Abstract: Disclosed is a module structure including a front sheet, a back sheet, and an optotronic device disposed between the front sheet and the back sheet. A first encapsulate layer is disposed between the optotronic device and the front sheet. A second encapsulate layer is disposed between the optotronic device and the back sheet. The back sheet is a layered structure of a hydrogenated styrene elastomer resin layer and a polyolefin layer, wherein the hydrogenated styrene elastomer resin layer is disposed between the second encapsulate layer and the polyolefin layer.

Abstract: Disclosed is a module structure including a front sheet, a back sheet, and an optoelectronic device disposed between the front sheet and the back sheet. A first packaging layer is disposed between the optoelectronic device and the front sheet. The back sheet is a layered structure of a hydrogenated styrene elastomer resin layer and a polyolefin layer, wherein the hydrogenated styrene elastomer resin layer is disposed between the optoelectronic device and the polyolefin layer.

Abstract: A high-voltage alternating current (AC) light-emitting diode (LED) structure is provided. The high-voltage AC LED structure includes a circuit substrate and a plurality of high-voltage LED (HV LED) chips. Each one of the HV LED chips includes a first substrate, an adhering layer, first ohmic contact layers, epi-layers, a first insulating layer, at least two first electrically conducting plates, at least two second electrically conducting plates, and a second substrate. The HV LED chips manufactured by a wafer-level process are coupled to the low-cost circuit substrate to produce the downsized high-voltage AC LED structure.

Abstract: A high-luminance ultraviolet (UV) light-emitting diode (LED) nail lamp structure and an LED light source module thereof are provided. The LED nail lamp structure includes a housing and an LED light source module. The LED light source module is provided in the housing and has a plurality of UV LEDs, wherein each UV LED has an LED chip disposed in a concave lamp cup. The LED nail lamp structure features high luminance and good lighting effect.

Abstract: The present invention discloses a LED package structure with transparent electrodes. The electrode layers the semiconductor layers inside the LED chip and the protection layer are all transparent to visible and invisible lights. With the adoption of the present invention, electrodes on the LED package no longer block any part of the light emission from inside the LED.

Abstract: Disclosed are an LED lamp structure driven by double current and a double current driving method thereof. The LED lamp structure driven by double current includes a COB package, a temperature sensor, and a controller. The COB package is provided therein with a blue LED chipset to be driven by a first current and a red LED chipset to be driven by a second current. The temperature sensor detects the working temperature of the red LED chipset, and the controller performs dynamic adjustment on the second current according to the working temperature so as to stabilize the color temperature of the LED lamp structure. Thus, as soon as the LED lamp structure is activated, its color temperature will be stabilized to ensure user comfort, which may otherwise be disturbed by variation of the color temperature.

Abstract: The present invention provides a high-voltage alternating current light-emitting diode (AC LED) structure. The high-voltage AC LED structure includes a circuit substrate and a plurality of AC LED chips. The AC LED chips each include an insulated substrate, an LED set, a first metal layer and a second metal layer. The AC LED chips manufactured by a wafer level process are coupled to the low-cost circuit substrate to produce the downsized high-voltage AC LED structure.

Abstract: An installation structure of countertop faucet includes a base having an insertion section extending through a mounting hole formed in a counter to engage a locking nut to be secured. The insertion section has a top end forming a receiving bore of which a circumferential wall forming two positioning holes communicating with the receiving bore. Each positioning hole receives therein a releasing module. The bottom of the base forms two water inlet passages communicating with the receiving bore and receiving stop valves therein and coupled to couplers for connection with water inlet tubes. A faucet has a joint section received in the receiving bore and having water guide tubes fit into the water inlet passages. The joint section forms two receiving apertures receiving therein positioning modules respectively engageable with the positioning holes to fix the faucet and being released by the releasing module to detach the faucet from the base.

Abstract: A liquid crystal (LC) display device includes a first substrate having a pixel unit and a second substrate. The pixel unit has a pixel electrode unit including a primary electrode region. A LC layer with chiral dopants is disposed between the first and second substrates. The pixel unit has a first boundary along a horizontal direction of an upper portion of the pixel unit. The first boundary has a first central point. The primary electrode region has a first side along the horizontal direction of an upper portion of the primary electrode region. The first side has a second central point left to the first central point. The primary electrode region has a second side located on the left to the second central point, and a first angle between the first and second sides is larger than 90 degrees or equal to 90 degrees.

Abstract: A single molecule detection platform is disclosed. The single molecule detection platform comprises a light-transmissive substrate, a plurality of spherical particles and a thin film. The surface of the light-transmissive substrate is etched to form a plurality of cone-shaped structures. Each spherical particle is disposed on top of each cone-shaped structure. The sizes of the plurality of spherical particles are suitable to allow only a single protein to be attached to each spherical particle. The thin film is deposited on the surface of the plurality of cone-shaped structures and acts as a reflective layer of one-dimensional waveguide. The plurality of spherical particles is not covered by the thin film.

