Abstract: One embodiment disclosed relates to a system for detecting anomalous messaging, discovering compromised accounts, and generating responses to threatened attacks. The system utilizes API commands and log forwarding for interaction and communication between a messaging and account hunting platform, other hunting platforms, an action center, and a security operations center. Another embodiment relates to a method of, and system for, performing a complete root cause analysis. Another embodiment relates to a method of, and system for, anomaly discovery which may advantageously utilize reference data to correlate different anomalies for reporting as a single incident.

Abstract: A semiconductor device package includes a first substrate, a dielectric layer, a thin film transistor (TFT) and an electronic component. The first substrate has a first surface and a second surface opposite to the first surface. The dielectric layer is disposed on the first surface of the first substrate. The dielectric layer has a first surface facing away from the first substrate and a second surface opposite to the first surface. The TFT layer is disposed on the dielectric layer. The electronic component is disposed on the second surface of the first substrate. A roughness of the first surface of the dielectric layer is less than a roughness of the first surface of the first substrate.

Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.

Abstract: A smart home includes Internet of things (IOT) devices that are paired with an IOT gateway. A backend system is in communication with the IOT gateway to receive IOT operating data of the IOT devices. The backend system generates a machine learning model for an IOT device. The machine learning model is consulted with IOT operating data of the IOT device to detect anomalous operating behavior of the IOT device. The machine learning model is updated as more and newer IOT operating data of the IOT device are received by the backend system.

Abstract: A transfer device for transferring a substrate is provided, including a base plate, at least one suction unit disposed on a side of the base plate to generate suction on the substrate, and a plurality of movement restriction units disposed on the side of the base plate to limit the movement of the substrate during transfer. Each of the movement restriction units includes a main body, an abutting member, and a pusher. The main body is attached to the base plate and has a chamber therein. The abutting member is movably received in the chamber and has an abutting portion that protrudes beyond the main body to abut the substrate. The pusher is received in the chamber and configured to push the abutting member to move toward the substrate.

Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to the first surface. The thin film transistor (TFT) module is disposed adjacent to and electrically connected to the first surface of the main substrate. The first electronic component is disposed adjacent to and electrically connected to the first surface of the main substrate. The encapsulant covers the at least one thin film transistor (TFT) module and the at least one first electronic component. The light emitting devices are electrically connected to the at least one thin film transistor (TFT) module.

Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.

Abstract: A semiconductor device package includes a first substrate, a dielectric layer, a thin film transistor (TFT) and an electronic component. The first substrate has a first surface and a second surface opposite to the first surface. The dielectric layer is disposed on the first surface of the first substrate. The dielectric layer has a first surface facing away from the first substrate and a second surface opposite to the first surface. The TFT layer is disposed on the dielectric layer. The electronic component is disposed on the second surface of the first substrate. A roughness of the first surface of the dielectric layer is less than a roughness of the first surface of the first substrate.

Abstract: A transfer device for transferring a substrate is provided, including a base plate, at least one suction unit disposed on a side of the base plate to generate suction on the substrate, and a plurality of movement restriction units disposed on the side of the base plate to limit the movement of the substrate during transfer. Each of the movement restriction units includes a main body, an abutting member, and a pusher. The main body is attached to the base plate and has a chamber therein. The abutting member is movably received in the chamber and has an abutting portion that protrudes beyond the main body to abut the substrate. The pusher is received in the chamber and configured to push the abutting member to move toward the substrate.

Abstract: A semiconductor package structure includes a semiconductor die, at least one wiring structure, an encapsulant and a plurality of conductive elements. The semiconductor die has an active surface. The at least one wiring structure is electrically connected to the active surface of the semiconductor die. The encapsulant surrounds the semiconductor die. The encapsulant is formed from an encapsulating material, and a Young's Modulus of the encapsulant is from 0.001 GPa to 1 GPa. The conductive elements are embedded in the encapsulant, and are electrically connected to the at least one wiring structure.

