Abstract: An embedded capacitor device within a circuit board having an integrated circuitry thereon is provided. The circuit board has a common coupling area under the integrated circuitry. The embedded capacitor device includes a first capacitor section providing at least one capacitor to a first terminal set of the integrated circuitry and a second capacitor section providing at least one capacitor to a second terminal set of the integrated circuitry. A portion of the first capacitor section is in the common coupling area and has its coupling to the first terminal set located in the common coupling area. Similarly, a portion of the second capacitor section is in the common coupling area and has its coupling to the second terminal set located in the common coupling area.

Abstract: An embedded capacitor core includes a first set of capacitors, a second set of capacitors, and an inter-layer dielectric film between the first set of capacitors and the second set of capacitors. The first set of capacitors includes: a first conductive pattern comprising at least two conductive electrodes; a second conductive pattern comprising at least two conductive electrodes corresponding to the two conductive electrodes of the first conductive pattern; and a first dielectric film between the first conductive pattern and the second conductive pattern. The second set of capacitors includes: a third conductive pattern comprising at least two conductive electrodes; a fourth conductive pattern comprising at least two conductive electrodes corresponding to the two conductive electrodes of the fourth conductive pattern; and a second dielectric film between the third conductive pattern and the fourth conductive pattern.

Abstract: This invention discloses a composite distributed dielectric structure. It comprises one or more conductor layers, one or more dielectric layers distributed on the conductor layers, and one or more conductor traces distributed on the dielectric layers. One or more dielectric plates can be further around the conductor traces. The dielectric layers or plates may or may not have plural dielectric materials therein, respectively described in two embodiments. Each conductor trace lies on a dielectric material without crossing two different dielectric materials. Two or more dielectric layers may be stacked on the conductor layers The invention provides a low cost and practical dielectric structure for interconnect systems to reduce dielectric loss, cross talk, and signal propagation delay and to well control the impedance matching while maintaining proper heat dissipation and noise reduction at high frequency transmission.

Abstract: A multi-layered circuit board a built-in component including multiple terminals, at least one signal pad formed on a top surface of the multi-layered circuit board for signal transmission, each of the at least one signal pad corresponding to one of the multiple terminals, and at least one test pad formed on the top surface of the multi-layered circuit board, each of the at least one test pad corresponding to one of the at least one signal pad for testing an electric path extending from the one signal pad through the one terminal to the each of the at least one test pad.

Abstract: An interleaving striped capacitor substrate structure for pressing-type print circuit boards is disclosed. To meet the high-frequency, high-speed, and high-density requirements in modern electronic systems, the interleaving striped capacitor substrate structure uses several dielectric materials of different dielectric coefficients to make a dielectric layer. One dielectric layer can be stacked on another to form a multi-layered capacitor substrate so that a single capacitor substrate can provide the highest capacitance required for the decoupling capacitor to suppress high-frequency noise signals, and the lower dielectric coefficient substrate required for high-speed signal transmission. This simultaneously achieves the effects of reducing high-frequency transmission time and suppressing high-frequency noise.

Abstract: An interleaving striped capacitor substrate structure for pressing-type print circuit boards is disclosed. To meet the high-frequency, high-speed, and high-density requirements in modern electronic systems, the interleaving striped capacitor substrate structure uses several dielectric materials of different dielectric coefficients to make a dielectric layer. One dielectric layer can be stacked on another to form a multi-layered capacitor substrate so that a single capacitor substrate can provide the highest capacitance required for the decoupling capacitor to suppress high-frequency noise signals, and the lower dielectric coefficient substrate required for high-speed signal transmission. This simultaneously achieves the effects of reducing high-frequency transmission time and suppressing high-frequency noise.

Abstract: A compositive laminate substrate applicable for integrated and minimized electronic circuits is composed of at least an inorganic substrate and an organic substrate. The inorganic substrate is embedded with resistors, capacitors and inductors. Through the organic substrate (printed circuit boards), outer I/O ports are connected with the passive components of the inorganic substrate.

