Patents by Inventor Min Lin

Min Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11038077
    Abstract: A chip package includes a chip, a sidewall structure that has a first light-shielding layer, a second light-shielding layer, and a cover. The chip has a light emitter and a light receiver that are located on a top surface of the chip. The sidewall structure is located on the top surface of the chip and has two aperture areas. The light emitter and the light receiver are respectively located in the two aperture areas. The sidewall structure surrounds the light emitter and the light receiver, and at least one surface of the sidewall structure has the first light-shielding layer. The second light-shielding layer is located between the chip and the sidewall structure. The cover is located on a surface of the sidewall structure facing away from the chip, and at least covers the light receiver and the sidewall structure that surrounds the light receiver.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: June 15, 2021
    Assignee: XINTEC INC.
    Inventors: Yen-Shih Ho, Po-Han Lee, Chien-Min Lin, Yi-Rong Ho
  • Publication number: 20210175725
    Abstract: A multicell battery management system is disclosed. The multicell battery management system includes N batteries and a power control device, wherein N is a positive integer. The power control device forms a charging/discharging circuit using (N?1) batteries and respectively inspects the storage capacity of each of the N batteries. The battery not allocated to the charging/discharging circuit is defined as an offline battery. When the comparison between the storage capacity of the (N?1) batteries and the storage capacity of the offline battery respectively satisfies a switching condition, the power control device selects one of the (N?1) batteries to be disconnected from the charging/discharging circuit and used as a new offline battery, and the original offline battery is added to the charging/discharging circuit. Thus, the multicell battery management system not only effectively increases battery efficiency, but also prolongs usage time and battery life.
    Type: Application
    Filed: June 28, 2018
    Publication date: June 10, 2021
    Inventor: Tz-Min Lin
  • Patent number: 11027260
    Abstract: In embodiments a metal or metal alloy nanowires are assembled into a nanoporous membrane that can be used in methods for catalyzing various reactions under low pressures and achieving high flow rate of the reactions. In embodiments, the membranes of the disclosure can catalyze CuAAC reactions with high efficiency and minimum leaching of active Cu species.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: June 8, 2021
    Assignee: UCHICAGO ARGONNE, LLC
    Inventors: Xiao-Min Lin, Jiangwei Wen, Kun Wu, Jun Tian
  • Patent number: 11032073
    Abstract: A Man in the Middle (MitM) computer receives a first session identifier from a client for a first communication session between the client and a server, and monitors Transport Layer Security (TLS) communication sessions between the client and the server, where the first session identifier is one of an unknown session identifier and an invalid session identifier. In response to receiving the first session identifier from the client, the MitM computer performs one of: requesting a second session identifier from the server for a second communication session if the first session identifier is an unknown session identifier; and transmitting, to the client, an instruction to flush a session cache in the client, where flushing the session cache in the client forces the client and the server to establish a full TLS handshake in order to obtain a session key if the first session identifier is an invalid session identifier.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: June 8, 2021
    Assignee: International Business Machines Corporation
    Inventors: Cheng-Ta Lee, Ping Min Lin, Wei-Shiau Suen, Ming-Hsun Wu
  • Publication number: 20210164718
    Abstract: A container energy storage system is provided in this disclosure. The system includes a container and a plurality of functional assemblies. The container includes a container frame and a bottom plate. The container frame is formed a plurality of openings and a hollow main body. The bottom plate is disposed at the bottom of the container frame and is fixedly connected to the container frame. The functional assemblies are disposed in the hollow main body and located above the bottom plate.
