Patents by Inventor Ming Ding
Ming Ding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10965249Abstract: A crystal oscillator circuit comprises: a crystal oscillator; and an injection frequency generating circuit, the injection frequency generating circuit being configured to sense a signal of the crystal oscillator and amplify the sensed signal, the injection frequency generating circuit being further configured to inject the amplified signal to the crystal oscillator; wherein the crystal oscillator circuit is configured such that the crystal oscillator receives the amplified signal during an initial start-up period of the crystal oscillator and stops receiving the amplified signal at an end of the initial start-up period.Type: GrantFiled: April 13, 2018Date of Patent: March 30, 2021Assignee: IMEC vzwInventor: Ming Ding
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Patent number: 10959278Abstract: A call setup method and associated apparatus discloses sending a first message to a network device, wherein the first message is used by the electronic device to request to set up an outgoing call; receiving a second message sent by the network device, wherein the second message is used by the electronic device to set up an incoming call; caching the second message when the electronic device is in a call initiation state; releasing the outgoing call based on an indication message received from the network device and setting up the incoming call.Type: GrantFiled: June 15, 2017Date of Patent: March 23, 2021Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Kai Yuan, Fenghui Dou, Ming Ding, Hui Jin
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Publication number: 20210083628Abstract: A power amplifier circuit includes a current generator and a current mirror driver. The current generator has a first input connected to a first voltage supply and an output configured to generate a first current. The current generator includes a first transistor, a second transistor, a first resistor and a second resistor. The first transistor has an emitter connected to ground. The second transistor has a base connected to a base of the first transistor and an emitter connected to ground. The first resistor is connected between the first voltage supply and a collector of the first transistor. The second resistor is connected between the first voltage supply and a collector of the second transistor. The current mirror drive has a first input connected to the output of the current generator to receive the first current and an output configured to generate a second current.Type: ApplicationFiled: September 18, 2019Publication date: March 18, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Jaw-Ming DING
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Patent number: 10944363Abstract: The present disclosure relates to a power amplifier circuit. The power amplifier circuit includes a voltage-controlled current source and a current mirror. The voltage-controlled current source is configured to receive a first voltage and to generate a first current. The current mirror is connected to the voltage-controlled current source and to generate a second current in response to the first current. The second current continuously changes from 0 mA to about 120 mA as the first voltage continuously changes from 0 V to about 1 V.Type: GrantFiled: June 29, 2018Date of Patent: March 9, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Jaw-Ming Ding
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Publication number: 20210012524Abstract: Provided are a method and a device that can efficiently generate a training dataset.Type: ApplicationFiled: March 28, 2019Publication date: January 14, 2021Inventors: Keita TOMOCHIKA, Takuya KIYOKAWA, Tsukasa OGASAWARA, Jun TAKAMATSU, Ming DING
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Publication number: 20200313626Abstract: A power amplifier circuit includes a first transistor, a second transistor and a bias circuit. The first transistor has a base configured to receive a first signal. The second transistor has an emitter connecting to a collector of the first transistor and a collector configured to output a second signal. The bias circuit is coupled to the first transistor and the second transistor. The bias circuit is configured to provide a direct current (DC) voltage at the collector of the second transistor about twice a DC voltage at the collector of the first transistor. The bias circuit is configured to provide an alternating current (AC) or radio frequency (RF) voltage at the collector of the second transistor about twice an AC or RF voltage at the collector of the first transistor.Type: ApplicationFiled: March 26, 2019Publication date: October 1, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Jaw-Ming DING
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Patent number: 10756025Abstract: A semiconductor package device includes: (1) a substrate having a top surface; (2) a passive component disposed on the substrate and having a top surface; (3) an active component disposed on the substrate and having a top surface; and (4) a package body disposed on the substrate, the package body including a first portion covering the active component and the passive component, and a second portion covering the passive component, wherein a top surface of the second portion of the package body is higher than a top surface of the first portion of the package body, and the first portion and the second portion of the package body include different materials.Type: GrantFiled: August 8, 2018Date of Patent: August 25, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Wei-Hsuan Lee, Jaw-Ming Ding, Wei-Yu Chen
