Patents by Inventor Ming-Chih Tsai

Ming-Chih Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210095100
    Abstract: A composite material including a nanocellulose core and a metal shell is provided. The metal shell covers a surface of the nanocellulose core. The composite material is nanosized and has high mechanical strength. Additionally, a method of manufacturing the composite material is also provided.
    Type: Application
    Filed: December 11, 2020
    Publication date: April 1, 2021
    Applicant: Winbond Electronics Corp.
    Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
  • Publication number: 20210063212
    Abstract: A sensor is provided and is disposed on a package body of an integrated circuit chip. The sensor includes a sensing element, a protective element, a cover, and at least two traces. The sensing element is disposed on the integrated circuit chip. The protective element is disposed on the integrated circuit chip and surrounds the sensing element. The cover is connected to the protective element. The at least two traces are electrically connected to the sensing element and to at least two pins of the integrated circuit chip.
    Type: Application
    Filed: December 31, 2019
    Publication date: March 4, 2021
    Inventor: MING-CHIH TSAI
  • Publication number: 20210010964
    Abstract: A method of manufacturing a composite material, comprising providing a conductive polymer having a hydrophilic end and adding a metal oxide, such that the metal oxide is connected to the hydrophilic end of the conductive polymer, wherein the metal oxide is obtained by subjecting a metal oxide precursor to a dehydration reaction, a polymerization reaction, a condensation reaction, or a combination thereof.
    Type: Application
    Filed: September 29, 2020
    Publication date: January 14, 2021
    Applicant: Winbond Electronics Corp.
    Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
  • Patent number: 10842421
    Abstract: A sensing device for sensing ion concentration of a solution, including a first substrate, a second substrate, a sensing layer, and two electrodes. The material of the first substrate includes cellulose. The second substrate is located on the first substrate. The sensing layer is located on the second substrate. The two electrodes are separately disposed on the sensing layer to expose the sensing layer and bring a solution in contact with the sensing layer so as to measure the resistance value of the solution and convert the resistance value into the ion concentration of the solution.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: November 24, 2020
    Assignee: Winbond Electronics Corp.
    Inventors: Ming-Hung Hsieh, Yu-Hsuan Ho, Ming-Chih Tsai, Yen-Jui Chu
  • Patent number: 10823691
    Abstract: A sensor, a composite material and a method of manufacturing the same are provided. The sensor includes a first electrode, a second electrode, and a sensing material layer. The first electrode and the second electrode are separated from each other. The sensing material layer is located between the first electrode and the second electrode and covers the first electrode and the second electrode. The sensing material layer includes the composite material including a conductive polymer and a metal oxide. The conductive polymer has a hydrophilic end. The metal oxide is connected to the hydrophilic end of the conductive polymer. The metal oxide includes a metal oxide precursor.
    Type: Grant
    Filed: January 5, 2018
    Date of Patent: November 3, 2020
    Assignee: Winbond Electronics Corp.
    Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
  • Patent number: 10818497
    Abstract: The present invention provides a patterned structure for an electronic device and a manufacturing method thereof. The patterned structure includes a patterned layer, a blocking structure, a cantilever structure, and a connection structure. The patterned layer is disposed on a substrate. The blocking structure is disposed on the substrate at one side of the patterned layer, wherein a thickness of the blocking structure is smaller than a thickness of the patterned layer. The cantilever structure is disposed on the substrate and located between the patterned layer and the blocking structure. The cantilever structure is connected with the patterned layer and the blocking structure. The connection structure is connected between the patterned layer and the substrate at one side of the patterned layer, and located on the cantilever structure and the blocking structure.
    Type: Grant
    Filed: August 21, 2017
    Date of Patent: October 27, 2020
    Assignee: Winbond Electronics Corp.
    Inventors: Yen-Jui Chu, Hsin-Hung Chou, Ming-Chih Tsai
  • Patent number: 10788521
    Abstract: A resistive environmental sensor including an electrode stack and a sensing layer is provided. The electrode stack includes a first electrode layer, a second electrode layer, and a dielectric layer disposed between the first and second electrode layers, wherein the electrode stack includes a side surface, and the first and second electrode layers are exposed on the side surface of the electrode stack. The sensing layer is disposed on the side surface of the electrode stack, and the sensing layer s in contact with the first and second electrode layers. An environmental variation is inspected by sensing a resistance variation of the sensing layer that is between the first and second electrode layers. The above-mentioned sensor is capable of sensing gases, light, humidity, temperature, and so on. The above-mentioned sensor has advantages of low resistivity and good sensitivity.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: September 29, 2020
    Assignee: Winbond Electronics Corp.
