Abstract: Provided are certain IDO inhibitors or pharmaceutically acceptable salts thereof which can inhibit enzymatic activity of indoleamine 2,3-dioxygenase (IDO) and may be useful for the treatment of diseases and disorders mediated by IDO. In addition, pharmaceutical compositions thereof and methods of use thereof are also provided.

Abstract: The invention provides an electrode for a prostate surgery and a using method thereof, and belongs to the technical field of medical apparatus and instruments. The electrode includes an electrode body, and the electrode body is provided with a concave arc surface and a convex arc surface; the electrode body includes a base body, an anterior resecting portion and a posterior resecting portion. The electrode has functions of being enucleatable and resectable, and also has a function of enlarging a hemostatic area, and is capable of improving the hemostatic effect and improving the hemostatic efficiency, thereby the efficiency of the surgery may be improved, the operation difficulty and risk of the surgery are reduced, the bleeding and injury of a patient during the prostate surgery are also reduced at the same time, the safety and success rate of the prostate surgery are improved, and the patients are benefited.

Abstract: The present invention is directed to a composition of temporary crown materials, comprising a powder reagent and a liquid reagent; wherein the powder reagent comprises PMMA and an initiator, and the liquid reagent comprises MMA, a catalyst, and a plasticizer; wherein the plasticizer is a citrate ester compound. The composition of temporary crown materials of the present invention has high hardness, high toughness, high flexural strength and excellent biocompatibility.

Abstract: The present invention discloses a plasma operation electrode for an otolaryngology department. The plasma operation electrode for the otolaryngology department includes a tubular loop electrode, a water absorption tube and an effluent flow guiding component. The water absorption tube is sheathed in the tubular loop electrode, a water inlet channel is formed between the water absorption tube and the tubular loop electrode. An end part, away from the handle, of the tubular loop electrode is provided with at least one water outlet hole. The effluent flow guiding component is correspondingly installed at the water outlet hole, and sealed and connected on an outer wall of the tubular loop electrode. A water injecting channel is formed between the effluent flow guiding component and the tubular loop electrode. The plasma operation electrode for the otolaryngology department has a good flow guiding effect to normal saline, and high in reliability and safety.

Abstract: A semiconductor package including a semiconductor die, a molding compound and a redistribution structure is provided. The molding compound laterally wraps around the semiconductor die, wherein the molding compound includes a base material and a first filler particle and a second filler particle embedded in the base material. The first filler particle has a first recess located in a top surface of the first filler particle, and the second filler particle has at least one hollow void therein. The redistribution structure is disposed on the semiconductor die and the molding compound, wherein the redistribution structure has a polymer dielectric layer. The polymer dielectric layer includes a body portion and a first protruding portion protruding from the body portion, wherein the body portion is in contact with the base material and the top surface of the first filler particle, and the first protruding portion fits with the first recess of the first filler particle.

Abstract: The present disclosure provides a plug connector adapted to insert into a receptacle connector, the receptacle connector includes a cage having an opening. The plug connector includes a metal shell and a conductive elastic member. The metal shell is provided with a recessed groove. The conductive elastic member includes a conductive elastic body, the conductive elastic body has a holding portion held in the recessed groove and a first electromagnetic shielding portion extending out of the recessed groove from the holding portion, when the plug connector is inserted forwardly into the receptacle connector, the first electromagnetic shielding portion enters into the opening of the cage of the receptacle connector and mechanically and electrically contacts the cage and the metal shell. However, some embodiments may not include a holding portion or recessed groove.

Abstract: A radio frequency amplifier circuit is provided. A matching circuit is configured on a radio frequency path of an input end or an output end of an amplifier. An inductance-capacitance resonance circuit and the matching circuit share an inductor included in the matching circuit to generate a corresponding resonance frequency. The matching circuit provides an input impedance or an output impedance matching two fundamental tones in a radio frequency signal at a first frequency and a second frequency. The inductance-capacitance resonance circuit provides a filtering path for filtering a signal component outside a frequency band formed by the first frequency and the second frequency in the radio frequency signal.

Abstract: A heat dissipation unit includes a main body and a mesh body. The main body has an upper plate and a lower plate. The upper and lower plates are correspondingly overlapped and mated with each other to together define an airtight chamber. A working fluid is contained in the airtight chamber. One face of the lower plate, which faces the airtight chamber, is formed with a capillary structure by means of laser processing. The mesh body is attached to the face of the lower plate with the capillary structure. By means of the mesh body, the liquid working fluid backflow efficiency of the capillary structure can be enhanced and the water content of the internal evaporation section of the heat dissipation unit can be increased to avoid dry burn.

Abstract: A memory storage apparatus including a memory array and a controller circuit is provided. The memory array is configured to store a first error correcting code and a first data. The controller circuit is coupled to the memory array. The controller circuit is configured to read the first data from the memory array and determine whether an error bit of the first data is one of one or more data mask bits to decide whether to update the first error correcting code stored in the memory array. The controller circuit includes a switch element. The switch element is coupled to the memory array. The switch element receives the first data from the memory array. An error correcting procedure is not performed on the first data. In addition, a data access method is also provided.

