Abstract: A memory device can include a plurality of memory banks coupled to an input/output bus and a memory controller coupled to the plurality of memory banks. The memory controller can be configured to control operations of the plurality of memory banks, where each of the plurality of memory banks can include a bank array including a plurality of memory cells configured to store data, a latch circuit coupled to the input/output bus, where the latch circuit can be configured to store target data received via the input/output bus to provide stored target data, and a comparison circuit coupled to the latch circuit, where the comparison circuit can be configured to compare stored data output by the bank array with the stored target data to provide result data to the memory controller.

Abstract: The present invention relates to a super absorbent polymer and a method for preparing the same. According to the method for preparing a super absorbent polymer of the present invention, the super absorbent polymer +having improved absorption capacity and permeability can be prepared.

Abstract: A memory device includes a memory cell array that includes a plurality of memory cell rows; and a refresh address generator configured to store flags respectively corresponding to the plurality of memory cell rows, generate refresh row addresses respectively corresponding to the plurality of memory cell rows by performing a count operation, and according to the flags, change a refresh period of the plurality of memory cell rows.

Abstract: A device, system, and/or method includes an internal circuit configured to perform at least one function, an input-output terminal set and a repair circuit. The input-output terminal set includes a plurality of normal input-output terminals connected to an external device via a plurality of normal signal paths and at least one repair input-output terminal selectively connected to the external device via at least one repair signal path. The repair circuit repairs at least one failed signal path included in the normal signal paths based on a mode signal and fail information signal, where the mode signal represents whether to use the repair signal path and the fail information signal represents fail information on the normal signal paths. Using the repair circuit, various systems adopting different repair schemes may be repaired and cost of designing and manufacturing the various systems may be reduced.

Abstract: A semiconductor memory device which includes a memory cell array, an error injection register set, a data input buffer, a write data generator, and control logic. The error injection register set stores an error bit set, including at least one error bit, based on a first command. The error bit set is associated with a data set to be written in the memory cell array. The data input buffer stores the data set to be written in the memory cell array based on a second command. The write data generator generates a write data set to be written in the memory cell array based on the data set and the error bit set. The control logic controls the error injection register set and the data input buffer.

Abstract: The present invention relates to a super absorbent polymer exhibiting more improved absorption under pressure and liquid permeability, even while basically maintaining excellent centrifuge retention capacity and absorption rate, and a method for producing the same. The super absorbent polymer comprises: a base polymer powder including a first crosslinked polymer of a water-soluble ethylenically unsaturated monomer having at least partially neutralized acidic groups; and a surface crosslinked layer formed on the base polymer powder and including a second crosslinked polymer in which the first crosslinked polymer is further crosslinked via a surface crosslinking agent, wherein the surface crosslinking agent includes at least two compounds having a solubility parameter value (?) of 12.

Abstract: A memory device includes a memory cell array that includes a plurality of memory cell rows; and a refresh address generator configured to store flags respectively corresponding to the plurality of memory cell rows, generate refresh row addresses respectively corresponding to the plurality of memory cell rows by performing a count operation, and according to the flags, change a refresh period of the plurality of memory cell rows.

Abstract: A device, system, and/or method includes an internal circuit configured to perform at least one function, an input-output terminal set and a repair circuit. The input-output terminal set includes a plurality of normal input-output terminals connected to an external device via a plurality of normal signal paths and at least one repair input-output terminal selectively connected to the external device via at least one repair signal path. The repair circuit repairs at least one failed signal path included in the normal signal paths based on a mode signal and fail information signal, where the mode signal represents whether to use the repair signal path and the fail information signal represents fail information on the normal signal paths. Using the repair circuit, various systems adopting different repair schemes may be repaired and cost of designing and manufacturing the various systems may be reduced.

Abstract: The present disclosure relates to an economical method of preparing a resin composition including a polyalkylene carbonate with improved thermal stability and processability. More specifically, the method of preparing a resin composition includes the steps of polymerizing carbon dioxide and an epoxide compound in the presence of a zinc-based catalyst and a solvent, recovering monomers, removing the catalyst and recovering raw materials, solution-blending with a thermostable resin to improve the thermal stability and processability, and removing the solvent and byproducts from the reaction mixture by using an agitated flash drum and an extrusion or kneader-type devolatilizer.

Abstract: A preparation method of a superabsorbent polymer, and a superabsorbent polymer prepared thereby are provided. The preparation method of the superabsorbent polymer according to the present disclosure prevents polymer particles from being broken or the surface thereof from being damaged during preparation and handling of the superabsorbent polymer, thereby providing a superabsorbent polymer having excellent absorption properties and permeability.

