Abstract: A device including a first receptacle for receiving a first electronic device, a second receptacle for receiving a second electronic device, a first switching charger for fast charging the first electronic device, and a second switching charger for fast charging the second electronic device. The device may determine that the first electronic device is communicatively coupled to the device within the first receptacle and that the second electronic device is communicatively coupled to the device within the second receptacle. The device may receive a first request from the first electronic device to fast charge the first electronic device via the first switching charger and charge the first electronic device via the first switching charger. Additionally, the device may receive a second request from the second electronic device to fast charge the second electronic device via the second switching charger and charge the second electronic device via the second switching charger.

Abstract: The disclosure provides an electrical apparatus. The electrical apparatus includes a timing controller, a data driver circuit, and a display panel. The timing controller is configured to receive at least one data polarity configuration signal. The timing controller generates and outputs a plurality of polarity inversion signals according to the data polarity configuration signal. The phases of the polarity inversion signals are different. The data driver circuit is coupled to the timing controller. The data driver circuit is configured to receive the polarity inversion signals. The display panel is coupled to the data driver circuit. The display panel is configured to display images. The data driver circuit drives the display panel to display the images according to the polarity inversion signals.

Abstract: A spine connecting rod includes a coupling assembly, a first rod and a second rod. The coupling assembly includes a cylindrical body having first and second coupling parts and a cylindrical elastic part inside the body. The first rod, pivotally connected with the coupling assembly, has a diameter less than any inner diameter of the elastic part and the first coupling part. One end of the first rod is furnished with a ball having a diameter greater than that of the first rod and any inner diameters of the elastic part and the second coupling part. The second rod is connected with the coupling assembly. The first and second rods protrude out of the first and second coupling parts, respectively. The ball of the first rod is rotationally disposed inside the coupling assembly to allow the first rod to undergo elastic movements via the elastic part.

Abstract: Examples of hybrid powertrain systems are provided herein. The system includes: an engine; a motor/generator (“MG”); a clutch coupled to the engine and the MG; a transmission coupled to the MG; an energy storage system connected to the MG; and a controller coupled to the engine, the MG, the clutch, the transmission and the energy storage system. The controller is configured to initiate an engine stop, allow engine torque and MG torque to reduce to zero or near zero, shift the transmission to a neutral gear, cause the MG to operate in a generator mode, thereby loading the engine to recover kinetic energy from the engine, disengage the clutch to decouple the MG from the engine, increase the speed of the MG to a target speed, and shift the transmission into gear in response to the MG reaching the target speed.

Abstract: A display device is provided and includes a display panel, a light source, a light source controller, and a timing controller. The light source is adjacent to the display panel. The light source controller is electrically connected to the light source. The timing controller is electrically connected to the light source controller and the display panel. The timing controller includes a decoding unit and first and second processing units. The first processing unit is electrically connected to the decoding unit and the display panel. The second processing unit is electrically connected to the decoding unit and the light source controller. The decoding unit provides a refresh signal to the first and second processing units so that the display panel refreshes displayed content in a first refresh sequence according to first refresh rates, and the light source refreshes brightness in a second refresh sequence according to second refresh rates.

Abstract: A semiconductor structure includes an isolation feature formed in the semiconductor substrate and a first fin-type active region. The first fin-type active region extends in a first direction. A dummy gate stack is disposed on an end region of the first fin-type active region. The dummy, gate stack may overlie an isolation structure. In an embodiment, any recess such as formed for a source/drain region in the first fin-type active region will be displaced from the isolation region by the distance the dummy gate stack overlaps the first fin-type active region.

Abstract: A tool path for treating a shoe upper may be generated to treat substantially only the surface of the shoe bounded by a bite line. The bite line may be defined to correspond to the junction of the shoe upper and a shoe bottom unit. Bite line data and three-dimensional profile data representing at least a portion of a surface of a shoe upper bounded by a bite line may be utilized in combination to generate a tool path for processing the surface of the upper, such as automated application of adhesive to the surface of a lasted upper bounded by a bite line.

Abstract: A memory device includes a first electrode, a first support layer, a dielectric layer and a second electrode. The first electrode is disposed on a substrate and extending upwards. The first support layer laterally supports an upper portion of a sidewall of the first electrode, where the first support layer has a slim portion. The dielectric layer is disposed on the first electrode and the first support layer. The second electrode is disposed on the dielectric layer. In addition, a method of fabricating the memory device is provided.

Abstract: In a system having a hybrid powertrain having a piston internal combustion engine, and a motor/generator, and the motor generator being coupleable to a clutch and thereby to a gearbox, the engine further being equipped with a valvetrain control system operable to change the engine valve operation between a first mode in which the engine can operate in a conventional internal combustion mode and a second mode in which pumping losses are reduced when the engine is not operating in a conventional internal combustion mode. This allows it to be rotated without generating power, in a hybrid mode, with minimal losses.

