Abstract: An IoT device password sharing system comprises a cloud server, at least one first smart device, at least one second smart device and at least one smart lock, and is connected to the cloud server through an application software of the first smart device, thereby setting a password message for the smart lock remotely, and transmitting the password message to the second smart device through the cloud server, and the second smart device is capable of opening the password message through an application software thereof and sharing the received password message, thereby achieving an object of opening the smart lock.

Abstract: A separate auxiliary digital lock structure includes: a panel device mounted on an outer side of the door panel and having at least one trigger module and a wireless signal transmission module, the trigger module generating and sending an unlocking trigger signal to the wireless signal transmission module; and a latch device mounted on an inner side of the door panel and having at least one latch control module, a wireless signal receiving module and a lock module, the wireless signal receiving module receiving and sending the unlocking trigger signal to the latch control module, allowing the latch control module to controllably cause the lock module to separate from a door frame. The separate auxiliary digital lock structure can be installed on the door panel yet still keeps the door panel intact. The panel device and latch device are attached to the door panel and perform wireless signal transmission.

Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.

Abstract: A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to the first surface. The thin film transistor (TFT) module is disposed adjacent to and electrically connected to the first surface of the main substrate. The first electronic component is disposed adjacent to and electrically connected to the first surface of the main substrate. The encapsulant covers the at least one thin film transistor (TFT) module and the at least one first electronic component. The light emitting devices are electrically connected to the at least one thin film transistor (TFT) module.

Abstract: A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to the first surface. The thin film transistor (TFT) module is disposed adjacent to and electrically connected to the first surface of the main substrate. The first electronic component is disposed adjacent to and electrically connected to the first surface of the main substrate. The encapsulant covers the at least one thin film transistor (TFT) module and the at least one first electronic component. The light emitting devices are electrically connected to the at least one thin film transistor (TFT) module.

Abstract: An electronic device is disclosed. The electronic device includes a carrier having a first surface and a first lateral surface, an antenna adjacent to the first surface of the carrier, and a shielding layer covering a portion of the first lateral surface of the carrier. The shielding layer is configured to allow a gain of the antenna to be greater than 20 dB.

Abstract: Disclosed is a control circuit of an atmospheric plasma generating device, comprising: a power supply suppling power to the control circuit, a switching element, a first set of resistors, a second set of resistors, a set of Zener diodes, a set of transistors electrically coupled to the switching element, the set of Zener diodes, the first set of resistors and the second set of resistors. The control circuit further includes a capacitor, an inductor, and a set of diodes electrically coupled to the first set of resistors or the second set of resistors.

Abstract: A water-cooling plate and a manufacturing method of a water-cooling plate seat are disclosed. The manufacturing method includes a preparing step, a planing step and a forming step. The preparing step is to provide a substrate, the substrate has a top surface and a bottom surface. The planing step is to process a planing operation to make fins protruding from the top surface of the substrate. The forming step is to provide a top mold and a bottom mold, the top mold is engaged with the bottom mold to make the substrate be bent to form a surrounding wall protruding out of the top surface and surrounding the fins. Accordingly, the seat is formed in one piece to make the thermal resistance be reduced, and subsequent processes and the assembly or disassembly are facilitated.

Abstract: A heat sink structure includes a seat, multiple fins and a cover body. The seat includes a bottom plate and an annular peripheral plate upward extended from the bottom plate. An accommodation space recessed on the seat is enclosed by the bottom plate and the annular peripheral plate. The fins are disposed in the accommodation space. The cover body correspondingly covers the seat and is screwed to the annular peripheral plate. Thereby, the heat sink structure has great cooling efficiency.

Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.

Abstract: The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.

Abstract: An electronic device is disclosed. The electronic device includes a carrier having a first surface and a first lateral surface, an antenna adjacent to the first surface of the carrier, and a shielding layer covering a portion of the first lateral surface of the carrier. The shielding layer is configured to allow a gain of the antenna to be greater than 20 dB.

Abstract: Disclosed is a control circuit of an atmospheric plasma generating device, comprising: a power supply suppling power to the control circuit, a switching element, a first set of resistors, a second set of resistors, a set of Zener diodes, a set of transistors electrically coupled to the switching element, the set of Zener diodes, the first set of resistors and the second set of resistors. The control circuit further includes a capacitor, an inductor, and a set of diodes electrically coupled to the first set of resistors or the second set of resistors.

Abstract: The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.

Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: Disclosed embodiments provide a virtual topology in response to an allocation request. The virtual topology is a synchronized subgraph of the physical topology. The synchronized subgraph virtual topology mirrors the physical topology in terms of tree structure. However, merely sharing the physical topology with users/customers is not feasible, as it may reveal additional infrastructure details such as MAC addresses, IP addresses, and the like, that can compromise security and/or jeopardize multi-tenant operations. Disclosed embodiments create virtual topology structures with obfuscated node data, so that important data such as physical IP addresses and/or MAC addresses are hidden from the end-users. Thus, disclosed embodiments provide the benefits of performance enhancement that comes from sharing the topology without the downside of compromising security by revealing physical topology details.

Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.

Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.

Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.