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Patent number: 10681811Abstract: Embodiments of present invention provide various device assemblies for digital communication. The device assemblies may include a main printed-circuit-board (PCB); and an OSA-on-daughter-board (OODB) directly connected to the main PCB. The OODB has an optical sub-assembly (OSA) wire-bonded onto a daughter PCB. In one embodiment, the daughter PCB includes a flexible printed-circuit (FPC) sheet connecting the OODB directly to the main PCB. In another embodiment, the main PCB includes a FPC sheet connecting the main PCB directly to the OODB. In one embodiment, the connection may be made through an anisotropic conductive film or an anisotropic conductive adhesive.Type: GrantFiled: February 10, 2019Date of Patent: June 9, 2020Inventors: Tongqing Wang, Ming Ding
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Patent number: 10651796Abstract: The present disclosure relates to a power amplifier circuit including a current source, a power control circuit, a current mirror and an output circuit. The current source circuit includes a first transistor and a second transistor. A source of the first transistor is connected to a drain of the second transistor and a gate of the first transistor is connected to a source with the second transistor. The power control circuit is connected to a gate of the second transistor. The current mirror circuit is connected to the gate of the first transistor and a source of the second transistor. The output circuit is connected to the current mirror circuit.Type: GrantFiled: February 2, 2018Date of Patent: May 12, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Jaw-Ming Ding
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Patent number: 10652823Abstract: Systems and methods providing a wakeup receiver for latency-critical applications are described herein. An example system includes a wakeup receiver communicatively coupled to a communication channel. The wakeup receiver is configured to monitor an input signal of the communication channel and down-convert the input signal to a DC signal. The system also includes an analog to digital converter (ADC) configured to digitize the DC signal and provide an ADC output. The system further includes a digital baseband (DBB) module configured to determine a received signal strength indication (RSSI) from the signal. The DBB is also configured to, for each packet, determine a respective packet length and compare the RSSI and respective packet length with a two-dimensional template. The DBB is additionally configured to, based on the comparison, determine an interrupt condition and, based on determining the interrupt condition, generate a wakeup signal.Type: GrantFiled: May 30, 2018Date of Patent: May 12, 2020Assignee: IMEC VZWInventors: Ming Ding, Peng Zhang, Yan Zhang, Akio Hirata, Akifumi Nagao
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Patent number: 10548113Abstract: A method of resource allocation for Channel State Information (CSI) feedback is provided, which comprises the following steps of: configuring a downlink transmission approach and a feedback mode for each User Equipment (UE); allocating feedback resources required for CSI feedback by each UE based on the configured downlink transmission approach and feedback mode, such that different types underlying different feedback modes for a single UE will not collide with each other within one sub-frame; and notifying each UE of the corresponding configured downlink transmission approach and feedback mode and allocated feedback resources.Type: GrantFiled: April 4, 2011Date of Patent: January 28, 2020Assignee: SHARP KABUSHIKI KAISHAInventors: Ming Ding, Renmao Liu, Yingyu Zhang, Yongming Liang, Zeng Yang
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Patent number: 10530545Abstract: A user equipment receives, from the base station apparatus, bit information. The bit information indicates first information indicating one or more antenna ports and second information indicating a number of layers for downlink data symbols.Type: GrantFiled: April 4, 2018Date of Patent: January 7, 2020Assignee: SHARP KABUSHIKI KAISHAInventors: Yingyu Zhang, Renmao Liu, Ming Ding, Yongming Liang, Zeng Yang
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Publication number: 20200007086Abstract: The present disclosure relates to a power amplifier circuit. The power amplifier circuit includes a voltage-controlled current source and a current mirror. The voltage-controlled current source is configured to receive a first voltage and to generate a first current. The current mirror is connected to the voltage-controlled current source and to generate a second current in response to the first current. The second current continuously changes from 0 mA to about 120 mA as the first voltage continuously changes from 0 V to about 1 V.Type: ApplicationFiled: June 29, 2018Publication date: January 2, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Jaw-Ming DING
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Patent number: 10516367Abstract: The present disclosure relates to a logic control circuit including a first inverter and a voltage limiter. The first inverter is connected to a first input voltage. The first inverter includes a first transistor having a first terminal and a second terminal. The second terminal of the first transistor is connected to a ground. The voltage limiter includes a second transistor. The second transistor has a gate connected to a ground, a source connected to the first terminal of the first transistor and a drain connected to a second input voltage.Type: GrantFiled: February 2, 2018Date of Patent: December 24, 2019Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Jaw-Ming Ding
