Abstract: A safety connector assembly for a lanyard having a first end portion and a second end portion includes a first connecting portion and a second connecting portion. The first connecting portion included a first surface, a second surface, an accommodating space, and a ring protrusion. The first surface is connected to the first end portion. The accommodating space is on the second surface. The ring protrusion extends from the accommodating space. The second connecting portion includes a third surface, a fourth surface, and a protruding portion. The third surface is connected to the second end portion. The protruding portion includes a protrusion and extends from the fourth surface. The protrusion is spaced apart from the fourth surface to form a space therebetween. When the first connecting portion interconnects with the second connecting portion, the protruding portion extends into the accommodating space and the ring protrusion abuts against the protrusion.

Abstract: A water outflow device includes a joint and an outflow component. The joint includes a connector, sleeve, plunger, and a spring. The connector having a through hole is threaded to a house pipe and a threaded port of the sleeve respectively. The sleeve has a connection port on an opposite end against the threaded port. The plunger is movable between a close position and an open position so as to link or isolate the through hole of the connector and the connection port of the sleeve. The spring arranged inside the connector serves to push the plunger to maintain the plunger in the close position. The outflow component has a buckle portion, seal portion, and a push portion. The buckle portion is separably arranged to the connection port of the sleeve. The seal portion is extending from the buckle portion.

Abstract: An LED base structure with an embedded capacitor includes a body, at least one pair of metal layers, at least one dielectric layer, and at least two conductive channels. The body is an insulating base. The metal layers are disposed in the body, and the dielectric layer is disposed between the metal layers, so as to form an embedded capacitor. The conductive channels are electrically connected to the metal layers, respectively. The LED base structure is further electrically connected to a resistor for forming a resistor-capacitor delay circuit whereby a phase delay is effectuated whenever AC power is supplied to the LED base structure, so as to control the time for switching on one of two parallel-connected LEDs and, as a result, prevent the LEDs from flashing which might otherwise arise when the LEDs are supplied with AC power.

Abstract: A manufacturing method for an axially symmetric light-emitting diode assembly disclosed herein includes steps of: providing a substrate; and forming a plurality of light-emitting areas on the substrate. The substrate has a central axis. The light-emitting areas are arranged with axial symmetry around the central axis while being insulated from each other. Each of the light-emitting areas has at least one light-emitting diode, and the light-emitting diodes are electrically connected to each other. