Patents by Inventor Ming-Hung Chen
Ming-Hung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230413454Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.Type: ApplicationFiled: August 29, 2023Publication date: December 21, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Yung I YEH, Chang-Lin YEH, Sheng-Yu CHEN
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Publication number: 20230401098Abstract: Approaches presented herein enable provisional scheduling of resources in a cloud computing environment. More specifically, a first group request to host an application is obtained. This first group request includes one or more virtual units, which each have one or more topological constraints. One or more resources are scheduled for each of the virtual units. This scheduling includes provisionally allocating the resources to each of the virtual units according to the topological constraints. Each resource comprises a respective weight. In response to obtaining a second group request, the resources are provisionally re-allocated to one or more virtual units of the second group request according to one or more topological constraints of the second group request and the respective weight of each of the resources. This re-allocating minimizes a summation of each respective weight of the resources. A new respective weight is then assigned to each of the resources.Type: ApplicationFiled: December 6, 2022Publication date: December 14, 2023Inventors: Asser Nasreldin Tantawi, Ming-Hung Chen, Pavlos Maniotis, Claudia Misale, Laurent Schares, Seetharami R. Seelam, Hao Yu
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Publication number: 20230335505Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.Type: ApplicationFiled: June 20, 2023Publication date: October 19, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Zheng Wei WU
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Publication number: 20230291655Abstract: Disclosed embodiments provide a virtual topology in response to an allocation request. The virtual topology is a synchronized subgraph of the physical topology. The synchronized subgraph virtual topology mirrors the physical topology in terms of tree structure. However, merely sharing the physical topology with users/customers is not feasible, as it may reveal additional infrastructure details such as MAC addresses, IP addresses, and the like, that can compromise security and/or jeopardize multi-tenant operations. Disclosed embodiments create virtual topology structures with obfuscated node data, so that important data such as physical IP addresses and/or MAC addresses are hidden from the end-users. Thus, disclosed embodiments provide the benefits of performance enhancement that comes from sharing the topology without the downside of compromising security by revealing physical topology details.Type: ApplicationFiled: December 6, 2022Publication date: September 14, 2023Inventors: Asser Nasreldin Tantawi, Ming-Hung Chen, Pavlos Maniotis, Claudia Misale, Laurent Schares, Seetharami R. Seelam, Hao Yu
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Patent number: 11744024Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.Type: GrantFiled: January 11, 2022Date of Patent: August 29, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Yung I Yeh, Chang-Lin Yeh, Sheng-Yu Chen
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Patent number: 11682631Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.Type: GrantFiled: June 11, 2021Date of Patent: June 20, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Zheng Wei Wu
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Publication number: 20230187374Abstract: An electronic device is disclosed. The electronic device includes a carrier having a first surface and a first lateral surface, an antenna adjacent to the first surface of the carrier, and a shielding layer covering a portion of the first lateral surface of the carrier. The shielding layer is configured to allow a gain of the antenna to be greater than 20 dB.Type: ApplicationFiled: December 10, 2021Publication date: June 15, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hui-Ping JIAN, Ming-Hung CHEN, Jia-Feng HO
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Publication number: 20230005970Abstract: A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to the first surface. The thin film transistor (TFT) module is disposed adjacent to and electrically connected to the first surface of the main substrate. The first electronic component is disposed adjacent to and electrically connected to the first surface of the main substrate. The encapsulant covers the at least one thin film transistor (TFT) module and the at least one first electronic component. The light emitting devices are electrically connected to the at least one thin film transistor (TFT) module.Type: ApplicationFiled: September 6, 2022Publication date: January 5, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Yung I YEH, Chang-Lin YEH, Sheng-Yu CHEN
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Publication number: 20220399283Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.Type: ApplicationFiled: June 11, 2021Publication date: December 15, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Zheng Wei WU
