Patents by Inventor Min Lin

Min Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180048434
    Abstract: An apparatus of a memory system and an operating method thereof includes: a plurality of memory devices; and a controller including a decoder and a BER predictor, coupled with the plurality of memory devices, configured to perform a decoding iteration includes to conduct NAND read and generate NAND data; decode in accordance with the NAND data and generate decoder information by the decoder; predict a BER in accordance with at least the decode information by the BER predictor; and evaluate the predicted BER and generate evaluation result by the BER predictor.
    Type: Application
    Filed: August 10, 2017
    Publication date: February 15, 2018
    Inventors: Naveen KUMAR, Aman BHATIA, Yi-Min LIN
  • Publication number: 20180033736
    Abstract: A semiconductor device package includes a substrate, a component on a surface of the substrate, a package body encapsulating the component, and an electromagnetic interference (EMI) shield conformally formed on the package body, where the EMI shield has a side portion defining an opening.
    Type: Application
    Filed: July 28, 2016
    Publication date: February 1, 2018
    Inventors: Ji-Min LIN, Ming-Wen Liao, Chun-Ying Huang
  • Publication number: 20180019178
    Abstract: A chip packaging includes a substrate, a first chip, a molding material, a first circuit, and a second circuit. The substrate includes a bottom surface, a first top surface disposed above the bottom surface with a first height, and a second top surface disposed above the bottom surface with a second height. The first height is smaller than the second height. The first chip is disposed on the first top surface. The molding material is disposed on the substrate and covers the first chip. The first and second circuits are disposed on the molding material, and are respectively and electrically connected to the first chip and the second top surface of the substrate. The substrate is made of copper material with huge area and has the properties of high current withstand capacity and high thermal efficiency. The second top surface protects the first chip from damage.
    Type: Application
    Filed: July 12, 2017
    Publication date: January 18, 2018
    Applicant: Industrial Technology Research Institute
    Inventors: Yu-Min Lin, Kuo-Shu Kao, Jing-Yao Chang, Tao-Chih Chang
  • Publication number: 20180020020
    Abstract: In response to receiving an unknown first session identifier from a client for a first communication session between the client and a server, a Man in the Middle (MitM) computer requests a second session identifier from the server for a second communication session between the server and the MitM computer. The MitM computer generates a third session identifier for a third communication session between the MitM computer and the client. The MitM computer generates a fourth communication session between the server and the client using a combination of the second communication session and the third communication session. In response to receiving an invalid session identifier from the client for a fifth communication session between the client and the server, the MitM computer transmits an instruction, to the client, to flush a session cache in the client to force a full TLS handshake between the client and the server.
    Type: Application
    Filed: July 15, 2016
    Publication date: January 18, 2018
    Inventors: CHENG-TA LEE, PING MIN LIN, WEI-SHIAU SUEN, MING-HSUN WU
  • Patent number: 9856139
    Abstract: The present disclosure relates to a method of forming a micro-electro mechanical system (MEMs) structure. In some embodiments, the method may be performed by providing a device substrate having a first MEMS device and a second MEMS device, and by providing a capping structure having a first cavity and a second cavity. The capping structure is bonded to the device substrate, such that the first cavity is arranged over the first MEMS device and the second cavity is arranged over the second MEMS device. A first pressure is established within the first cavity and the second cavity. A vent is selectively etched within the capping structure to change the first pressure within the second cavity to a second pressure, which is different from the first pressure.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: January 2, 2018
    Assignee: Taiwan Semiconductor Maunfacturing Co., Ltd.
    Inventors: Hsin-Ting Huang, Hsiang-Fu Chen, Wen-Chuan Tai, Shao-Chi Yu, Chia-Ming Hung, Allen Timothy Chang, Bruce C. S. Chou, Chin-Min Lin
  • Publication number: 20170373706
    Abstract: A memory device can include a memory array, a processor coupled to the memory array, and a decoding apparatus. The decoding apparatus is configured to perform parallel decoding of codewords. Each of the codewords has a plurality of data blocks, each data block having a number of data bits. The decoding apparatus is configured to decode in parallel two or more codewords, which share a common data block, to determine error information associated with each codeword. For each error, the error information identifies a data block having the and associated error bit patterns. The decoding apparatus is configured to update the two or more codewords based on the identified data blocks having errors and the associated error bit patterns.
    Type: Application
    Filed: April 28, 2017
    Publication date: December 28, 2017
    Inventors: Yi-Min Lin, Aman Bhatia, Naveen Kumar, Johnson Yen
  • Patent number: 9847225
    Abstract: An integrated circuit device and method for manufacturing the integrated circuit device are disclosed. The disclosed method comprises forming a wedge-shaped recess with an initial bottom surface in the substrate; transforming the wedge-shaped recess into an enlarged recess with a height greater than the height of the wedge-shaped recess; and epitaxially growing a strained material in the enlarged recess.
