Patents by Inventor Min Liang

Min Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10700034
    Abstract: An embodiment apparatus includes a dielectric layer, a conductive trace in the dielectric layer, and a bump pad. The conductive trace includes a first portion having an exposed top surface, wherein the exposed top surface is recessed from a top surface of the dielectric layer. Furthermore, the bump pad is disposed over and is electrically connected to a second portion of the conductive trace.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: June 30, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Min Liang, Jiun Yi Wu
  • Patent number: 10700031
    Abstract: An integrated fan-out package includes a die, an encapsulant, a redistribution structure, a seed layer, conductive pillars, and a buffer layer. The encapsulant encapsulates the die. The redistribution structure is over the die and the encapsulant. The redistribution structure includes dielectric layers and conductive patterns. The dielectric layers are sequentially stacked and the conductive patterns are sandwiched between the dielectric layers. The seed layer and the conductive pillars are sequentially stacked over the redistribution structure. The seed layer is directly in contact with the conductive patterns closest to the conductive pillars. The buffer layer is disposed over the redistribution structure. The dielectric layer closest to the conductive pillars and the buffer layer are sandwiched between the seed layer and the conductive patterns closest to the conductive pillars.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: June 30, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Yang Yu, Chin-Liang Chen, Hai-Ming Chen, Kuan-Lin Ho, Yu-Min Liang
  • Publication number: 20200197123
    Abstract: The invention discloses an object developing and calibrating method in a surgical environment. The method mainly includes the steps of: using at least one infrared LED (IR-LED) and at least one infrared sensor (IR-Sensor) on a surgical eyeglass, to have a surgical environment image; and retaining image signals within a first wavelength range and removing image signals not in the first wavelength range in the surgical environment image. The method helps the surgeon see only the object images on the surgical eyeglass without the interference of non-surgical environmental imaging noises.
    Type: Application
    Filed: December 23, 2018
    Publication date: June 25, 2020
    Inventor: Min-Liang Wang
  • Publication number: 20200176405
    Abstract: Semiconductor packages and methods of forming the same are disclosed. One of the semiconductor packages includes a circuit board structure, a first redistribution layer structure, a plurality of first bonding elements, a package structure and a plurality of second bonding elements. The first redistribution layer structure is disposed over and electrically connected to the circuit board structure. The first bonding elements are disposed between and electrically connected to the first redistribution layer structure and the circuit board structure. The package structure is disposed over and electrically connected to the first redistribution layer structure. The second bonding elements are disposed between and electrically connected to the first redistribution layer structure and the package structure.
    Type: Application
    Filed: July 25, 2019
    Publication date: June 4, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jiun-Yi Wu, Chen-Hua Yu, Yu-Min Liang
  • Publication number: 20200176346
    Abstract: Semiconductor packages and methods of forming the same are disclosed. One of the semiconductor packages includes a first redistribution layer structure, a package structure, a bus die and a plurality of connectors. The package structure is disposed over the first redistribution layer structure, and includes a plurality of package components. The bus die and the connectors are encapsulated by a first encapsulant between the package structure and the first redistribution layer structure. The bus die is electrically connected to two or more of the plurality of package components, and the package structure are electrically connected to the first redistribution layer structure through the plurality of connectors.
    Type: Application
    Filed: October 17, 2019
    Publication date: June 4, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jiun-Yi Wu, Chen-Hua Yu, Chung-Shi Liu, Yu-Min Liang
  • Patent number: 10666240
    Abstract: A device having a memory configured to store information indicating debounce times for the device's switches and having circuits configured to determine whether the switches are depressed and closed based on the debounce times. The debounce times are updated based on the age of the device and/or switch usage. The method for debouncing may be performed by a computer having computer-readable media directed to adjusting the debounce times based on the age of the device containing the switches.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: May 26, 2020
    Assignee: RAZER (ASIA-PACIFIC) PTE. LTD.
    Inventors: Min-Liang Tan, Sreenath Unnikrishnan, Kheng Joo Khaw
  • Patent number: 10658263
    Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: May 19, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Yang Yu, Chin-Liang Chen, Kuan-Lin Ho, Yu-Min Liang, Wen-Lin Chen
  • Publication number: 20200151474
    Abstract: Non-intrusive assessment of fatigue in drivers using eye tracking. In a simulated driving experiment, vigilance was assessed by power spectral analysis of multichannel electroencephalogram (EEG) signals, recorded simultaneously, and binary labels of alert and drowsy (baseline) were generated for each epoch of the eye tracking data. A classifier and a non-linear support vector machine were employed for vigilance assessment. Evaluation results revealed a high accuracy of 88% for the RF classifier, which significantly outperformed the SVM with 81% accuracy (p<0.001). In a simulated driving experiment, the simultaneously recorded multichannel electroencephalogram (EEG) signals were used as the baseline. A random forest (RF) and a non-linear support vector machine (SVM) were employed for binary classification of the state of vigilance. Different lengths of eye tracking epoch were selected for feature extraction, and the performance of each classifier was investigated for every epoch length.
