Patents by Inventor Min Liang

Min Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220302064
    Abstract: A chip package structure includes a fan-out package containing at least one semiconductor die, an epoxy molding compound (EMC) die frame laterally surrounding the at least one semiconductor die, and a redistribution structure. The fan-out package has chamfer regions at which horizontal surfaces and vertical surfaces of the fan-out package are connected via angled surfaces that are not horizontal and not vertical. The chip package structure may include a package substrate that is attached to the fan-out package via an array of solder material portions, and an underfill material portion that laterally surrounds the array of solder material portions and contacts an entirety of the angled surfaces. The angled surfaces eliminate a sharp corner at which mechanical stress may be concentrated, and distribute local mechanical stress in the chamfer regions over a wide region to prevent cracks in the underfill material portion.
    Type: Application
    Filed: March 18, 2021
    Publication date: September 22, 2022
    Inventors: Wei-Yu CHEN, Chi-Yang YU, Kuan-Lin HO, Chin-Liang CHEN, Yu-Min LIANG, Jiun Yi WU
  • Patent number: 11450335
    Abstract: A method and a device for updating a coefficient vector of a finite impulse response filter are provided. The update method includes: obtaining an updated step-size diagonal matrix for a coefficient vector of the FIR filter; and obtaining an updated coefficient vector of the FIR filter based on the updated step-size diagonal matrix.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: September 20, 2022
    Assignee: DATANG MOBILE COMMUNICATIONS EQUIPMENT CO., LTD.
    Inventors: Xuan Zhou, Min Liang
  • Publication number: 20220294121
    Abstract: A communication system includes a Gradient-index lens, a first plurality of antenna elements, and a control system. The first plurality of antenna elements are arranged on a first surface parallel to a surface of the Gradient-index lens. The first plurality of antenna elements are configured to generate a first plurality of antenna signals in response to receiving a signal from an end user device. The control system receives the first plurality of antenna signals from the first plurality of antenna elements and determines an end user direction associated with the end user signal based on a predetermined set of antenna signal values associates with the first plurality of antenna elements.
    Type: Application
    Filed: July 29, 2020
    Publication date: September 15, 2022
    Inventors: Hao Xin, Min Liang, Jiang Xin
  • Patent number: 11439340
    Abstract: According to various embodiments, a display device may be provided. The display device may include: a receiver configured to receive user data based on an electroencephalography measurement; at least one light source; and a controller configured to control the at least one light source based on the user data.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: September 13, 2022
    Assignee: Razer (Asia-Pacific) Pte. Ltd.
    Inventors: Min-Liang Tan, Kian Sin Yeo, Beng Leong Toh, Ji Fong Lim, Gui Mei Dai, Kah Yong Lee, Aninda Kanti Sen
  • Publication number: 20220270994
    Abstract: An integrated fan-out package includes a die, an encapsulant, a seed layer, a conductive pillar, a redistribution structure, and a buffer layer. The encapsulant encapsulates the die. The seed layer and the conductive pillar are sequentially stacked over the die and the encapsulant. The redistribution structure is over the die and the encapsulant. The redistribution structure includes a conductive pattern and a dielectric layer. The conductive pattern is directly in contact with the seed layer and the dielectric layer covers the conductive pattern and surrounds the seed layer and the conductive pillar. The buffer layer is disposed over the redistribution structure. The seed layer is separate from the dielectric layer by the buffer layer, and a Young's modulus of the buffer layer is higher than a Young's modulus of the dielectric layer of the redistribution structure.
    Type: Application
    Filed: May 11, 2022
    Publication date: August 25, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho, Yu-Min Liang
  • Publication number: 20220270987
    Abstract: A semiconductor package includes a substrate, a semiconductor device, and a ring structure. The semiconductor device disposed on the substrate. The ring structure disposed on the substrate and surrounds the semiconductor device. The ring structure includes a first portion and a second portion. The first portion bonded to the substrate. The second portion connects to the first portion. A cavity is between the second portion and the substrate.
    Type: Application
    Filed: February 25, 2021
    Publication date: August 25, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Yang Yu, Jung-Wei Cheng, Yu-Min Liang, Jiun-Yi Wu, Yen-Fu Su, Chien-Chang Lin, Hsin-Yu Pan
  • Patent number: 11424220
    Abstract: A method of manufacturing a semiconductor structure includes providing a substrate including a redistribution layer (RDL) disposed over the substrate, disposing a first patterned mask over the RDL, disposing a first conductive material over the RDL exposed from the first patterned mask to form a first conductive pillar, removing the first patterned mask, disposing a second patterned mask over the RDL, disposing a second conductive material over the RDL exposed from the second patterned mask to form a second conductive pillar, removing the second patterned mask, disposing a first die over the first conductive pillar, and disposing a second die over the second conductive pillar. A height of the second conductive pillar is substantially greater than a height of the first conductive pillar.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: August 23, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chi-Yang Yu, Kuan-Lin Ho, Chin-Liang Chen, Yu-Min Liang
  • Patent number: 11406346
    Abstract: A surgical position calibration method for getting the augmented and mixed reality of a surgical instrument includes the following steps: placing a calibration plate under a C-ARM to take C-ARM images, with the calibration plate provided with geometric patterns; inputting the C-ARM images into a computer to make 2D image maps; finding the center point of each geometric pattern on the calibration plate; defining a first reference calibration point; finding the distance between the center point of each other geometric pattern and the first reference calibration point to set up a translation matrix formula to form a 3D space image map; placing a surgical instrument at any position above the calibration plate; using the translation matrix formula generating a spatial variation image for the displacement of the surgical instrument; and forming a new spatial variation image.