    Inventors: Yu-Hsuan Ho, Ming-Chih Tsai
  • Patent number: 10697753
    Abstract: A strain sensing device and a manufacturing method thereof are provided in the invention. The strain sensing device includes a substrate and at least one sensing electrode. The substrate has a plurality of pores. A material of the substrate includes nanocellulose, and the substrates is strained in response to changes in external conditions. The at least one sensing electrode is disposed on the substrate, wherein the sensing electrode contacting the substrate extends into the pores of the substrate. The at least one sensing electrode has a major axis parallel to a surface of the substrate. A resistance value of the at least one sensing electrode changes in response to a strain of the substrate.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: June 30, 2020
    Assignee: Winbond Electronics Corp.
    Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
  • Patent number: 10697919
    Abstract: A reduction-oxidation sensor device and a manufacturing method thereof are provided. The reduction-oxidation sensor device includes a first electrode, at least one sensing structure and a second electrode. The first electrode is located on a substrate. The at least one sensing structure is located on the first electrode and the substrate. The at least one sensing structure includes a metal nanowire layer and a metal oxide layer. The metal nanowire layer is disposed on the first electrode and the substrate. The metal nanowire layer is wrapped by the metal oxide layer. The second electrode is located on the at least one sensing structure.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: June 30, 2020
    Assignee: Winbond Electronics Corp.
    Inventors: Ming-Chih Tsai, Yu-Hsuan Ho, Yen-Jui Chu, Ming-Hung Hsieh
  • Patent number: 10527504
    Abstract: A transparent pressure sensor and a manufacturing method thereof are provided. The transparent pressure sensor includes several layers of transparent electrodes, at least one pressure-sensitive deformation layer between the transparent electrodes, and a metal oxide layer. Each layer of the transparent electrodes is composed of nanowires, and the metal oxide layer is disposed in a space among the nanowires.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: January 7, 2020
    Assignee: Winbond Electronics Corp.
    Inventors: Yu-Hsuan Ho, Ming-Chih Tsai, Ming-Hung Hsieh
  • Patent number: 10473607
    Abstract: A gas sensor includes a first substrate, at least one first electrode, a sensing structure, at least one second electrode, and a second substrate. The at least one first electrode is located on the first substrate. The sensing structure is located on the at least one first electrode and the first substrate, and the sensing structure includes a first semiconductor layer and a second semiconductor layer. The first semiconductor layer having a first conductive type covers the first substrate and the at least one first electrode; the second semiconductor layer having a second conductive type is located on the first semiconductor layer. The at least one second electrode covers the sensing structure. The second substrate covers the at least one second electrode and the sensing structure.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: November 12, 2019
    Assignee: Winbond Electronics Corp.
    Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
  • Patent number: 10453620
    Abstract: A perovskite composite structure is provided. The perovskite composite structure includes a light absorption layer and a sterically-hindered layer disposed in the periphery of the light absorption layer. The light absorption layer includes a perovskite material. The sterically-hindered layer includes a two-dimensional material.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: October 22, 2019
    Assignee: Winbond Electronics Corp.
    Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
  • Patent number: 10401200
    Abstract: A multifunctional sensor including a substrate, a first sensing structure, a dielectric layer and a second sensing structure is provided. The first sensing structure is disposed on the substrate. The dielectric layer is disposed on the first sensing structure. The second sensing structure is disposed on the dielectric layer. The first sensing structure and the second sensing structure are located on the same side of the substrate.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: September 3, 2019
    Assignee: Winbond Electronics Corp.
    Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
  • Patent number: 10323996
    Abstract: A pressure sensor and a manufacturing method thereof are provided. The pressure sensor includes a thin-film transistor (TFT) array and a pressure-sensitive layer covering the TFT array. The pressure-sensitive layer includes a plurality of insulating layers and one of one-directional materials arranged on the same plane and two-directional materials. The insulating layers and the one- or two-directional materials are alternately stacked so as to effectively enhance pressure resolution.
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: June 18, 2019
    Assignee: Winbond Electronics Corp.
