Ming Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: An apparatus, such as a memory device, that includes circuits and techniques to synchronize various internal signals with an internal clock signal to ensure proper functionality of the memory device. A walk back circuit is provided to mimic propagation delays of an internal command signal, such as a write command signal, and to speed up the delayed internal command signal an amount equivalent to the propagation delays. The walk back circuit includes a mixture of delay elements provided to mimic propagation delays caused by both gate delays and routing delays.
Abstract: A connection component for array elements in an ultrasonic probe comprises a first-layer body and a second-layer body, wherein the second-layer body is connected with the first-layer body, and an area of the second-layer body is smaller than an area of the first-layer body. A region in the first-layer body that extends beyond the second-layer body is provided with at least one first-layer conductive element penetrating through the first-layer body. A lower surface of the second-layer body is provided with at least one second-layer conductive element penetrating through the second-layer body and the first-layer body. A signal transmission line is connected to the array elements by the first-layer conductive elements and the second-layer conductive elements. The connection component for array elements is in a stepped shape. The signal transmission line is connected to an array element assembly through the stepped connection component for array elements to provide sufficient space.
Abstract: Embodiments of the present disclosure may be used for patterning a layer in a 5 nm node or beyond fabrication to achieve an end-to-end distance below 35 nm. Compared to the state of the art technology, embodiments of the present disclosure reduce cycle time and cost of production from three lithographic processes and four etching processes to one lithographic process and three etch processes.
Abstract: A semiconductor structure includes a semiconductor substrate, at least one raised dummy feature, at least one memory cell, and at least one word line. The raised dummy feature is present on the semiconductor substrate and defines a cell region on the semiconductor substrate. The memory cell is present on the cell region. The word line is present adjacent to the memory cell.
Abstract: A method for wireless communications between a User Equipment (UE) and a Base Station (BS) is provided. The method includes counting, by a UE, a number of beam switching within a particular period of time, and transmitting, by the UE, a measurement report to a BS when the number of beam switching exceeds a threshold during the particular period of time.
Abstract: A semiconductor light-emitting device comprises a substrate; a first adhesive layer on the substrate; multiple epitaxial units on the first adhesive layer; a second adhesive layer on the multiple epitaxial units; multiple first electrodes between the first adhesive layer and the multiple epitaxial units, and contacting the first adhesive layer and the multiple epitaxial units; and multiple second electrodes between the second adhesive layer and the multiple epitaxial units, and contacting the second adhesive layer and the multiple epitaxial units; wherein the multiple epitaxial units are totally separated.
Abstract: A method, a device, and a non-transitory storage medium are described in which a global identification service is provided. The service includes a selection of an Internet Protocol version 6 (IPv6) address to an end device. The service encrypts a unique identifier of the end device with an encryption key to generate an IPv6 address. The service verifies whether the IPv6 address is an IPv6 address allocated to or owned by a service provider. When the IPv6 address is an allocated or owned IPv6 address, the IPv6 address is assigned to the end device. When the IPv6 address is not an allocated or owned IPv6 address, the service selects another encryption key until a suitable IPv6 address is generated. Subsequent to an assignment of the IPv6 address, a network uses the IPv6 address as a globally unique identifier for the end device.
February 21, 2018
August 22, 2019
Dahai Ren, Ming Chen, Feng Li, Dongxu Shan
Abstract: The present disclosure, in some embodiments, relates to a silicon on insulator (SOI) substrate. The SOI substrate includes a dielectric layer disposed over a first substrate. The dielectric layer has an outside edge aligned with an outside edge of the first substrate. An active layer covers a first annular portion of an upper surface of the dielectric layer. The upper surface of the dielectric layer has a second annular portion that surrounds the first annular portion and extends to the outside edge of the dielectric layer. The second annular portion is uncovered by the active layer.
Abstract: A semiconductor device and a fabrication method thereof are provided. The semiconductor device includes a semiconductor structure, a dielectric layer, a metal-semiconductor compound film and a cover layer. The semiconductor structure has an upper surface and a lateral surface. The dielectric layer encloses the lateral surface of the semiconductor structure and exposes the upper surface of the semiconductor structure. The metal-semiconductor compound film is on the semiconductor structure, wherein the dielectric layer exposes a portion of a surface of the metal-semiconductor compound film. The cover layer encloses the portion of the surface of the metal-semiconductor compound film exposed by the dielectric layer, and exposes the dielectric layer.
Abstract: A miniature fluid control device includes a gas inlet plate, a resonance plate and a piezoelectric actuator. The gas inlet plate includes at least one inlet, at least one convergence channel and a central cavity. A convergence chamber is defined by the central cavity. The resonance plate has a central aperture. The piezoelectric actuator includes a suspension plate, an outer frame and a piezoelectric ceramic plate. A gap is formed between the resonance plate and the piezoelectric actuator to define a first chamber. When the piezoelectric actuator is driven and after the gas is fed into the miniature fluid control device through the inlet of the gas inlet plate, the gas is sequentially converged to the central cavity through the convergence channel, transferred through the central aperture of the resonance plate, introduced into the first chamber, transferred downwardly through the piezoelectric actuator, and exited from the miniature fluid control device.
Abstract: A piezoelectric actuator includes a suspension plate, an outer frame, at least one bracket and a piezoelectric ceramic plate. The suspension plate is a square structure. The length of the suspension plate is in a range between 7.5 mm and 12 mm, and the suspension plate is permitted to undergo a curvy vibration from a middle portion to a periphery portion. The outer frame is arranged around the suspension plate. The at least one bracket is connected between the suspension plate and the outer frame for elastically supporting the suspension plate. The piezoelectric ceramic plate is a square structure and has a length not larger than a length of the suspension plate. The piezoelectric ceramic plate is attached on a first surface of the suspension plate. When a voltage is applied to the piezoelectric ceramic plate, the suspension plate is driven to undergo the curvy vibration.