    Type: Grant
    Filed: October 1, 2018
    Date of Patent: August 9, 2022
    Assignee: TAIWAN MAIN ORTHOPAEDIC BIOTECHNOLOGY CO., LTD.
    Inventor: Min-Liang Wang
  • Publication number: 20220246513
    Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a first under-bump metallization (UBM) pattern, a first conductive via, and a first dielectric layer laterally covering the first UBM pattern and the first conductive via. Entireties of a top surface and a bottom surface of the first UBM pattern are substantially planar. The first conductive via landing on the top surface of the first UBM pattern includes a vertical sidewall and a top surface connected to the vertical sidewall, and a planarized mark is on the top surface of the first conductive via. A bottom surface of the first dielectric layer is substantially flush with the bottom surface of the first UBM, and a top surface of the first dielectric layer is substantially flush with the top surface of the first conductive via.
    Type: Application
    Filed: April 20, 2022
    Publication date: August 4, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Lin Ho, Chin-Liang Chen, Jiun-Yi Wu, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen
  • Publication number: 20220248117
    Abstract: This application discloses and describes a variety of systems, methods, and devices directed to headset audio systems having acoustic chambers. Acoustic chambers of the inventive subject matter can be implemented such that the backside of a speaker diaphragm projects sound waves into an acoustic chamber. Because acoustic chambers are formed to create fixed volumes of space, this minimizes impact of those sound waves projected from the back of a speaker diaphragm that could otherwise affect sound reproduction. This new inventive audio system actually differentiates from the way diaphragms are attached which conventional speaker driver assembly doesn't, to accomplish the invention the way fixing magnets and other parts for magnetic delivering are invented to eliminate or integrated, such as frame or bracket is cancelled, chambers now use to fix magnetic parts.
    Type: Application
    Filed: February 3, 2021
    Publication date: August 4, 2022
    Inventors: Chia-Ming Chang, Wei-Min Liang
  • Publication number: 20220225010
    Abstract: A headset may include a headband; first and second earcups respectively attached to first and second ends of the headband; a first light display unit; a headset receiver configured to receive data from a processor-based device; and a headset control unit. Each of the first and second earcups may include an interior surface and an exterior surface, where the interior surfaces of the first and second earcups may face each other and the exterior surfaces of the first and second earcups may face away from each other. The first light display unit may include a matrix of independently controllable light emitting elements arranged along a boundary of the exterior surface of the first earcup. The headset control unit may be configured to control the light emitting elements of the first light display unit based on the data received by the headset receiver.
    Type: Application
    Filed: September 27, 2019
    Publication date: July 14, 2022
    Inventors: Min-Liang TAN, Andrew PHILIPPOU, Hongzheng LIAO
  • Publication number: 20220206594
    Abstract: A method, a computer readable medium, and an apparatus for providing haptic feedback through a plurality of haptic devices are provided. The apparatus may receive a multi-channel audio stream. The apparatus may split the multi-channel audio stream into a plurality of audio channels. For each haptic signal of a plurality of haptic signals, the apparatus may generate the haptic signal based on one or more audio channels of the plurality of audio channels. For each haptic signal of the plurality of haptic signals, the apparatus may transmit the haptic signal to a corresponding haptic device of the plurality of haptic devices to produce the haptic feedback.
    Type: Application
    Filed: March 18, 2022
    Publication date: June 30, 2022
    Inventors: Wooi Liang CHIN, Chung Wei LEE, Shiuwen WONG, Min-Liang TAN, Ping HE
  • Publication number: 20220208633
    Abstract: A semiconductor package includes a circuit structure, a first redistribution layer, a second redistribution layer, a first encapsulant, a bus die and a plurality of through vias. The first redistribution layer is disposed over the circuit structure. The second redistribution layer is disposed over the first redistribution layer. The first encapsulant is disposed between the first redistribution layer and the second redistribution layer. The through vias surround the bus die. The first encapsulant is extended along an entire sidewall of the bus die, and a first surface of the bus die is substantially coplanar with top surfaces of the first encapsulant and the plurality of through vias.
