Patents by Inventor Ming Feng
Ming Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11966153Abstract: A wavelength conversion module includes a driving element, a wavelength conversion wheel, and at least one flow guide. The wavelength conversion wheel includes a rotary disc and at least one wavelength conversion layer. The driving element is connected to the rotary disc to drive the wavelength conversion wheel to rotate along an axis of the driving element as a central axis. The flow guide is disposed beside the wavelength conversion wheel at intervals along the axis, and at least one airflow channel is formed between the flow guide and the wavelength conversion wheel. The flow guide and the driving element are disposed at intervals, and the flow guide does not contact the rotary disc and the driving element. An orthographic projection of the flow guide on the rotary disc overlaps the wavelength conversion layer. When the wavelength conversion wheel rotates, the wavelength conversion wheel and the flow guide move relatively.Type: GrantFiled: April 14, 2022Date of Patent: April 23, 2024Assignee: Coretronic CorporationInventors: Ming-Feng Hou, Shi-Wen Lin, Shih-Hang Lin
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Publication number: 20240130022Abstract: This application relates to the field of lighting, and discloses an LED filament. The LED filament includes an LED chip unit, a light conversion layer, and an electrode. The light conversion layer covers the LED chip unit and part of the electrode, and a color of a light emitted by the LED filament after lighting is different from a color of the light conversion layer. This application has the characteristics of uniform light emission and good heat dissipation effect.Type: ApplicationFiled: September 18, 2022Publication date: April 18, 2024Inventors: Tao Jiang, Lin Zhou, Ming-Bin Wang, Chih-Shan Yu, Rong-Huan Yang, Ji-Feng Xu, Heng Zhao, Jian Lu, Qi Wu
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Publication number: 20240118073Abstract: Manufacturing of a shoe is enhanced by creating 3-D models of shoe parts. For example, a laser beam may be projected onto a shoe-part surface, such that a projected laser line appears on the shoe part. An image of the projected laser line may be analyzed to determine coordinate information, which may be converted into geometric coordinate values usable to create a 3-D model of the shoe part. Once a 3-D model is known and is converted to a coordinate system recognized by shoe-manufacturing tools, certain manufacturing steps may be automated.Type: ApplicationFiled: December 8, 2023Publication date: April 11, 2024Inventors: Patrick C. Regan, Chih-Chi Chang, Kuo-Hung Lee, Ming-Feng Jean
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Patent number: 11955484Abstract: A semiconductor device includes a semiconductor substrate having a first region and a second region, insulators, gate stacks, and first and second S/Ds. The first and second regions respectively includes at least one first semiconductor fin and at least one second semiconductor fin. A width of a middle portion of the first semiconductor fin is equal to widths of end portions of the first semiconductor fin. A width of a middle portion of the second semiconductor fin is smaller than widths of end portions of the second semiconductor fin. The insulators are disposed on the semiconductor substrate. The first and second semiconductor fins are sandwiched by the insulators. The gate stacks are over a portion of the first semiconductor fin and a portion of the second semiconductor fin. The first and second S/Ds respectively covers another portion of the first semiconductor fin and another portion of the second semiconductor fin.Type: GrantFiled: June 10, 2022Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Kuan-Jung Chen, I-Chih Chen, Chih-Mu Huang, Kai-Di Wu, Ming-Feng Lee, Ting-Chun Kuan
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Patent number: 11953877Abstract: Manufacturing of a shoe or a portion of a shoe is enhanced by executing various shoe-manufacturing processes in an automated fashion. For example, information describing a shoe part may be determined, such as an identification, an orientation, a color, a surface topography, an alignment, a size, etc. Based on the information describing the shoe part, automated shoe-manufacturing apparatuses may be instructed to apply various shoe-manufacturing processes to the shoe part, such as a pickup and placement of the shoe part with a pickup tool.Type: GrantFiled: October 20, 2022Date of Patent: April 9, 2024Assignee: NILE, Inc.Inventors: Dragan Jurkovic, Patrick Conall Regan, Chih-Chi Chang, Chang-chu Liao, Ming-Feng Jean, Kuo-Hung Lee, Yen-Hsi Liu, Hung-Yu Wu
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Patent number: 11955460Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.Type: GrantFiled: October 5, 2020Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Da Tsai, Meng-Tse Chen, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng, Ching-Hua Hsieh, Chung-Shi Liu
