liang Chen, Jiun-Yi Wu, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen
  • ACTIVE CALIBRATION DEVICE AND METHOD FOR OBTAINING PARAMETERS USED TO CALIBRATE INFORMATION CONTAINED IN IMAGES CAPTURED BY AN INFRARED CAMERA DEVICE
    Publication number: 20210227143
    Abstract: An active calibration device is provided for obtaining parameters that are used to calibrate information contained in images captured by an infrared camera device. The active calibration device includes a base having at least one mounting surface; and a plurality of infrared (IR) light emitting components disposed on the mounting surface of the base. The IR light emitting components are arranged to form a predetermined pattern, and are configured to emit infrared light for receipt by a lens of the infrared camera device.
    Type: Application
    Filed: May 18, 2020
    Publication date: July 22, 2021
    Inventor: Min-Liang WANG
  • SURGERY SYSTEM, CONTACTLESS CONTROL PANEL FOR SURGERY SYSTEM, AND CONTROL METHOD
    Publication number: 20210225504
    Abstract: A surgery system includes a contactless control panel, an infrared camera, a computer and a display. The contactless control panel includes control areas which are arranged in a predetermined pattern and are coated with infrared reflective material to reflect infrared radiation. The infrared camera captures an infrared image of the control areas. The computer performs image recognition on the infrared image, determines, based on the predetermined pattern stored in advance and a result of the image recognition, which one of the control areas is masked, and generates a device control signal based on a function corresponding to the one of the control areas that is determined to be masked. The display device displays images based on the device control signal.
    Type: Application
    Filed: July 1, 2020
    Publication date: July 22, 2021
    Inventor: Min-Liang WANG
  • PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20210210464
    Abstract: A package structure and a method of forming the same are provided. The package structure includes a first die and a second die, a first encapsulant, a second encapsulant and a RDL structure. The first die includes a first connector and a first protection layer covering sidewalls of the first connector, and the second die includes a second connector. The first encapsulant is at least disposed laterally between the first die and the second die to encapsulate first sidewalls of the first die and the second die that faces each other. The second encapsulant encapsulates second sidewalls of the first die and the second die. The RDL structure is disposed on and electrically connected to the first die and the second die. The top surfaces of the first protection layer, the first encapsulant, and the second encapsulant are in contact with a bottom surface of the RDL structure.
    Type: Application
    Filed: March 22, 2021
    Publication date: July 8, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Yang Yu, Chin-Liang Chen, Chien-Hsun Lee, Kuan-Lin Ho, Yu-Min Liang
  • IMPLEMENTATION METHOD FOR OPERATING A SURGICAL INSTRUMENT USING SMART SURGICAL GLASSES
    Publication number: 20210196404
    Abstract: An implementation method for operating a surgical instrument using smart surgical glasses for a surgeon to perform an operation on an surgical site with at least one surgical instrument mainly comprises the steps of: the surgeon wearing a smart surgical glasses; using the sensors to sense the position of the surgical instrument held by the surgeon and the position of the surgical site; displaying a picture on a display of the smart surgical glasses, the picture comprising a plurality of sub-blocks; combining the medical image block, the instrument block and the surgical site block to form a mixed reality image; displaying an image of the surgical planning block in the mixed reality image; and the surgeon operating the surgical instrument according to the image of the surgical planning block.
    Type: Application
    Filed: December 30, 2019
    Publication date: July 1, 2021
    Inventor: Min-Liang Wang
  • SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING
    Publication number: 20210202266
    Abstract: Interconnect devices, packaged semiconductor devices and methods are disclosed herein that are directed towards embedding a local silicon interconnect (LSI) device and through substrate vias (TSVs) into system on integrated substrate (SoIS) technology with a compact package structure. The LSI device may be embedded into SoIS technology with through substrate via integration to provide die-to-die FL connection arrangement for super large integrated Fan-Out (InFO) for SBT technology in a SoIS device. Furthermore, the TSV connection layer may be formed using lithographic or photoresist-defined vias to provide eLSI P/G out to a ball-grid-array (BGA) connection interface.
    Type: Application
    Filed: May 7, 2020
    Publication date: July 1, 2021
    Inventors: Chien-Hsun Chen, Yu-Min Liang, Yen-Ping Wang, Jiun Yi Wu, Chen-Hua Yu, Kai-Chiang Wu
  • Substrate and package structure
    Patent number: 11024594
    Abstract: According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the pads has a pad size. The pad size in the first area is larger than the pad size in the second area.