Abstract: A semiconductor package structure includes a semiconductor die, at least one wiring structure, an encapsulant and a plurality of conductive elements. The semiconductor die has an active surface. The at least one wiring structure is electrically connected to the active surface of the semiconductor die. The encapsulant surrounds the semiconductor die. The encapsulant is formed from an encapsulating material, and a Young's Modulus of the encapsulant is from 0.001 GPa to 1 GPa. The conductive elements are embedded in the encapsulant, and are electrically connected to the at least one wiring structure.

Abstract: An electronic paper display apparatus and a driving method thereof are provided. The electronic paper display apparatus includes an electronic paper display panel and a control chip. The control chip is coupled to the electronic paper display panel. The control chip is configured to generate a clock signal and simulate a driving signal according to the clock signal and panel control data. The control chip drives the electronic paper display panel by utilizing the clock signal and the driving signal.

Abstract: A semiconductor device package includes a substrate, a first insulation layer, a support film and an interconnection structure. The substrate has a first sidewall, a first surface and a second surface opposite to the first surface. The first insulation layer is on the first surface of the substrate and has a second sidewall. The first insulation layer has a first surface and a second surface adjacent to the substrate and opposite to the first surface of the first insulation layer. The support film is on the second surface of the substrate and has a third sidewall. The support film has a first surface adjacent to the substrate and a second surface opposite to the first surface of the support film. The interconnection structure extends from the first surface of the first insulation layer to the second surface of the support film via the first insulation layer and the support film. The interconnection structure covers the first, second and third sidewalls.

Abstract: A semiconductor device package includes a substrate, a semiconductor device, and an underfill. The substrate includes a top surface defining a mounting area, and a barrier section on the top surface and adjacent to the mounting area. The semiconductor device is mounted on the mounting area of the substrate. The underfill is disposed between the semiconductor device and the mounting area and the barrier section of the substrate. A contact angle between a surface of the underfill and the barrier section is greater than or equal to about 90 degrees.

Abstract: A semiconductor device package includes a substrate, a first insulation layer, a support film and an interconnection structure. The substrate has a first sidewall, a first surface and a second surface opposite to the first surface. The first insulation layer is on the first surface of the substrate and has a second sidewall. The first insulation layer has a first surface and a second surface adjacent to the substrate and opposite to the first surface of the first insulation layer. The support film is on the second surface of the substrate and has a third sidewall. The support film has a first surface adjacent to the substrate and a second surface opposite to the first surface of the support film. The interconnection structure extends from the first surface of the first insulation layer to the second surface of the support film via the first insulation layer and the support film. The interconnection structure covers the first, second and third sidewalls.

Abstract: The present disclosure relates to a semiconductor device package comprising a substrate, a semiconductor device, and a underfill. The substrate includes a top surface defining a mounting area, and a barrier section on the top surface and adjacent to the mounting area. The semiconductor device is mounted on the mounting area of the substrate. The underfill is disposed between the semiconductor device and the mounting area and the barrier section of the substrate. A contact angle between a surface of the underfill and the barrier section is greater than or equal to about 90 degrees.

Abstract: An electronic paper display apparatus and a driving method thereof are provided. The electronic paper display apparatus includes an electronic paper display panel and a control chip. The control chip is coupled to the electronic paper display panel. The control chip is configured to generate a clock signal and simulate a driving signal according to the clock signal and panel control data. The control chip drives the electronic paper display panel by utilizing the clock signal and the driving signal.

Abstract: The present disclosure relates to a semiconductor package structure and a method for manufacturing the same. The semiconductor package structure includes a leadframe and a semiconductor die. The leadframe includes a main portion and a protrusion portion. The semiconductor die is bonded to a first surface of the main portion. The protrusion portion protrudes from a second surface of the main portion. The position of the protrusion portion corresponds to the position of the semiconductor die.

Abstract: The present disclosure provides a hair styling tool for padding a hair bundle, comprising: a base, an elastic padding, an adornment structure, and a contact layer. The base has an upper surface, a lower surface, and an opening passing from the upper surface to the lower surface. The elastic padding is disposed on a portion of the upper surface of the base. The adornment structure is disposed on another portion of the upper surface of the base. The contact layer is disposed on the lower surface of the base. A first hair section of the hair bundle covers the elastic padding and is padded thereby. A second hair section of the hair bundle passes through the opening and is pressed by the contact layer, such that the adornment structure is exposed above the second hair section.