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Patent number: 11955433Abstract: A package includes a redistribution structure, a die package on a first side of the redistribution structure including a first die connected to a second die by metal-to-metal bonding and dielectric-to-dielectric bonding, a dielectric material over the first die and the second die and surrounding the first die, and a first through via extending through the dielectric material and connected to the first die and a first via of the redistribution structure, a semiconductor device on the first side of the redistribution structure includes a conductive connector, wherein a second via of the redistribution structure contacts the conductive connector of the semiconductor device, a first molding material on the redistribution structure and surrounding the die package and the semiconductor device, and a package through via extending through the first molding material to contact a third via of the redistribution structure.Type: GrantFiled: July 20, 2022Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Fa Chen, Sung-Feng Yeh, Hsien-Wei Chen
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Publication number: 20240113032Abstract: Interconnect structure packages (e.g., through silicon vias (TSV) packages, through interlayer via (TIV) packages) may be pre-manufactured as opposed to forming TIVs directly on a carrier substrate during a manufacturing process for a semiconductor die package at backend packaging facility. The interconnect structure packages may be placed onto a carrier substrate during manufacturing of a semiconductor device package, and a semiconductor die package may be placed on the carrier substrate adjacent to the interconnect structure packages. A molding compound layer may be formed around and in between the interconnect structure packages and the semiconductor die package.Type: ApplicationFiled: April 25, 2023Publication date: April 4, 2024Inventors: Kai-Fung CHANG, Chin-Wei LIANG, Sheng-Feng WENG, Ming-Yu YEN, Cheyu LIU, Hung-Chih CHEN, Yi-Yang LEI, Ching-Hua HSIEH
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Publication number: 20240105121Abstract: An electronic device includes a substrate, a first silicon transistor, a second silicon transistor and a first oxide semiconductor transistor. The first silicon transistor, the second silicon transistor and the first oxide semiconductor transistor are disposed on the substrate. The first silicon transistor has a first terminal electrically connected to a first voltage level, a second terminal and a control terminal. The second silicon transistor has a first terminal electrically connected to the second terminal of the first silicon transistor, a second terminal electrically connected to a second voltage level, and a control terminal electrically connected to the control terminal of the first silicon transistor. The first oxide semiconductor transistor has a first terminal electrically connected to the first terminal of the second silicon transistor. Wherein, a voltage value of the first voltage level is greater than a voltage value of the second voltage level.Type: ApplicationFiled: December 6, 2023Publication date: March 28, 2024Inventors: Lien-Hsiang CHEN, Kung-Chen KUO, Ming-Chun TSENG, Cheng-Hsu CHOU, Kuan-Feng LEE
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Publication number: 20240096847Abstract: A method includes putting a first package component into contact with a second package component. The first package component comprises a first dielectric layer including a first dielectric material, and the first dielectric material is a silicon-oxide-based dielectric material. The second package component includes a second dielectric layer including a second dielectric material different from the first dielectric material. The second dielectric material comprises silicon and an element selected from the group consisting of carbon, nitrogen, and combinations thereof. An annealing process is performed to bond the first dielectric layer to the second dielectric layer.Type: ApplicationFiled: November 28, 2023Publication date: March 21, 2024Inventors: Chen-Hua Yu, Wen-Chih Chiou, Ku-Feng Yang, Ming-Tsu Chung
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Publication number: 20240096784Abstract: Some embodiments of the present disclosure relate to an integrated chip including an extended via that spans a combined height of a wire and a via and that has a smaller footprint than the wire. The extended via may replace a wire and an adjoining via at locations where the sizing and the spacing of the wire are reaching lower limits. Because the extended via has a smaller footprint than the wire, replacing the wire and the adjoining via with the extended via relaxes spacing and allows the size of the pixel to be further reduced. The extended via finds application for capacitor arrays used for pixel circuits.Type: ApplicationFiled: January 3, 2023Publication date: March 21, 2024Inventors: Meng-Hsien Lin, Hsing-Chih Lin, Ming-Tsong Wang, Min-Feng Kao, Kuan-Hua Lin, Jen-Cheng Liu, Dun-Nian Yaung, Ko Chun Liu