Abstract: A method of fabricating a semiconductor integrated circuit (IC) is disclosed. A first conductive feature and a second conductive feature are provided. A first hard mask (HM) is formed on the first conductive feature. A patterned dielectric layer is formed over the first and the second conductive features, with first openings to expose the second conductive features. A first metal plug is formed in the first opening to contact the second conductive features. A second HM is formed on the first metal plugs and another patterned dielectric layer is formed over the substrate, with second openings to expose a subset of the first metal plugs and the first conductive features. A second metal plug is formed in the second openings.

Abstract: A semiconductor structure includes an isolation feature formed in the semiconductor substrate and a first fin-type active region. The first fin-type active region extends in a first direction. A dummy gate stack is disposed on an end region of the first fin-type active region. The dummy gate stack may overlie an isolation structure. In an embodiment, any recess such as formed for a source/drain region in the first fin-type active region will be displaced from the isolation region by the distance the dummy gate stack overlaps the first fin-type active region.

Abstract: A method of manufacturing a semiconductor structure includes depositing a silicon layer over a substrate, removing a portion of the silicon layer to form a gate stack, and performing a hydrogen treatment on the gate stack to repair a plurality of voids in the stack structure.

Abstract: An optical assembly includes a first prism and a second prism. The first prism has a first surface. The first surface includes a first optical region. The second prism has a second surface. The first and the second surface are disposed facing each other. The second surface includes a second optical region, in which on a first reference plane, an orthographic projection of the first optical region overlaps an orthographic projection of the second optical region, and the first reference plane is substantially parallel to the first surface or the second surface. When the optical assembly is at a first temperature, at least one of the first optical region and the second optical region is concave, and a vertical distance between the first and the second optical region gradually decreases from a first center point of the first optical region to a first edge of the first optical region.

Abstract: A three dimensional printing apparatus including a carrying plate, a transparent plate, an elastic film, and a bump is provided. The transparent plate is disposed on the carrying plate. The elastic film is disposed on the transparent plate. The bump is disposed between the elastic film and the carrying plate. An interface between the transparent plate and the elastic film is in communication with an external space through a fluid channel between each bump and the elastic film. An orthographic projection area of the bump on the transparent plate is not more than ¼ of a surface area of the transparent plate.

Abstract: An electronic device includes an array substrate. The array substrate includes first to third gate lines, a first to third pixel units, and a gate driving circuit. The third gate line is disposed between the first and second gate lines. The first pixel unit is electrically connected to the first gate line and the data line. The second pixel unit is electrically connected to the second gate line and the data line. The third pixel unit is electrically connected to the third gate line and the data line. The gate driving circuit is electrically connected to the first to third gate lines. The gate driving circuit provides a first gate driving signal to the first pixel unit, a second gate driving signal to the second pixel unit, and a third gate driving signal to the third pixel unit in a time sequence.

Abstract: A light source driving circuit and a method for driving a light source are provided. The light source driving circuit includes a filter. The filter is configured to receive a pixel signal. The filter selects one filter parameter from multiple filter parameters according to a gray level value of the pixel signal. The filter performs a filter operation on the pixel signal according to the selected filter parameter, so as to output a driving signal to drive a light source module. The filter parameters include a first filter parameter, a second filter parameter, and a third filter parameter. The second filter parameter is obtained by performing an interpolation operation on the first filter parameter and the second filter parameter via the filter.

Abstract: Methods and apparatuses for connecting multiple loads with a common return pin in engine control module application are disclosed. Only one of the multiple loads can be connected to a power source at a time. At the high side, each load is coupled to the power source through a respective pin at a connector. At the low side, the multiple loads share a common return pin at the connector that connects the loads to the ground. When a first load is connected to the power source at the high side, a first low side driver circuit is used to connect the first load to the ground at the low side. When a second load is connected to the power source at the high side, the second low side driver circuit is used to connect the second load to the ground at the low side.

Abstract: In an embodiment, a robotic arm includes: a base; at least one link secured to the base; a gripper secured to the at least one link, wherein: the gripper comprises a finger, the gripper is configured to secure a wafer while the at least one link is in motion, and the gripper is configured to release the wafer while the at least one link is stopped, a sensor disposed on the finger, the sensor configured to collect sensor data characterizing the robotic arm's interaction with a semiconductor processing chamber while the wafer is secured using the finger.

Abstract: Manufacturing and assembly of a shoe or a portion of a shoe is enhanced by automated placement and assembly of shoe parts. For example, a part-recognition system analyzes an image of a shoe part to identify the part and determine a location of the part. Once the part is identified and located, the part can be manipulated by an automated manufacturing tool.