Abstract: A coaxial via hole structure used in a carrier is disclosed. The coaxial via hole includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor and an intermediate fill. The outer cylinder-shaped conductor extends along a first direction. The inner cylinder-shaped conductor is disposed in the outer cylinder-shaped conductor and also extends along the first direction. The intermediate fill is between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor and is made of insulating material or electrical-resistant material. The coaxial via hole structure can be applied as a capacitor or a resistor and has the function of signal shielding.

Abstract: A coaxial via hole structure used in a carrier is disclosed. The coaxial via hole includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor and an intermediate fill. The outer cylinder-shaped conductor extends along a first direction. The inner cylinder-shaped conductor is disposed in the outer cylinder-shaped conductor and also extends along the first direction. The intermediate fill is between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor and is made of insulating material or electrical-resistant material. The coaxial via hole structure can be applied as a capacitor or a resistor and has the function of signal shielding.

Abstract: A packaging structure with low switching noises is disclosed. In this structure, a chip capacitor is connected to a chip. The chip capacitor is a capacitor structure formed using a high dielectric material to provide a better noise filtering effect. Therefore, the invention can effectively lower switching noises.

Abstract: A regulable test IC system for signal noise on the electrical analysis point, comprising: a power supply, for providing a test voltage in the system; a pulse generator, for providing a test frequency in a noise testing of the system; a regulable test IC with different signal pads capable of regulable testing signal noise with the test frequency from the pulse generator and the test voltage from the power supply in a plurality of built-in specific structures, under the basis of an assigned current standard; and a digital detection device with a display, for displaying and recording the result of the regulable test.

Abstract: A packaging structure with low switching noises is disclosed. In this structure, a chip capacitor is connected to a chip. The chip capacitor is a capacitor structure formed using a high dielectric material to provide a better noise filtering effect. Therefore, the invention can effectively lower switching noises.

Abstract: An interleaving striped capacitor substrate structure for pressing-type print circuit boards are disclosed. To achieve the high-frequency, high-speed, and high-density trend in modern electronic systems, the interleaving striped capacitor substrate structure uses several dielectric materials of different dielectric coefficients to make a dielectric layer. According to the practical needs, one or both sides of the dielectric layer is adhered with a conductive metal layer to form a capacitor substrate so that a single capacitor substrate can provide the lower dielectric coefficient substrate required for high-speed signal transmissions and the high dielectric coefficient substrate required by the decoupling capacitor to suppress the high-frequency noise signals. This simultaneously achieves the effects of lowering the high-frequency transmission time and suppressing high-frequency noises.

Abstract: An electrical-resistant via hole structure used in a carrier is disclosed. The electrical-resistant via hole includes a via hole and electrical-resistant material. The via hole is in the carrier and extends along a first direction. The electrical-resistant material is placed into the via hole and contacts with first and second conductors. The assembly consisting of a first conductor, electrical-resistant material, and second conductor composes a resistor. The electrical-resistant via hole of the invention needs less area and reduces the size of PCBs.

Abstract: A regulable test IC system for signal noise on the electrical analysis point, comprising: a power supply, for providing a test voltage in the system; a pulse generator, for providing a test frequency in a noise testing of the system; a regulable test IC with different signal pads capable of regulable testing signal noise with the test frequency from the pulse generator and the test voltage from the power supply in a plurality of built-in specific structures, under the basis of an assigned current standard; and a digital detection device with a display, for displaying and recording the result of the regulable test.

Abstract: A coaxial via hole structure used in a carrier is disclosed. The coaxial via hole includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor and an intermediate fill. The outer cylinder-shaped conductor extends along a first direction. The inner cylinder-shaped conductor is disposed in the outer cylinder-shaped conductor and also extends along the first direction. The intermediate fill is between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor and is made of insulating material or electrical-resistant material. The coaxial via hole structure can be applied as a capacitor or a resistor and has the function of signal shielding.