    Type: Grant
    Filed: November 15, 2011
    Date of Patent: December 19, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun-Fai Cheng, An-Shen Chang, Hui-Min Lin, Tsz-Mei Kwok, Hsien-Ching Lo
  • Publication number: 20170356242
    Abstract: A blind assembly includes first and second side seats, a rotatable winding shaft, a shade member wound on the winding shaft, and a winding device. The winding device has a fixing unit, a coupling barrel, and a scroll spring. The fixing unit has a fixing portion disposed non-rotatably on the first side seat, and a spring-mounting portion extending oppositely to the fixing portion. The coupling barrel is disposed in and co-rotatable with the winding shaft, and is rotatable relative to the fixing unit. The scroll spring has opposite ends disposed respectively on the spring-mounting portion and the coupling barrel, such that rotation of the coupling barrel generates a resilient force for retracting the shade member.
    Type: Application
    Filed: June 14, 2016
    Publication date: December 14, 2017
    Inventor: Ke-Min LIN
  • Publication number: 20170343718
    Abstract: A lighting system including a LED light source, a convex lens, and a light guide post disposed between the LED light source and the convex lens. The light guide post includes a light emitting portion and a light collecting portion connected to the light emitting portion. The light emitting portion has a light guide post-light emitting surface facing the convex lens. The light collecting portion has an internal reflective surface including at least an elliptical surface having a first focal point and a second focal point. The second focal point is located between the first focal point and the convex lens, and the second focal point is located inside the light guide post.
    Type: Application
    Filed: April 27, 2017
    Publication date: November 30, 2017
    Inventors: Yu-Min Lin, Tsung-Huan Tsai, Mong-Ea Lin
  • Publication number: 20170347444
    Abstract: The present invention provides a manufacturing method of a curved circuit board which includes the following steps. The first step is to provide a flexible substrate. The next step is to form a patterned catalyst layer on the flexible substrate. The next step is to deposit metal on the patterned catalyst layer by electroless plating to form a wiring substrate, wherein the wiring substrate includes a planar wiring structure. The last step is to place the wiring substrate into a mold having a molding surface with a three-dimensional design, and then execute a heating process to shape the planar wiring structure to a three-dimensional wiring structure, wherein the heated wiring substrate is laminated to the molding surface of the mold. The present invention further provides an electronic product using the curved circuit board.
    Type: Application
    Filed: May 25, 2016
    Publication date: November 30, 2017
    Inventors: YU-MIN LIN, CHIA-PIN WANG, CHIA-CHING SUNG, NA LU
  • Publication number: 20170331500
    Abstract: A memory device can include a memory array, a processor coupled to the memory array, and a decoding apparatus. The decoding apparatus is configured to perform parallel decoding of codewords. Each of the codewords has a plurality of data blocks, and each data block having a number of data bits. The decoding apparatus is configured to decode, in parallel, a first codeword with one or more other codewords to determine error information associated with each codeword. For errors in a common data block shared between two codewords being decoded in parallel, the error information includes a data block identifier and associated error bit patterns. Further, the decoding apparatus is configured to update the codewords based on the error information.
    Type: Application
    Filed: August 3, 2017
    Publication date: November 16, 2017
    Inventors: Aman Bhatia, Yi-Min Lin, Naveen Kumar, Johnson Yen
  • Publication number: 20170310342
    Abstract: Techniques are described for codeword decoding. In an example, a system computes a checksum for a codeword based on the codeword and a parity check matrix. The system compares the checksum to thresholds. Each threshold is associated with a different decoder from a plurality of decoders available on the system. The system selects a decoder from the plurality of decoders. The decoder is selected based on the comparison of the checksum to the thresholds. The system decodes the codeword by using the selected decoder.
    Type: Application
    Filed: March 8, 2017
    Publication date: October 26, 2017
    Inventors: Johnson Yen, HongChich Chou, Yi-Min Lin
  • Publication number: 20170309675
    Abstract: A device includes a semiconductor substrate, a plurality of micro-lenses disposed on the substrate, each micro-lens being configured to direct light radiation to a layer beneath the plurality of micro-lenses. The device further includes a transparent layer positioned between the plurality of micro-lenses and the substrate, the transparent layer comprising a structure that is configured to block light radiation that is traveling towards a region between adjacent micro-lenses, wherein the structure and the transparent material are coplanar at respective top surfaces and bottom surfaces thereof.
    Type: Application
    Filed: July 12, 2017
    Publication date: October 26, 2017
    Inventors: Chin-Min Lin, Ching-Chun Wang, Dun-Nian Yaung, Chun-Ming Su, Tzu-Hsuan Hsu
  • Patent number: 9799750
    Abstract: A semiconductor device and a method for fabricating the semiconductor device are disclosed. An isolation structure is formed in a substrate and a gate stack is formed atop the isolation structure. A spacer is formed adjoining a sidewall of the gate stack and extends beyond an edge of the isolation structure. The disclosed method provides an improved method for protecting the isolation structure by using the spacer. The spacer can prevent the isolation structure from being damaged by chemicals, therefor, to enhance contact landing and upgrade the device performance.