    Type: Application
    Filed: August 1, 2019
    Publication date: May 14, 2020
    Inventors: Ali Shahidi Zandi, Min Liang, Azhar Quddus, Laura Prest, Felix J.E. Comeau
  • Publication number: 20200135678
    Abstract: An embodiment apparatus includes a dielectric layer, a conductive trace in the dielectric layer, and a bump pad. The conductive trace includes a first portion having an exposed top surface, wherein the exposed top surface is recessed from a top surface of the dielectric layer. Furthermore, the bump pad is disposed over and is electrically connected to a second portion of the conductive trace.
    Type: Application
    Filed: December 27, 2019
    Publication date: April 30, 2020
    Inventors: Yu-Min Liang, Jiun Yi Wu
  • Patent number: 10622278
    Abstract: A method for manufacturing a semiconductor structure is disclosed. The method includes: providing a semiconductor substrate having a plurality of dies thereon; dispensing an underfill material and a molding compound to fill spaces beneath and between the dies; disposing a temporary carrier over the dies; thinning a thickness of the semiconductor substrate; performing back side metallization upon the thinned semiconductor substrate; removing the temporary carrier; and attaching a plate over the dies. An associated semiconductor structure is also disclosed.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: April 14, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chin-Liang Chen, Chi-Yang Yu, Kuan-Lin Ho, Yu-Min Liang
  • Publication number: 20200100756
    Abstract: A surgical position calibration method for getting the augmented and mixed reality of a surgical instrument includes the following steps: placing a calibration plate under a C-ARM to take C-ARM images, with the calibration plate provided with geometric patterns; inputting the C-ARM images into a computer to make 2D image maps; finding the center point of each geometric pattern on the calibration plate; defining a first reference calibration point; finding the distance between the center point of each other geometric pattern and the first reference calibration point to set up a translation matrix formula to form a 3D space image map; placing a surgical instrument at any position above the calibration plate; using the translation matrix formula generating a spatial variation image for the displacement of the surgical instrument; and forming a new spatial variation image.
    Type: Application
    Filed: October 1, 2018
    Publication date: April 2, 2020
    Inventor: Min-Liang Wang
  • Patent number: 10603133
    Abstract: This present invention discloses an image guided augmented reality method, comprising the following steps of: obtaining a first conversion matrix of a camera and a marked point; obtaining a second conversion matrix of the eye and the camera; linking the first conversion matrix and the second conversion matrix to obtain a correct position corresponding matrix of the eye to the marked point; and linking the correct position corresponding matrix to a position feature of the marked point to obtain the correct position of the eye to the marked point. The present invention also discloses a surgical navigation method of wearable glasses, used for obtaining the correct position of the operator's eye to the marked point.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: March 31, 2020
    Assignee: Taiwan Main Orthopaedic Biotechnology Co., Ltd.
    Inventors: Min-Liang Wang, Pei-Yuan Lee, Ming-Hsien Hu
  • Publication number: 20200060982
    Abstract: Purified therapeutic nanoparticles are provided herein. Such nanoparticles comprise an active pharmaceutical ingredient and human serum albumin, wherein the weight ratio of human serum albumin to the active ingredient in the therapeutic nanoparticles is from 0.01:1 to 1:1, and wherein the nanoparticles are substantially free of free human serum albumin that is not incorporated in the nanoparticles. The present disclosure also provides pharmaceutical compositions that comprise the purified therapeutic nanoparticles and are also substantially free of free human serum albumin. Methods for preparing and using the purified therapeutic nanoparticles and compositions thereof are also provided.
    Type: Application
    Filed: October 30, 2019
    Publication date: February 27, 2020
    Inventors: Chunlei Li, Yanhui Li, Min Liang, Caixia Wang, Yajuan Wang, Shixia Wang, Dongjian Chen, Yongfeng Li
  • Publication number: 20200068283
    Abstract: The present invention is directed to a headphone or an earpiece that includes a cushion that advantageously allows for improved comfort, sound quality, and stability in the ear. The cushion includes an inner cavity, an ear-canal aperture and a tip portion, wherein the inner cavity of the cushion accommodates a nozzle portion of a housing within the cavity, and the axis of the inner cavity is substantially parallel to the first axis, and wherein the ear-canal aperture opens toward the ear canal of the user's ear when the headphone or the earpiece is worn by the user. A speaker element is positioned inside the nozzle portion of the housing, and the center of mass of the headphone is shifted close to a center plane of the cushion.