    Type: Application
    Filed: March 16, 2020
    Publication date: June 3, 2021
    Inventors: Mu-Min LIN, Chin-Ming CHEN
  • Patent number: 11020711
    Abstract: A membrane for filtering one or more hydrophobic organic contaminants can include a porous nanostructure that includes one or more of a metal, a metal oxide, and a metal alloy nanostructure component functionalized with one or more amphiphilic ligands.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: June 1, 2021
    Assignee: UCHICAGO ARGONNE, LLC
    Inventors: Xiao-Min Lin, Kun Wu, Subramanian Sankaranarayanan
  • Publication number: 20210157445
    Abstract: A capacitive touch screen, having a first transparent substrate provided with a touch circuit layer. The touch circuit layer is provided with first and second electrodes and a jumper portion. The touch screen is further provided with an insulating layer. The insulating layer is continuously disposed in an entire transparent touch area of the touch screen, and is provided with through holes at the jumper portion to form a jumper connection of the second electrode. The touch screen further includes a shielding layer sandwiched between the first transparent substrate and the touch circuit layer, and contains multiple shielding blocks. The shielding blocks correspond to the through holes, and the contours of the shielding blocks are formed by expanding the contours of the through holes outwards. The capacitive touch screen can effectively reduce side light reflection on an edge slope of the insulating layer, thereby avoiding interference with display.
    Type: Application
    Filed: May 23, 2018
    Publication date: May 27, 2021
    Inventors: MIN LIN, Xichun WU, Yi SHEN, Yinghuang SUN, Keng LIN, Yuemin LV, Yuanming CHEN, Dezhi LIN, Jiatong GAO, Yongbin HUANG, Yan WANG, Dingji CHEN
  • Patent number: 11016621
    Abstract: A capacitive touch screen, having a first transparent substrate provided with a touch circuit layer. The touch circuit layer is provided with first and second electrodes and a jumper portion. The touch screen is further provided with an insulating layer. The insulating layer is continuously disposed in an entire transparent touch area of the touch screen, and is provided with through holes at the jumper portion to form a jumper connection of the second electrode. The touch screen further includes a shielding layer sandwiched between the first transparent substrate and the touch circuit layer, and contains multiple shielding blocks. The shielding blocks correspond to the through holes, and the contours of the shielding blocks are formed by expanding the contours of the through holes outwards. The capacitive touch screen can effectively reduce side light reflection on an edge slope of the insulating layer, thereby avoiding interference with display.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: May 25, 2021
    Inventors: Min Lin, Xichun Wu, Yi Shen, Yinghuang Sun, Keng Lin, Yuemin Lv, Yuanming Chen, Dezhi Lin, Jiatong Gao, Yongbin Huang, Yan Wang, Dingji Chen
  • Publication number: 20210152095
    Abstract: A full bridge converter having a wide output voltage range includes an input power source, a full bridge switching circuit, a transformer, a first rectifying circuit, a second rectifying circuit, a first output circuit, a second output circuit, and a control circuit. The transformer includes a magnetic core, a primary side winding, a first secondary side winding, and a second secondary side winding. The first rectifying circuit includes a first AC switch, a second AC switch and a first freewheeling diode, and the second rectifying circuit includes a third AC switch, a fourth AC switch and a second freewheeling diode. The control circuit, according to a duty cycle, controls the first AC switch and the third AC switch to be turned on during a positive half cycle, and controls the second AC switch and the fourth AC switch to be turned on during a negative half cycle.
    Type: Application
    Filed: March 4, 2020
    Publication date: May 20, 2021
    Inventors: JING-YUAN LIN, SHIH-MIN LIN, HSUAN-YU YUEH
  • Patent number: 11004816
    Abstract: A hetero-integrated structure includes a substrate, a die, a passivation layer, a first redistribution layer, a second redistribution layer, and connecting portions. The die is attached on the substrate. The die has an active surface and a non-active surface. The active surface has pads. The passivation layer covers sidewalls and a surface of the die to expose a surface of the pads. The first redistribution layer is located on the passivation layer and electrically connected to the pads. The second redistribution layer is located on the substrate and adjacent to the die. The connecting portions are connected to the first redistribution layer and the second redistribution layer.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: May 11, 2021
    Assignee: Industrial Technology Research Institute
    Inventors: Yu-Min Lin, Ang-Ying Lin, Sheng-Tsai Wu, Tao-Chih Chang, Wei-Chung Lo
  • Publication number: 20210121587
    Abstract: Disclosed is an integrated intracavity gas circulation treatment device for a laparoscopic surgery, includes a filtering unit and a driving pump unit. The filtering unit is provided with an air inlet channel, the driving pump unit is installed in the filtering unit, and communicated with the filtering unit; and the driving pump unit is provided, with an air exhausting channel. The device is capable of realizing integrated installation of the filtering unit and the driving pump unit, skillful in design, compact in structure, the device is simply and conveniently used and operated by a medical worker. In the whole surgery process, stability of an air pressure in the abdominal cavity is high, an effect of gas circulation filtering is good, surgery efficiency and quality are improved, and it is guaranteed that a contaminated and non-sterilizable work piecemay not be repeatedly used, so real zero infection is achieved.