Abstract: An optical imaging lens sequentially includes a first, a second, a third, a fourth, a fifth, and a sixth lens elements from an object side to an image side along an optical axis. Each of the lens elements includes an object-side surface and an image-side surface. The second lens element has negative refracting power. A periphery region of the object-side surface of the fourth lens element is convex. A periphery region of the image-side surface of the fifth lens element is convex. The optical imaging lens satisfies following conditions: HFOV?45°; 2.000?D1/D2, and TTL/T6?6.300.
Abstract: The present disclosure provides a touch panel structure, including a display device, a dielectric layer, a first sensing circuit, a second sensing circuit and a shielding layer. The dielectric layer is disposed on the display device. The first sensing circuit includes a plurality of first sensing electrodes and a plurality of conducting bridges, wherein the first sensing electrodes are disposed on the dielectric layer, and the conducting bridges are disposed between the dielectric layer and the display device. Adjacent ones of the first sensing electrodes are electrically connected with each other through one of the conducting bridges. The second sensing circuit includes a plurality of second sensing electrodes, which are disposed on the dielectric layer. The second sensing circuit is insulated from and crosses the first sensing circuit. The shielding layer is disposed between the dielectric layer and the display device and coplanar with the conducting bridges.
Abstract: A communication device for handling a cell selection procedure or a cell reselection procedure comprises a storage device and a processing circuit, coupled to the storage device. The storage device stores, and the processing circuit is configured to execute instructions of: measuring a plurality of power values corresponding to a plurality of beams of a cell; determining a first cell quality value according to an average of the plurality of power values; determining an offset value according to a number of the plurality of beams corresponding to the plurality of power values; determining a second cell quality value according to the first cell quality value and the offset value; and performing the cell selection procedure or the cell reselection procedure according to the second cell quality value.
Abstract: A method of manufacturing conductors for a semiconductor device, the method comprising: forming a structure on a base; and eliminating selected portions of members of a first set and selected portions of members of a second set from the structure. The structure includes: capped first conductors arranged parallel to a first direction; and capped second conductors arranged parallel to and interspersed with the capped first conductors. The capped first conductors are organized into at least first and second sets. Each member of the first set has a first cap with a first etch sensitivity. Each member of the second set has a second cap with a second etch sensitivity. Each of the capped second conductors has a third etch sensitivity. The first, second and third etch sensitivities are different.
Abstract: A piezoelectric actuator includes a suspension plate, an outer frame, at least one bracket and a piezoelectric ceramic plate. The suspension plate is a square structure. The length of the suspension plate is in a range between 4 mm and 8 mm, and the suspension plate is permitted to undergo a curvy vibration from a middle portion to a periphery portion. The outer frame is arranged around the suspension plate. The at least one bracket is connected between the suspension plate and the outer frame for elastically supporting the suspension plate. The piezoelectric ceramic plate is a square structure and has a length not larger than a length of the suspension plate. The piezoelectric ceramic plate is attached on a first surface of the suspension plate. When a voltage is applied to the piezoelectric ceramic plate, the suspension plate is driven to undergo the curvy vibration.
Abstract: Disclosed is a beam energy dispersion adjusting mechanism for superconducting proton cyclotron. The adjusting mechanism includes a vacuum cavity, bases are symmetrically mounted on outer walls of four faces of the vacuum cavity in horizontal and vertical directions, an electric cylinder and a transmission mechanism are mounted on each of the four bases, a jaws block and a position fixing plate are correspondingly provided on an inner wall of the vacuum cavity at each face. The transmission mechanism includes an oil-free sleeve, a moving connecting rod onto which the position fixing plate is fixed, a corrugated pipe, and an electric cylinder connecting block whose both ends are screwed with the moving connecting rod and the electric cylinder, the jaws block is fixedly connected with the position fixing plate. The disclosure utilizes the electric cylinder to drive the jaws block to complete specified linear displacement, and satisfies back-end beam quality requirements.
September 5, 2018
Date of Patent:
August 20, 2019
HEFEI CAS ION MEDICAL AND TECHNICAL DEVICES CO., LTD.
Abstract: A method for manufacturing a display panel including a substrate and a light emitting functional layer on the substrate comprises the following steps: forming a conductive wire on the substrate; forming a semiconductor layer on the conductive wire; forming a conductive channel in the semiconductor layer, the conductive channel connects to the conductive wire; and forming a first electrode layer on the semiconductor layer and the light emitting functional layer, wherein the first electrode layer connects with the conductive channel. The present disclosure can reduce a length of a wiring trace between the electrode layer and the conductive wire, and avoid a touch blind region on the display panel caused by the excessively large wiring trace region.
January 9, 2019
August 15, 2019
Liang CHEN, Lei WANG, Xiaochuan CHEN, Minghua XUAN, Shengji YANG, Dongni LIU, Han YUE, Ming YANG, Li XIAO, Pengcheng LU
Abstract: A computer-implemented method of routing protection is provided comprising: receiving, by one or more processors of an active network element from a remote peer device, a plurality of data packets; sending, by the one or more processors of the active network element to a plurality of standby network elements, a multicast data packet comprising combined data of the plurality of data packets; receiving, by the one or more processors of the active network element from at least one of the standby network elements, an acknowledgment of receipt of the multicast data packet; and in response to the receipt of the acknowledgment, sending, by the one or more processors of the active network element to the remote peer device, an acknowledgment of receipt of the plurality of data packets.