Abstract: Systems and methods for simultaneous radio frequency (“RF”) transmission and reception for nuclear magnetic resonance applications, such as magnetic resonance imaging (“MRI”) are described. The system includes a simultaneous transmit and receive (“STAR”) control system that compensates for the effects of load changes in a radio frequency (“RF”) coil due to the inevitable motion of living subjects (e.g., from subject motion, respiration, swallowing). The system also maintains a high transmit-receive isolation, even when scanning a subject using a continuous RF broad band sweep excitation.

Abstract: A semiconductor memory device includes a plurality of memory banks in a first region, a data terminal to which an input data signal is input, the data terminal being in a second region, and an inverting circuit that inverts or non-inverts the input data signal in response to an inversion control signal indicating whether the input data signal has been inverted, wherein at least one inverting circuit is disposed for each of the plurality of memory banks.

Abstract: A memory device including a stack semiconductor device including; an upper substrate vertically stacked on a lower substrate, the upper substrate including N upper through-silicon vias (UTSV) and upper driving circuits, and the lower substrate including N lower through-silicon vias (LTSV) and lower driving circuits, wherein each one of the upper driving circuits is stagger-connected between a Kth UTSV and a (K+1)th LTSV, where ‘N’ is a natural number greater than 1, and ‘K’ is a natural number ranging from 1 to (N?1).

Abstract: A memory cell array may include a normal cell array and a spare cell array, the normal cell array having a plurality of normal memory cells connected to normal lines and the spare memory cell array having a plurality of spare memory cells connected to spare lines configured to replace a failed normal memory cell with a spare memory cell. A spare line address encoding circuit may be configured to generate a spare line address which encodes spare line enable signals being applied when a spare line replacing a normal line is activated to indicate a physical location of the spare line being activated. A spare line adjacent address generator may be configured to generate spare line adjacent address based on the spare line address, and to activate spare lines physically adjacent to the activated spare line.

Abstract: Provided are a method and an apparatus for repairing a memory cell in a memory test system. A test device detects a fail address by testing a memory device according to a test command, and temporarily stores the fail address in a fail address memory (FAM). The fail address is transmitted to the memory device according to a fail address transmission mode, is temporarily stored in a temporary fail address storage of the memory device, and is then stored in an anti-fuse array, which is a non-volatile storage device. To secure the reliability of data, stored data can be read to verify the data and a verification result can be transmitted in series or in parallel to the test device.

Abstract: A semiconductor memory device includes a memory cell array, a repair control circuit and a refresh control circuit. The memory cell array includes a plurality of memory cells and a plurality of redundancy memory cells. The repair control circuit receives a repair command and performs a repair operation on a first defective memory cell among the plurality of memory cells during a repair mode. The semiconductor memory device may operate in a repair mode in response to the repair command. The refresh control circuit performs a refresh operation on non-defective ones of the plurality of memory cells during the repair mode.

Abstract: A memory device including: an error correction code (ECC) cell array; an ECC engine configured to receive write data to be written to a memory cell array and generate internal parity bits for the write data; and an ECC select unit configured to receive the internal parity bits and external parity bits and, in response to a first level of a control signal, store the internal parity bits in the ECC cell array and, in response to a second level of the control signal store the external parity bits in the ECC cell array.

Abstract: Provided are a method and an apparatus for repairing a memory cell in a memory test system. A test device detects a fail address by testing a memory device according to a test command, and temporarily stores the fail address in a fail address memory (FAM). The fail address is transmitted to the memory device according to a fail address transmission mode, is temporarily stored in a temporary fail address storage of the memory device, and is then stored in an anti-fuse array, which is a non-volatile storage device. To secure the reliability of data, stored data can be read to verify the data and a verification result can be transmitted in series or in parallel to the test device.

Abstract: A device, system, and/or method includes an internal circuit configured to perform at least one function, an input-output terminal set and a repair circuit. The input-output terminal set includes a plurality of normal input-output terminals connected to an external device via a plurality of normal signal paths and at least one repair input-output terminal selectively connected to the external device via at least one repair signal path. The repair circuit repairs at least one failed signal path included in the normal signal paths based on a mode signal and fail information signal, where the mode signal represents whether to use the repair signal path and the fail information signal represents fail information on the normal signal paths. Using the repair circuit, various systems adopting different repair schemes may be repaired and cost of designing and manufacturing the various systems may be reduced.

Abstract: A method of preparing a polyalkylene carbonate resin is provided. More particularly, a method of preparing a polyalkylene carbonate resin capable of preventing polymer degradation and improving physical properties and quality of a final resin product, in which, after polymerization of polyalkylene carbonate, by-products are removed by using a large amount of water to purify a reaction mixture, and in a subsequence process of removing a catalyst residue, a primary purification method is conducted by using a filter so that a content of the catalyst in the reaction mixture is less than 1% by weight, is provided.