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Publication number: 20190387358Abstract: The present disclosure describes how a master beacon having a known QUID can be used to capture beacons within its range and superimpose a systematic address scheme on those beacons. The superimposed address scheme can then be used as a proxy for the individual beacons when developing applications that make use of the beacons. A master beacon automatically detects each beacon in a plurality of beacons and, for a set of beacons in the plurality of beacons, automatically changes either the first profile identifier or the second profile identifier for each beacon in the set of beacons. The change is such that the first profile identifier or the second profile identifier is identical for each beacon in the set of beacons and is also associated with the master beacon.Type: ApplicationFiled: August 27, 2019Publication date: December 19, 2019Inventors: Aaron Lyon PHILLIPS-LUBIMIV, Jay FALLAH, Ming DING, Samson Grant KIRK-KOFFI
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Publication number: 20190373664Abstract: A call setup method and associated apparatus discloses sending a first message to a network device, wherein the first message is used by the electronic device to request to set up an outgoing call; receiving a second message sent by the network device, wherein the second message is used by the electronic device to set up an incoming call; caching the second message when the electronic device is in a call initiation state; releasing the outgoing call based on an indication message received from the network device and setting up the incoming call.Type: ApplicationFiled: June 15, 2017Publication date: December 5, 2019Inventors: Kai Yuan, Fenghui Dou, Ming Ding, Hui Jin
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Patent number: 10491224Abstract: The present disclosure describes systems and methods to provide a digital wakeup timer with reduced size and lower power. An example system or apparatus includes a wakeup timer employing a digital-intensive frequency-locked loop (DFLL) architecture to fully utilize the advantages of advanced CMOS processes. Such a system includes a bang-bang frequency detector, a digital loop filter, a digitally-controlled oscillator (DCO), and a multi-phase clock generator. An output of the bang-bang frequency detector is provided to an input of the digital loop filter. An output of the digital loop filter is provided to the DCO. An output of the DCO includes information indicative of an output frequency. The multi-phase clock generator provides respective clock signals based on the output frequency to the bang-bang frequency detector, the digital loop filter, and the DCO.Type: GrantFiled: February 20, 2019Date of Patent: November 26, 2019Assignees: Stichting IMEC Nederland, Technische Universiteit DelftInventors: Ming Ding, Zhihao Zhou, Yao-Hong Liu, Fabio Sebastiano
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Patent number: 10440511Abstract: The present disclosure describes how a master beacon having a known UUID can be used to capture beacons within its range and superimpose a systematic address scheme on those beacons. The superimposed address scheme can then be used as a proxy for the individual beacons when developing applications that make use of the beacons. A master beacon automatically detects each beacon in a plurality of beacons and, for a set of beacons in the plurality of beacons, automatically changes either the first profile identifier or the second profile identifier for each beacon in the set of beacons. The change is such that the first profile identifier or the second profile identifier is identical for each beacon in the set of beacons and is also associated with the master beacon.Type: GrantFiled: January 23, 2018Date of Patent: October 8, 2019Assignee: AP1 Inc.Inventors: Aaron Lyon Phillips-Lubimiv, Jay Fallah, Ming Ding, Samson Grant Kirk-Koffi
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Publication number: 20190268007Abstract: The present disclosure describes systems and methods to provide a digital wakeup timer with reduced size and lower power. An example system or apparatus includes a wakeup timer employing a digital-intensive frequency-locked loop (DFLL) architecture to fully utilize the advantages of advanced CMOS processes. Such a system includes a bang-bang frequency detector, a digital loop filter, a digitally-controlled oscillator (DCO), and a multi-phase clock generator. An output of the bang-bang frequency detector is provided to an input of the digital loop filter. An output of the digital loop filter is provided to the DCO. An output of the DCO includes information indicative of an output frequency. The multi-phase clock generator provides respective clock signals based on the output frequency to the bang-bang frequency detector, the digital loop filter, and the DCO.Type: ApplicationFiled: February 20, 2019Publication date: August 29, 2019Inventors: Ming Ding, Zhihao Zhou, Yao-Hong Liu, Fabio Sebastiano
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Publication number: 20190254165Abstract: Embodiments of present invention provide various device assemblies for digital communication. The device assemblies may include a main printed-circuit-board (PCB); and an OSA-on-daughter-board (OODB) directly connected to the main PCB. The OODB has an optical sub-assembly (OSA) wire-bonded onto a daughter PCB. In one embodiment, the daughter PCB includes a flexible printed-circuit (FPC) sheet connecting the OODB directly to the main PCB. In another embodiment, the main PCB includes a FPC sheet connecting the main PCB directly to the OODB. In one embodiment, the connection may be made through an anisotropic conductive film or an anisotropic conductive adhesive.Type: ApplicationFiled: February 10, 2019Publication date: August 15, 2019Inventors: Tongqing Wang, Ming Ding