    Type: Application
    Filed: August 31, 2020
    Publication date: April 29, 2021
    Inventors: Min Lin, Wenshuai Zhuo
  • Patent number: 10992268
    Abstract: A radio frequency signal amplification device includes an amplification circuit, an impedance matching circuit, a frequency detection circuit, and a control circuit. The amplification circuit has an input terminal and an output terminal. The amplification circuit amplifies a radio frequency (RF) signal received from the input terminal, and generates an amplified radio frequency signal to the output terminal. The impedance matching circuit is coupled to the input terminal or the output terminal of the amplification circuit. The impedance matching circuit receives the radio frequency signal and provides an impedance matching the radio frequency signal, or receives the amplified radio frequency signal and provides an impedance matching the amplified radio frequency signal. The frequency detection circuit determines a frequency band to which the radio frequency signal belongs. The control circuit adjusts the impedance of the impedance matching circuit according to the frequency band.
    Type: Grant
    Filed: September 15, 2019
    Date of Patent: April 27, 2021
    Assignee: RichWave Technology Corp.
    Inventors: Shyh-Chyi Wong, Cheng-Min Lin
  • Publication number: 20210118860
    Abstract: An image sensor package and a manufacturing method thereof are provided. The image sensor package includes a redistribution circuit structure; an image sensing chip disposed on the redistribution circuit structure and having a sensing surface, on which a sensing area and a first conductive pillar arranged in the periphery of the sensing area are disposed; a lid covering the sensing area; an encapsulant disposed on the redistribution circuit structure and encapsulating at least part of the image sensing chip and the cover; and a top tier semiconductor chip disposed above the image sensing chip and having an active surface on which a first conductor is disposed. The first conductor overlaps the image sensing chip in a direction perpendicular to the sensing surface. The first conductive pillar and the first conductor are aligned and bonded to each other to electrically connect the image sensing chip and the top tier semiconductor chip.
    Type: Application
    Filed: May 27, 2020
    Publication date: April 22, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Sheng-Tsai Wu, Yu-Min Lin, Yuan-Yin Lo, Ang-Ying Lin, Tzu-Hsuan Ni, Chao-Jung Chen, Shin-Yi Huang
  • Publication number: 20210111125
    Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes: an interposer including a dielectric body, a plurality of semiconductor bodies separated by the dielectric body, a through via penetrating through the dielectric body, and a wiring structure located in each of the plurality of semiconductor bodies; a plurality of semiconductor chips located side by side on a first surface of the interposer and electrically connected to the wiring structure; an encapsulant located on the first surface of the interposer and encapsulating at least a portion of the plurality of semiconductor chips; and a redistribution circuit structure located on a second surface of the interposer opposite to the first surface of the interposer and electrically connected to the plurality of semiconductor chips through the through via.
    Type: Application
    Filed: August 27, 2020
    Publication date: April 15, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Chao-Jung Chen, Yu-Min Lin, Sheng-Tsai Wu, Shin-Yi Huang, Ang-Ying Lin, Tzu-Hsuan Ni, Yuan-Yin Lo
  • Publication number: 20210111126
    Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes: an interposer including a wiring structure and an interposer via electrically connected to the wiring structure; a plurality of semiconductor chips located on a first surface of the interposer and electrically connected to each other through the interposer; an encapsulant located on the first surface of the interposer and encapsulating at least a portion of the plurality of semiconductor chips; and a redistribution circuit structure located on a second surface of the interposer opposite to the first surface, wherein the plurality of semiconductor chips are electrically connected to the redistribution circuit structure through at least the interposer.