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Publication number: 20240085671Abstract: An annular light trapping component includes an inner surface, an outer surface, an object-side surface and an image-side surface. The inner surface includes multiple L-shaped annular grooves. The annular light trapping component includes multiple stripe-shaped structures in the L-shaped annular grooves. The L-shaped annular grooves include an object-side L-shaped annular groove closest to the object-side surface and an image-side L-shaped annular groove closest to the image-side surface. A bottom diameter of the image-side L-shaped annular groove is larger than a bottom diameter of the object-side L-shaped annular groove. Each L-shaped annular groove includes a first side and a second side located between the object-side surface and the image-side surface. The stripe-shaped structures are disposed on the first side or the second side. A degree of inclination between the first side and the central axis is larger than a degree of inclination between the second side and the central axis.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Applicant: LARGAN PRECISION CO., LTD.Inventors: Ming-Ta CHOU, Cheng-Feng LIN, Wei-Hung WENG
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Publication number: 20240085676Abstract: A light-folding element includes an object-side surface, an image-side surface, a reflection surface and a connection surface. The reflection surface is configured to reflect imaging light passing through the object-side surface to the image-side surface. The connection surface is connected to the object-side, image-side and reflection surfaces. The light-folding element has a recessed structure located at the connection surface. The recessed structure is recessed from the connection surface an includes a top end portion, a bottom end portion and a tapered portion located between the top end and bottom end portions. The top end portion is located at an edge of the connection surface. The tapered portion has two tapered edges located on the connection surface. The tapered edges are connected to the top end and bottom end portions. A width of the tapered portion decreases in a direction from the top end portion towards the bottom end portion.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Applicant: LARGAN PRECISION CO., LTD.Inventors: Min-Chun LIAO, Lin An CHANG, Ming-Ta CHOU, Jyun-Jia CHENG, Cheng-Feng LIN, Ming-Shun CHANG
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Publication number: 20240088236Abstract: In a method of manufacturing a semiconductor device, underlying structures comprising gate electrodes and source/drain epitaxial layers are formed, one or more layers are formed over the underlying structures, a hard mask layer is formed over the one or more layers, one or more first resist layers are formed over the hard mask layer, a first photo resist pattern is formed over the one or more first resist layers, a width of the first photo resist pattern is adjusted, the one or more first resist layers are patterned by using the first photo resist pattern as an etching mask, thereby forming a first hard mask pattern, and the hard mask layer is patterned by using the first hard mask pattern, thereby forming a second hard mask pattern.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ming-Wen HSIAO, Chun-Yen TAI, Yen-Hsin LIU, Ming-Jhih KUO, Ming-Feng SHIEH
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Patent number: 11925457Abstract: A device for encouraging and guiding a spirometer user includes a housing, a main valve, a visual assembly, and a sound making assembly. The housing has a guiding channel, a first outlet channel, a second outlet channel, and an inlet channel. The main valve is disposed in a housing communicating with the guiding channel, the first outlet channel, the second outlet channel or the inlet channel and configured to regulate or control fluid flowing paths. The visual assembly includes a check valve in the second outlet channel, and at least one movable member. The sound making assembly includes a check valve and a sound maker. So, it can generate the visual and sound encouraging effects for learning how to use a spirometer correctly.Type: GrantFiled: February 17, 2021Date of Patent: March 12, 2024Assignees: TAICHUNG VETERANS GENERAL HOSPITAL, CENTRAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGYInventors: Ming-Feng Wu, Yu-Hsuan Chen, Kuo-Chih Su, Chun-Hsiang Wang