    Inventors: Yu-Hsuan Ho, Ming-Chih Tsai, Ming-Hung Hsieh
  • Patent number: 10282964
    Abstract: A gas detecting device configured to be attached to a surface includes a substrate, a semiconductor layer, a light-emitting component, a first electrode and a second electrode. The substrate includes a plurality of stacking layers stacked onto one another, and a material of the substrate includes cellulose nanofibrils (CNF). The substrate is formed by 3-D printing, such that a contact surface of the substrate is tightly attached to the surface. The semiconductor layer is formed on the substrate by 3-D printing. The light-emitting component is disposed on the substrate. The first electrode is coupled to the semiconductor layer and the light-emitting component. The second electrode is coupled to the semiconductor layer and a ground electrode. The first electrode and the second electrode are both disposed on the semiconductor layer and maintain a gap therebetween. A resistance of the semiconductor layer is changed according to a concentration of a designated gas.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: May 7, 2019
    Assignee: Winbond Electronics Corp.
    Inventors: Ming-Hung Hsieh, Yu-Hsuan Ho, Ming-Chih Tsai, Yen-Jui Chu
  • Patent number: 10277995
    Abstract: A bone-conduction hearing aid device is provided. The bone-conduction hearing aid device is suitable for being attached to a body surface and includes a substrate, an input transducer, an amplifier, and a bone-conduction speaker. The substrate is composed of a plurality of stacking layers stacked on top of one another. A material of the substrate includes cellulose nanofiber. The substrate is formed by 3D printing technique so that a contact surface of the substrate is tightly attached with the body surface. The input transducer is disposed on the substrate and configured to receive a sound signal and convert the sound signal into an electric signal. The amplifier is disposed on the substrate and coupled to the input transducer to amplify the electric signal into an amplified electric signal. The bone-conduction speaker is disposed on the substrate and coupled to the amplifier to convert the amplified electric signal into a vibration signal.
    Type: Grant
    Filed: November 24, 2017
    Date of Patent: April 30, 2019
    Assignee: Winbond Electronics Corp.
    Inventors: Ming-Hung Hsieh, Yu-Hsuan Ho, Ming-Chih Tsai, Yen-Jui Chu
  • Publication number: 20180362736
    Abstract: A composite material including a nanocellulose core and a metal shell is provided. The metal shell covers a surface of the nanocellulose core. The composite material is nanosized and has high mechanical strength. Additionally, a method of manufacturing the composite material is also provided.
    Type: Application
    Filed: January 14, 2018
    Publication date: December 20, 2018
    Applicant: Winbond Electronics Corp.
    Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
  • Publication number: 20180238750
    Abstract: A pressure sensor and a manufacturing method thereof are provided. The pressure sensor includes a first electrode, a pressure-sensitive layer covering the first electrode, and a second electrode covering the pressure-sensitive layer. A support material is contained in the pressure-sensitive layer, and the support material is a nano-sized material with an aspect ratio between 100 and 5000. Mechanical property of the pressure-sensitive layer in the pressure sensor can be improved by the property of the nano-sized material.
    Type: Application
    Filed: December 18, 2017
    Publication date: August 23, 2018
    Applicant: Winbond Electronics Corp.
    Inventors: Yu-Hsuan Ho, Ming-Chih Tsai, Ming-Hung Hsieh
  • Publication number: 20180240607
    Abstract: A perovskite composite structure is provided. The perovskite composite structure includes a light absorption layer and a sterically-hindered layer disposed in the periphery of the light absorption layer. The light absorption layer includes a perovskite material. The sterically-hindered layer includes a two-dimensional material.
    Type: Application
    Filed: November 9, 2017
    Publication date: August 23, 2018
    Applicant: Winbond Electronics Corp.
    Inventors: Ming-Chih Tsai, Yu-Hsuan Ho
  • Publication number: 20180231403
    Abstract: A multifunctional sensor including a substrate, a first sensing structure, a dielectric layer and a second sensing structure is provided. The first sensing structure is disposed on the substrate. The dielectric layer is disposed on the first sensing structure. The second sensing structure is disposed on the dielectric layer. The first sensing structure and the second sensing structure are located on the same side of the substrate.
    Type: Application
    Filed: August 16, 2017
    Publication date: August 16, 2018
    Applicant: Winbond Electronics Corp.
    Inventors: Ming-Chih Tsai, Yu-Hsuan Ho