Abstract: A chip package structure including first and second insulating layers, first and second circuit structures, a chip on the first circuit structure, an encapsulant, a conductive through via, and first and second heat dissipation layers is provided. The first circuit structure is disposed at the first surface of the first insulating layer. The bottom electrode of the chip is electrically connected to the first circuit structure. The second circuit structure is disposed on the chip and electrically connected to the top electrode of the chip. The encapsulant encapsulates the first and second circuit structures and the chip. The conductive through via is disposed in the encapsulant and connects the first and second circuit structures. The second insulating layer is disposed on the second circuit structure. The first heat dissipation layer is disposed on the first insulating layer. The second heat dissipation layer is disposed on the second insulating layer.

Abstract: The present disclosure relates to a micro-electro mechanical system (MEMS) package and a method of achieving differential pressure adjustment in multiple MEMS cavities at a wafer-to-wafer bonding level. A device substrate comprising first and second MEMS devices is bonded to a capping substrate comprising first and second recessed regions. A ventilation trench is laterally spaced apart from the recessed regions and within the second cavity. A sealing structure is arranged within the ventilation trench and defines a vent in fluid communication with the second cavity. A cap is arranged within the vent to seal the second cavity at a second gas pressure that is different than a first gas pressure of the first cavity.

Abstract: A proximity sensing device which is disposed under the OLED panel and has an emitting module and a receiving module, is provided. The emitting module can emit an invisible light which has a peak wavelength not less than 1000 nm. The receiving module is disposed adjacent to the emitting module and can receive a reflecting light from the reflected invisible light. Therefore, the invisible light passing through the OLED panel will not cause a bright spot on the panel.

Abstract: A chip scale package structure is provided. The chip scale package structure includes an image sensor chip and a chip. The image sensor chip includes a first redistribution layer including a conductive wire and a conductive pad formed on the conductive wire, wherein the conductive pad is exposed from the surface of the first redistribution layer. The chip includes a plurality of through silicon via (TSV) and a second redistribution layer including a conductive wire and a conductive pad formed on the conductive wire, wherein the conductive pad is exposed from the surface of the second redistribution layer. The area of the chip is smaller than that of the image sensor chip. The second redistribution layer of the chip bonds to the first redistribution layer of the image sensor chip.

Abstract: A plug connector having a protective member replacing a gold finger on a circuit board includes an insulation base, a cable terminal block, and a grip. The insulation base includes a top wall, a bottom wall, and two side walls. The cable terminal block includes at least one cable including multiple conductors. The circuit board includes a contact section and a solder section, and the width of the solder section is greater than the width of the contact section. Two stopping and grounding parts are respectively formed on both sides of the solder section adjacent to the contact section. The circuit board includes multiple conductive pads on a surface of the contact section and multiple solder pads on a surface of the solder section. The conductors of the cable are separately soldered to solder pads. The protective member is clipped to the contact section of the circuit board.

Abstract: A multilayer filter screen and the manufacturing method thereof are provided. The multilayer filter screen includes a conductive powder layer and a plastic powder layer. The conductive powder layer and the plastic powder layer are stacked up through a solidifying process. Therefore, the mechanical structural strength and the anti-static electricity function of the multilayer filter screen are improved.

Abstract: A method of fabricating a sensing apparatus is disclosed. The method includes providing a substrate that includes a plurality of image sensors, forming an optical filtering film on the substrate, and forming a collimator on the optical filtering film. The method further includes forming a blocking layer on the collimator and forming an illumination layer on the blocking layer. The illumination layer is configured to illuminate an object placed above the illumination layer. The image sensors are configured to detect a portion of light reflected from the object.

Abstract: A plug connector having a protective member replacing a gold finger on a circuit board includes an insulation base, a cable terminal block, and a grip. The insulation base includes a top wall, a bottom wall, and two side walls. The cable terminal block includes at least one cable including multiple conductors. The circuit board includes a contact section and a solder section, and the width of the solder section is greater than the width of the contact section. Two stopping and grounding parts are respectively formed on both sides of the solder section adjacent to the contact section. The circuit board includes multiple conductive pads on a surface of the contact section and multiple solder pads on a surface of the solder section. The conductors of the cable are separately soldered to solder pads. The protective member is clipped to the contact section of the circuit board.

Abstract: An optoelectronic device is disclosed, comprising: a photodiode array including a plurality of first photodiodes, each first photodiode including a respective n+ region and a respective n-well region; a guide array disposed over the photodiode array, the guide array including a plurality of guide members separated from one another by a layer of light-blocking material, the guide members being aligned with the n+ regions of the first photodiodes, such that each guide member is disposed over a different respective n+ region, and the layer of light-blocking material being aligned with the n-well regions of the first photodiodes; and a filter array disposed over the guide array, the filter array including a plurality of bandpass filters, each bandpass filter being aligned with a different one of the plurality of guide members, each bandpass filter having a different transmission band.

Abstract: Optical sensors and their making methods are described herein. In some embodiments, a described sensing apparatus includes: an image sensor; a collimator above the image sensor, wherein the collimator includes an array of apertures; and an optical filtering layer above the collimator, wherein the optical filtering layer is configured to filter a portion of light to be transmitted into the array of apertures.