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Patent number: 11926787Abstract: A well cementing method is described for improving cementing quality by controlling the hydration heat of cement slurry. By controlling the degree and/or rate of hydration heat release from cement slurry, the method improves the hydration heat release during formation of cement with curing of cement slurry, improves the binding quality between the cement and the interfaces, and in turn improves the cementing quality at the open hole section and/or the overlap section. The cementing method improves cementing quality of oil and gas wells and reduces the risk of annular pressure.Type: GrantFiled: April 21, 2020Date of Patent: March 12, 2024Assignees: PetroChina Company Limited, CNPC Engineering Technology R&D Company LimitedInventors: Shuoqiong Liu, Hua Zhang, Jianzhou Jin, Ming Xu, Yongjin Yu, Fengzhong Qi, Congfeng Qu, Hong Yue, Youcheng Zheng, Wei Li, Yong Ma, Youzhi Zheng, Zhao Huang, Jinping Yuan, Zhiwei Ding, Chongfeng Zhou, Chi Zhang, Zishuai Liu, Hongfei Ji, Yuchao Guo, Xiujian Xia, Yong Li, Jiyun Shen, Huiting Liu, Yusi Feng, Bin Lyu
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Publication number: 20240074615Abstract: A pepper mill includes a receiving unit, a grinding unit, and an adjusting mechanism. The receiving unit includes a stationary seat and a rotatable seat. The grinding unit includes inner and outer grinding seats. The adjusting mechanism includes an operating base mounted in the rotatable seat and operable to rotate about a rotary axis, and a movable seat disposed between the operating base and the inner grinding seat. The operating base includes a threaded rod extending upwardly into and threadedly engaging the movable seat. The movable seat is connected co-rotatably to the rotatable seat, is movable with the inner grinding seat along the rotary axis, and is not rotatable relative to the rotatable seat. Rotation of the operating base drives the movable seat to move along the rotary axis under guidance of the rotatable seat, thereby driving the inner grinding seat to move along the rotary axis.Type: ApplicationFiled: May 24, 2023Publication date: March 7, 2024Inventor: Ming-Feng WU
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Publication number: 20240077922Abstract: An electronic system using a USB type-C port and an abnormal elimination method thereof are provided. After sending a hard reset request to a power adapter, a host device determines whether to enter an error recovery state according to whether an initialization signal is at a first preset level for a first preset time, so that the initialization signal is changed to a second preset level, or whether to force the initialization signal to change to the second preset level according to whether the initialization signal is at the first preset level for a second preset time.Type: ApplicationFiled: November 30, 2022Publication date: March 7, 2024Applicant: Acer IncorporatedInventors: Yuan-Yi Li, Ming-Feng Hsieh, Chun-Chih Kuo
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Publication number: 20240077196Abstract: A lamp structure of an umbrella contains a body, an illumination device, and a control pusher. The body includes a shaft, a notch, a runner slidably, and multiple stretchers. The illumination device includes at least one lighting element, a circuit board, and a battery. The circuit board has a control switch, when the runner is moved upward to push the illumination device, the umbrella is opened. The control pusher is connected to the runner and includes a controlling element. The control pusher is slid vertically with respect to the shaft and is switched in three-section positions, such that the control pusher is slid to a first position, a second position, and a third position relative to the shaft to drive the control switch to be conducted or not so that the circuit board controls the at least one lighting element to power on or off.Type: ApplicationFiled: August 22, 2023Publication date: March 7, 2024Inventors: SHUN-JUNG CHEN, SUN-FENG SUNG, MING-HSIUNG CHEN
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Patent number: 11924534Abstract: This disclosure provides a lens assembly that has an optical path and includes a lens element and a light-blocking membrane layer. The lens element has an optical portion, and the optical path passes through the optical portion. The light-blocking membrane layer is coated on the lens element and adjacent to the optical portion. The light-blocking membrane layer has a distal side and a proximal side that is located closer to the optical portion than the distal side. The proximal side includes two extension structures and a recessed structure. Each of the extension structures extends along a direction away from the distal side, and the extension structures are not overlapped with each other in a direction in parallel with the optical path. The recessed structure is connected to the extension structures and recessed along a direction towards the distal side.Type: GrantFiled: November 10, 2021Date of Patent: March 5, 2024Assignee: LARGAN PRECISION CO., LTD.Inventors: Jyun-Jia Cheng, Yu Chen Lai, Ming-Ta Chou, Cheng-Feng Lin, Chen-Yi Huang