    Type: Grant
    Filed: July 17, 2012
    Date of Patent: October 24, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Fai Cheng, Han-Ting Tsai, An-Shen Chang, Hui-Min Lin
  • Publication number: 20170294923
    Abstract: Techniques are described for optimizing a parity-check matrix for a low density parity check (LDPC) encoder. In an example, a first parity-check matrix is accessed. Based on a set of rules, an independent set of check nodes and variable nodes is determined. The set of rules specifies that a check node associated with the first parity-check matrix belongs to the independent set when the check node is connected to only one variable node from the independent set. The set of rules further specifies that a variable node associated with the first parity-check matrix belongs to the independent set when the variable node is connected to only one check node from the independent set. A size of the independent set is based on the set of rules. A second parity-check matrix is generated by at least applying a permutation to the first parity-check matrix based on the independent set.
    Type: Application
    Filed: February 13, 2017
    Publication date: October 12, 2017
    Inventors: Aman Bhatia, Wei-Hao Yuan, Yi-Min Lin, Naveen Kumar, Fan Zhang, Johnson Yen
  • Publication number: 20170279467
    Abstract: Techniques are described for decoding a codeword. In one example, the techniques include obtaining a first message comprising reliability information corresponding to each bit in the first codeword, determining a plurality of least reliable bits in the first codeword, and generating a plurality of flipped messages by flipping one or more of the plurality of least reliable bits in the first codeword. A number of the plurality of least reliable bits is equal to a first parameter and a number of flipped bits in each of the plurality of flipped messages is less than or equal to a second parameter. The method further includes decoding one or more of the plurality of flipped messages using a hard decoder to generate one or more candidate codewords.
    Type: Application
    Filed: February 14, 2017
    Publication date: September 28, 2017
    Inventors: Aman Bhatia, Naveen Kumar, Yi-Min Lin, Lingqi Zeng
  • Publication number: 20170279466
    Abstract: An apparatus for decoding a TPC codeword is disclosed. The apparatus includes a memory and a processor coupled to the memory. The processor is configured to receive a first set of soft information corresponding to the TPC codeword. The TPC codeword includes at least one codeword corresponding to each of first, second, and third dimensions. The processor is further configured to iteratively perform a first soft decoding procedure on the at least one codeword corresponding to the first dimension to generate a first candidate codeword and upon determining that the first candidate codeword is not a correct codeword, and perform a second decoding procedure on the at least one codeword corresponding to the third dimension to generate a second candidate codeword. The second decoding procedure generates a second set of soft information to be used at a later iteration of the first decoding procedure.
    Type: Application
    Filed: February 15, 2017
    Publication date: September 28, 2017
    Inventors: Yi-Min Lin, Aman Bhatia, Naveen Kumar, Johnson Yen
  • Publication number: 20170279465
    Abstract: In one embodiment, an apparatus for decoding is disclosed. The apparatus includes a memory and at least one processor coupled to the memory. The at least one processor is configured to obtain one or more parameters corresponding to a system, determine a plurality of settings corresponding to an adaptive soft decoding procedure for decoding a product code, wherein the plurality of settings are determined based on the one or more parameters using a trellis, and determine a decoded codeword by performing the adaptive soft decoding procedure on the received codeword, wherein the adaptive soft decoder utilizes the determined plurality of settings.
    Type: Application
    Filed: February 13, 2017
    Publication date: September 28, 2017
    Inventors: Naveen Kumar, Aman Bhatia, Yi-Min Lin
  • Publication number: 20170279463
    Abstract: Techniques are described for decoding a first message. In one example, the techniques include obtaining a second message comprising reliability information corresponding to each bit in the first message, performing a soft decision decoding procedure on the second message to generate a decoded codeword, wherein the soft decision decoding procedure comprises a joint decoding and miscorrection avoidance procedure, and outputting the decoded codeword.
    Type: Application
    Filed: February 13, 2017
    Publication date: September 28, 2017
    Inventors: Aman Bhatia, Yi-Min Lin, Naveen Kumar, Fan Zhang
  • Publication number: 20170279468
    Abstract: A memory device includes a memory array, a processor, and a decoding apparatus. The processor is coupled to the memory array and configured to read encoded data from the memory array. The encoded data includes a plurality of data blocks and each data block is included in two or more data codewords. Further, data codewords belonging to a same pair of data codewords share a common data block. The decoding apparatus is configured to iteratively decode data codewords using hard decoding and soft decoding, and to correct stuck errors by identifying failed data blocks based on shared blocks between failed data codewords.
    Type: Application
    Filed: March 15, 2017
    Publication date: September 28, 2017
    Inventors: Naveen Kumar, Aman Bhatia, Yi-Min Lin