Abstract: A low-light-emitting-angle high-luminance ultraviolet (UV) light-emitting diode (LED) nail lamp structure and an LED light source module thereof are provided. The UV LED nail lamp structure includes a housing and an LED light source module. The LED light source module is provided in the housing and has a plurality of UV LEDs, wherein the light-emitting angle of each UV LED ranges between 25° and 80°. The UV LED nail lamp structure features high luminance and enhanced lighting effect.

Abstract: The present invention provides a high-voltage alternating current light-emitting diode (AC LED) structure. The high-voltage AC LED structure includes a circuit substrate and a plurality of AC LED chips. The AC LED chips each include an insulated substrate, an LED set, a first metal layer and a second metal layer. The AC LED chips manufactured by a wafer level process are coupled to the low-cost circuit substrate to produce the downsized high-voltage AC LED structure.

Abstract: A high-voltage alternating current (AC) light-emitting diode (LED) structure is provided. The high-voltage AC LED structure includes a circuit substrate and a plurality of high-voltage LED (HV LED) chips. Each one of the HV LED chips includes a first substrate, an adhering layer, first ohmic contact layers, epi-layers, a first insulating layer, at least two first electrically conducting plates, at least two second electrically conducting plates, and a second substrate. The HV LED chips manufactured by a wafer-level process are coupled to the low-cost circuit substrate to produce the downsized high-voltage AC LED structure.

Abstract: A high-luminance ultraviolet (UV) light-emitting diode (LED) nail lamp structure and an LED light source module thereof are provided. The LED nail lamp structure includes a housing and an LED light source module. The LED light source module is provided in the housing and has a plurality of UV LEDs, wherein each UV LED has an LED chip disposed in a concave lamp cup. The LED nail lamp structure features high luminance and good lighting effect.

Abstract: A manufacturing method and a structure of a light-emitting diode (LED) chip are disclosed. The method includes the steps of: providing a conductive block; providing an epitaxial block; bonding; removing an epitaxial substrate; making independent LEDs; forming a dielectric layer; and making electrical connection. A first LED, a second LED, and a third LED are formed on the conductive block, wherein the first and second LEDs are electrically connected in series, and the second and third LEDs are electrically connected in parallel. Thus, a basic unit with a flexible design of series- and parallel-connected LEDs can be formed to increase the variety and application of LED chip-based designs.

Abstract: A safety connector assembly for a lanyard having a first end portion and a second end portion includes a first connecting portion and a second connecting portion. The first connecting portion included a first surface, a second surface, an accommodating space, and a ring protrusion. The first surface is connected to the first end portion. The accommodating space is on the second surface. The ring protrusion extends from the accommodating space. The second connecting portion includes a third surface, a fourth surface, and a protruding portion. The third surface is connected to the second end portion. The protruding portion includes a protrusion and extends from the fourth surface. The protrusion is spaced apart from the fourth surface to form a space therebetween. When the first connecting portion interconnects with the second connecting portion, the protruding portion extends into the accommodating space and the ring protrusion abuts against the protrusion.

Abstract: A water outflow device includes a joint and an outflow component. The joint includes a connector, sleeve, plunger, and a spring. The connector having a through hole is threaded to a house pipe and a threaded port of the sleeve respectively. The sleeve has a connection port on an opposite end against the threaded port. The plunger is movable between a close position and an open position so as to link or isolate the through hole of the connector and the connection port of the sleeve. The spring arranged inside the connector serves to push the plunger to maintain the plunger in the close position. The outflow component has a buckle portion, seal portion, and a push portion. The buckle portion is separably arranged to the connection port of the sleeve. The seal portion is extending from the buckle portion.

Abstract: An LED base structure with an embedded capacitor includes a body, at least one pair of metal layers, at least one dielectric layer, and at least two conductive channels. The body is an insulating base. The metal layers are disposed in the body, and the dielectric layer is disposed between the metal layers, so as to form an embedded capacitor. The conductive channels are electrically connected to the metal layers, respectively. The LED base structure is further electrically connected to a resistor for forming a resistor-capacitor delay circuit whereby a phase delay is effectuated whenever AC power is supplied to the LED base structure, so as to control the time for switching on one of two parallel-connected LEDs and, as a result, prevent the LEDs from flashing which might otherwise arise when the LEDs are supplied with AC power.

Abstract: A manufacturing method for an axially symmetric light-emitting diode assembly disclosed herein includes steps of: providing a substrate; and forming a plurality of light-emitting areas on the substrate. The substrate has a central axis. The light-emitting areas are arranged with axial symmetry around the central axis while being insulated from each other. Each of the light-emitting areas has at least one light-emitting diode, and the light-emitting diodes are electrically connected to each other. Since the light-emitting areas are formed on the substrate with the axially symmetric arrangement, the axially symmetric light-emitting diode assembly can present a well symmetric light pattern.