    Type: Application
    Filed: October 28, 2019
    Publication date: February 27, 2020
    Applicant: Kingston Technology Corp.
    Inventors: PETER LEEKUO CHOU, BARON King Lee, Wei-Min Liang, Pen Hao Ma
  • Patent number: 10568844
    Abstract: Novel siRNA and shRNA nanocapsules and delivery methods are disclosed herein. These siRNA and shRNA nanocapsules and delivery methods are highly robust and effective. This invention provides a platform for RNAi delivery with low toxicity and long intracellular half-life for practical therapeutic applications.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: February 25, 2020
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Yunfeng Lu, Irvin S. Y. Chen, Ming Yan, Min Liang, Masakazu Kamata, Jing Wen
  • Patent number: 10574783
    Abstract: Most computer operating systems are able to automatically configure the coupled computer peripheral audio device for use with the computer operating system without the need for installation of a specific driver. However, when these computer peripheral audio devices are detected by the computing system, a generic audio device control configuration is often assigned to them and whatever customised settings previously configured by the user will be lost and replaced with a new set of unfamiliar setting. This poses much inconvenience and hassle to gainers when they use a different computing system or machine. Described according to an embodiment of the invention is a headset device and a device profile management method, operating on a computing cloud, comprising steps for receiving client data provided by a computing system detecting coupling of an audio device thereto and for retrieving configuration data corresponding to the client data for use in configuring the audio device by the computing system.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: February 25, 2020
    Assignee: RAZER (ASIA-PACIFIC) PTE. LTD.
    Inventors: Min-Liang Tan, Shiuwen Wong
  • Patent number: 10558253
    Abstract: According to various embodiments, an energy monitoring method may be provided. The energy monitoring method may include: determining internal energy information indicating a charge state of an internal battery of a computing device; wirelessly receiving external energy information indicating a charge state of an external battery for the computing device; determining a combined energy information indicating a combined charge state of the internal battery and external battery based on the internal energy information and based on the external energy information; and providing a notification to a user of the computing device based on the combined energy information.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: February 11, 2020
    Assignee: RAZER (ASIA-PACIFIC) PTE. LTD.
    Inventor: Min-Liang Tan
  • Publication number: 20200043819
    Abstract: A semiconductor package and a manufacturing method are provided. The semiconductor package includes a die, a dummy cube, a stress relaxation layer, an encapsulant and a redistribution structure. The dummy cube is disposed beside the die. The stress relaxation layer covers a top surface of the dummy cube. The encapsulant encapsulates the die and the dummy cube. The redistribution structure is disposed over the encapsulant and is electrically connected to the die. The stress relaxation layer is interposed between the dummy cube and the redistribution structure.
    Type: Application
    Filed: October 25, 2018
    Publication date: February 6, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Yang Yu, Chien-Hsun Lee, Yu-Min Liang
  • Publication number: 20200029147
    Abstract: The present invention is directed to a headphone or an earpiece that includes a cushion that advantageously allows for improved comfort, sound quality, and stability in the ear. The cushion includes an inner cavity, an ear-canal aperture and a tip portion, wherein the inner cavity of the cushion accommodates a nozzle portion of a housing within the cavity, and the axis of the inner cavity is substantially parallel to the first axis, wherein the ear-canal aperture opens toward the ear canal of the user's ear when the headphone or the earpiece is worn by the user, and wherein the tip portion engages the concha of the user's ear when the headphone or the earpiece is worn by the user, and the axis of the tip portion is not parallel to the first axis. The headphone or the earpiece includes dual acoustic elements to amplify sounds in different frequency ranges.
    Type: Application
    Filed: September 30, 2019
    Publication date: January 23, 2020
    Applicant: Kingston Technology Corp.
    Inventors: PETER LEEKUO CHOU, Baron King Lee, Wei-Min Liang, Pen Hao Ma
  • Patent number: D875738
    Type: Grant
    Filed: November 2, 2018
    Date of Patent: February 18, 2020
    Assignee: Kingston Digital, Inc.
    Inventors: Albert Jin, Sean Peralta, Baron King Lee, Peter Leekuo Chou, Guan Hua Tzeng, Wei Min Liang