    Type: Application
    Filed: March 16, 2022
    Publication date: June 30, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jiun-Yi Wu, Chen-Hua Yu, Chung-Shi Liu, Yu-Min Liang
  • Patent number: 11373822
    Abstract: Key switches of the inventive subject matter are designed to give users the tactile feel of key switches from expensive mechanical keyboards without drawback typically associated with alternative key switches. In some embodiments, key switches described in this application are designed to function with a sheet of membrane switches. These embodiments feature a plunger and rocker combination that prevents the pressure from a user's key press from being directly transferred to a membrane switch, thereby reducing wear and tear.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: June 28, 2022
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Jian-Cheng Lai, Wei-Min Liang, Kuo Shou Yu
  • Patent number: 11357728
    Abstract: A liposome comprising bilayer and inner water phase is disclosed. Said inner water phase may contain sulfobutyl ether cyclodextrin and an active compound.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: June 14, 2022
    Assignee: CSPC ZHONGQI PHARMACEUTICAL TECHNOLOGY (SHIJIAZHUANG) CO., LTD.
    Inventors: Chunlei Li, Lan Zhang, Caixia Wang, Li Zhang, Dongmin Shen, Yanhui Li, Xian Xiu, Min Liang, Yongfeng Li
  • Patent number: 11355461
    Abstract: An integrated fan-out package includes a die, an encapsulant, a seed layer, a conductive pillar, a redistribution structure, and a buffer layer. The encapsulant encapsulates the die. The seed layer and the conductive pillar are sequentially stacked over the die and the encapsulant. The redistribution structure is over the die and the encapsulant. The redistribution structure includes a conductive pattern and a dielectric layer. The conductive pattern is directly in contact with the seed layer and the dielectric layer covers the conductive pattern and surrounds the seed layer and the conductive pillar. The buffer layer is disposed over the redistribution structure. The seed layer is separate from the dielectric layer by the buffer layer, and a Young's modulus of the buffer layer is higher than a Young's modulus of the dielectric layer of the redistribution structure.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: June 7, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho, Yu-Min Liang
  • Patent number: 11340342
    Abstract: A high performance, low-cost automotive radar is designed by mounting receivers around a 3D printed Luneburg lens. With this configuration, the antenna radiation pattern is maintained for all angles, (which means no beam deformation). Further, the present radar is capable of performing detection at all azimuth and elevation angles with high angle resolution and broadband operation. The radar adaptively adjusts its spatial sensing pattern, sweeping frequency band, pulse repetition frequency and coherent processing interval according to the environment. This is accomplished by initially performing a rough scan, which updates sensing results via a narrow bandwidth waveform and wide beam scanning. When interested objects are identified, a high-resolution detailed scan is performed in a specific region of interest. In this way, a much more effective detection can be obtained.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: May 24, 2022
    Assignee: Arizona Board of Regents on behalf of the University of Arizona
    Inventors: Hao Xin, Min Liang, Siyang Cao
  • Patent number: 11315862
    Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a redistribution structure, a circuit substrate, and an insulating encapsulation. The redistribution structure includes a first under-bump metallization (UBM) pattern covered by a first dielectric layer, and the first UBM pattern includes a surface substantially leveled with a surface of the first dielectric layer. The circuit substrate is electrically coupled to the redistribution structure through a conductive joint disposed on the surface of the first UBM pattern. The insulating encapsulation is disposed on the redistribution structure to cover the circuit substrate.
    Type: Grant
    Filed: June 29, 2020
    Date of Patent: April 26, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kuan-Lin Ho, Chin-Liang Chen, Jiun-Yi Wu, Chi-Yang Yu, Yu-Min Liang, Wei-Yu Chen
  • Patent number: 11314344
    Abstract: A method, a computer readable medium, and an apparatus for providing haptic feedback through a plurality of haptic devices are provided. The apparatus may receive a multi-channel audio stream. The apparatus may split the multi-channel audio stream into a plurality of audio channels. For each haptic signal of a plurality of haptic signals, the apparatus may generate the haptic signal based on one or more audio channels of the plurality of audio channels. For each haptic signal of the plurality of haptic signals, the apparatus may transmit the haptic signal to a corresponding haptic device of the plurality of haptic devices to produce the haptic feedback.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: April 26, 2022
    Assignee: RAZER (ASIA-PACIFIC) PTE. LTD.
    Inventors: Wooi Liang Chin, Chung Wei Lee, Shiuwen Wong, Min-Liang Tan, Ping He
  • Patent number: 11303036
    Abstract: A hollow light-weight, low-cost, and high-performance 3D Luneburg lens structure using partially-metalized thin film, string, threads, fiber or wire base metamaterial to implement the continuously varying relative permittivity profile, characteristic of Luneburg lens structures, is disclosed. The hollow light-weight lens structure is based on the effective medium approach and may be implemented by a number of means. Further, most of the volume of the lens structure is free-space, thus the weight of the lens is significantly less than conventional 3D Luneburg lens structures of the same dimensions.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: April 12, 2022
    Assignee: Arizona Board of Regents on Behalf of The University of Arizona
    Inventors: Hao Xin, Min Liang