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Publication number: 20220345044Abstract: A power converter is provided. The power converter includes an LLC converter, a feedback circuit, a first driving circuit, and a second driving circuit. The LLC converter includes a first arm transistor group and a second arm transistor group. The feedback circuit provides a feedback signal corresponding to a current value of the LLC converter. The first driving circuit drives the first arm transistor group in response to the feedback signal and provides a control signal. The second driving circuit drives the second arm transistor group in response to the control signal.Type: ApplicationFiled: January 18, 2022Publication date: October 27, 2022Applicant: Yosun Industrial Corp.Inventor: Ming-Hung Chen
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Publication number: 20220346239Abstract: The present disclosure provides an electronic device and method of manufacturing the same. The electronic device includes a first region, a second region, an electronic component, and a first sensing element. The second region is adjacent to the first region. The first region has a first pliability. The second region has a second pliability. The second pliability is greater than the first pliability. The electronic component is disposed at the first region. The first sensing element is disposed at the second region and electrically connected to the electronic component.Type: ApplicationFiled: April 23, 2021Publication date: October 27, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Tun-Ching PI, Ming-Hung CHEN
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Patent number: 11437415Abstract: A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to the first surface. The thin film transistor (TFT) module is disposed adjacent to and electrically connected to the first surface of the main substrate. The first electronic component is disposed adjacent to and electrically connected to the first surface of the main substrate. The encapsulant covers the at least one thin film transistor (TFT) module and the at least one first electronic component. The light emitting devices are electrically connected to the at least one thin film transistor (TFT) module.Type: GrantFiled: August 30, 2019Date of Patent: September 6, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Yung I. Yeh, Chang-Lin Yeh, Sheng-Yu Chen
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Publication number: 20220223489Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.Type: ApplicationFiled: March 29, 2022Publication date: July 14, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Sheng-Yu CHEN, Chang-Lin YEH, Ming-Hung CHEN
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Publication number: 20220141971Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.Type: ApplicationFiled: January 11, 2022Publication date: May 5, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Yung I. YEH, Chang-Lin YEH, Sheng-Yu CHEN
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Patent number: 11302647Abstract: The present disclosure provides for a semiconductor device package and a method for manufacturing the same. The semiconductor device package includes a substrate, a conductive element and conductive layers. The substrate has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The conductive element is disposed on the first surface of the substrate. The conductive layers have a first portion on the conductive element and a second portion on the lateral surface of the substrate. A number of layers of the first portion of the conductive layers is different from a number of layers of the second portion of the conductive layers.Type: GrantFiled: May 14, 2020Date of Patent: April 12, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Hui-Ping Jian, Wei-Zhen Qiu
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Publication number: 20220102453Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.Type: ApplicationFiled: December 13, 2021Publication date: March 31, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Sheng-Yu CHEN, Chang-Lin YEH, Yung-I YEH
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Patent number: 11289394Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.Type: GrantFiled: December 23, 2019Date of Patent: March 29, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Sheng-Yu Chen, Chang-Lin Yeh, Ming-Hung Chen
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Patent number: 11224132Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.Type: GrantFiled: September 6, 2019Date of Patent: January 11, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Yung I. Yeh, Chang-Lin Yeh, Sheng-Yu Chen
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Patent number: 11201200Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.Type: GrantFiled: August 23, 2019Date of Patent: December 14, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Hung Chen, Sheng-Yu Chen, Chang-Lin Yeh, Yung-I Yeh
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Publication number: 20210358859Abstract: The present disclosure provides for a semiconductor device package and a method for manufacturing the same. The semiconductor device package includes a substrate, a conductive element and conductive layers. The substrate has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The conductive element is disposed on the first surface of the substrate. The conductive layers have a first portion on the conductive element and a second portion on the lateral surface of the substrate. A number of layers of the first portion of the conductive layers is different from a number of layers of the second portion of the conductive layers.Type: ApplicationFiled: May 14, 2020Publication date: November 18, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Hung CHEN, Hui-Ping JIAN, Wei-Zhen QIU