    Type: Application
    Filed: October 8, 2020
    Publication date: April 15, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Ang-Ying Lin, Yu-Min Lin, Shin-Yi Huang, Sheng-Tsai Wu, Yuan-Yin Lo, Tzu-Hsuan Ni, Chao-Jung Chen
  • Publication number: 20210110933
    Abstract: A system for establishing a model for cardiac ventricular hypertrophy (VH) screening includes a storage and a processor. The storage stores multiple pieces of subject data respectively associated with multiple subjects. Each of the pieces of subject data contains a basic physiological parameter group, an electrocardiographic parameter group, and an actual VH condition that corresponds to a left or right ventricle of the subject associated with the piece of subject data. The processor is electrically connected to the storage, splits the pieces of subject data into a training set and a test set, and establishes the model for VH screening based on the pieces of subject data in the training set by using machine learning techniques.
    Type: Application
    Filed: October 11, 2019
    Publication date: April 15, 2021
    Inventor: Gen-Min Lin
  • Publication number: 20210111153
    Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes a redistribution circuit structure; a first semiconductor chip disposed on the redistribution structure and having a first active surface on which a first conductive post is disposed; a second semiconductor chip disposed above the first semiconductor chip and having a second active surface on which a first conductor is disposed; and a first encapsulant disposed on the redistribution circuit structure and encapsulating at least the first semiconductor chip, wherein the first conductive post and the first conductor are aligned and bonded to each other to electrically connect the first semiconductor chip and the second semiconductor chip.
    Type: Application
    Filed: October 8, 2020
    Publication date: April 15, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Min Lin, Ang-Ying Lin, Sheng-Tsai Wu, Chao-Jung Chen, Tzu-Hsuan Ni, Shin-Yi Huang, Yuan-Yin Lo
  • Patent number: 10961118
    Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. In some embodiments, a ventilation trench and an isolation trench are concurrently within a capping substrate. The isolation trench isolates a silicon region and has a height substantially equal to a height of the ventilation trench. A sealing structure is formed within the ventilation trench and the isolation trench, the sealing structure filing the isolation trench and defining a vent within the ventilation trench. A device substrate is provided and bonded to the capping substrate at a first gas pressure and hermetically sealing a first cavity associated with a first MEMS device and a second cavity associated with a second MEMS device. The capping substrate is thinned to open the vent to adjust a gas pressure of the second cavity.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: March 30, 2021
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Chia Lee, Chin-Min Lin, Cheng San Chou, Hsiang-Fu Chen, Wen-Chuan Tai, Ching-Kai Shen, Hua-Shu Ivan Wu, Fan Hu
  • Patent number: 10961100
    Abstract: A magnetic screwdriver device includes a pad without magnetism, a driving shaft, and a driven shaft. The two shafts, magnetically attracted to each other, are disposed on opposite sides of the pad. The driving shaft is used to transmit a torque to rotate the driven shaft. When the torque exceeds a predetermined value to overcome a friction force between the driven shaft and the pad, the driven shaft would be stopped.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: March 30, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE H
    Inventors: Chang-Min Lin, Wei-Chieh Chang, Hsuan-Yu Huang
  • Publication number: 20210082810
    Abstract: A package substrate includes a substrate, an insulating protective layer and an interposer. The substrate has a first surface and a second surface opposing to the first surface. The substrate includes a plurality of first conductive pads embedded in the first surface. The insulating protective layer is disposed on the first surface of the substrate. The insulating protective layer has an opening for exposing the first conductive pads embedded in the first surface of the substrate. The interposer has a top surface and a bottom surface opposing to the top surface. The interposer includes a plurality of conductive vias and a plurality of second conductive pads located on the bottom surface. The interposer is located in a recess defined by the opening of the insulating protective layer and the first surface of the substrate. Each of the second conductive pads is electrically connected to corresponding first conductive pad.
    Type: Application
    Filed: November 12, 2020
    Publication date: March 18, 2021
    Applicants: Industrial Technology Research Institute, Unimicron Technology Corp.
    Inventors: Yu-Hua Chen, Wei-Chung Lo, Tao-Chih Chang, Yu-Min Lin, Sheng-Tsai Wu