    Type: Grant
    Filed: November 26, 2018
    Date of Patent: June 1, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Wei-Hung Lin, Hsiu-Jen Lin, Ming-Da Cheng, Yu-Min Liang, Chen-Shien Chen, Chung-Shi Liu
  • NOVEL HOLLOW LIGHT WEIGHT LENS STRUCTURE
    Publication number: 20210151894
    Abstract: A hollow light-weight, low-cost, and high-performance 3D Luneburg lens structure using partially-metalized thin film, string, threads, fiber or wire base metamaterial to implement the continuously varying relative permittivity profile, characteristic of Luneburg lens structures, is disclosed. The hollow light-weight lens structure is based on the effective medium approach and may be implemented by a number of means. Further, most of the volume of the lens structure is free-space, thus the weight of the lens is significantly less than conventional 3D Luneburg lens structures of the same dimensions.
    Type: Application
    Filed: June 15, 2018
    Publication date: May 20, 2021
    Inventors: Hao Xin, Min Liang
  • Semiconductor Packages and Method of Manufacture
    Publication number: 20210125933
    Abstract: A package includes an interposer structure free of any active devices. The interposer structure includes an interconnect device; a dielectric film surrounding the interconnect device; and first metallization pattern bonded to the interconnect device. The package further includes a first device die bonded to an opposing side of the first metallization pattern as the interconnect device and a second device die bonded to a same side of the first metallization pattern as the first device die. The interconnect device electrically connects the first device die to the second device die.
    Type: Application
    Filed: May 26, 2020
    Publication date: April 29, 2021
    Inventors: Wei-Yu Chen, Chun-Chih Chuang, Kuan-Lin Ho, Yu-Min Liang, Jiun Yi Wu
  • In-ear headphones with an ergonomic cushion and an ergonomic cushion thereof
    Patent number: 10972823
    Abstract: The present invention is directed to a headphone or an earpiece that includes a cushion that advantageously allows for improved comfort, sound quality, and stability in the ear. The cushion includes an inner cavity, an ear-canal aperture and a tip portion, wherein the inner cavity of the cushion accommodates a nozzle portion of a housing within the cavity, and the axis of the inner cavity is substantially parallel to the first axis, and wherein the ear-canal aperture opens toward the ear canal of the user's ear when the headphone or the earpiece is worn by the user. A speaker element is positioned inside the nozzle portion of the housing, and the center of mass of the headphone is shifted close to a center plane of the cushion.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: April 6, 2021
    Assignee: Kingston Technology Corp.
    Inventors: Peter Leekuo Chou, Baron King Lee, Wei-Min Liang, Pen Hao Ma
  • Headphones with an ergonomic cushion and an ergonomic cushion thereof
    Patent number: 10972822
    Abstract: The present invention is directed to a headphone or an earpiece that includes a cushion that advantageously allows for improved comfort, sound quality, and stability in the ear. The cushion includes an inner cavity, an ear-canal aperture and a tip portion, wherein the inner cavity of the cushion accommodates a nozzle portion of a housing within the cavity, and the axis of the inner cavity is substantially parallel to the first axis, wherein the ear-canal aperture opens toward the ear canal of the user's ear when the headphone or the earpiece is worn by the user, and wherein the tip portion engages the concha of the user's ear when the headphone or the earpiece is worn by the user, and the axis of the tip portion is not parallel to the first axis. The headphone or the earpiece includes dual acoustic elements to amplify sounds in different frequency ranges.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: April 6, 2021
    Assignee: Kingston Technology Corp.
    Inventors: Peter Leekuo Chou, Baron King Lee, Wei-Min Liang, Pen Hao Ma
  • PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
    Publication number: 20210098354
    Abstract: A package structure including a first circuit board structure, a redistribution layer structure, bonding elements, and a semiconductor package is provided. The redistribution layer structure is disposed over and electrically connected to the first circuit board structure. The bonding elements are disposed between and electrically connected to the redistribution layer structure and the first circuit board structure. Each of the bonding elements has a core portion and a shell portion surrounding the core portion. A stiffness of the core portion is higher than a stiffness of the shell portion. A semiconductor package is disposed over and electrically connected to the redistribution layer structure.
    Type: Application
    Filed: February 20, 2020
    Publication date: April 1, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Kai-Chiang Wu, Jiun-Yi Wu, Yu-Min Liang
  • SEMICONDUCTOR PACKAGE
    Publication number: 20210098325
    Abstract: A semiconductor package including a first semiconductor device, a second semiconductor device, an insulating encapsulant, a redistribution structure and a supporting element is provided. The insulating encapsulant encapsulates the first semiconductor device and the second semiconductor device. The redistribution structure is over the first semiconductor device, the second semiconductor device and the insulating encapsulant. The redistribution structure is electrically connected to the first semiconductor device and the second semiconductor device. The supporting element is embedded in one of the insulating encapsulant and the redistribution structure.
    Type: Application
    Filed: January 20, 2020
    Publication date: April 1, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Yang Yu, Chien-Hsun Lee, Jung-Wei Cheng, Tsung-Ding Wang, Yu-Min Liang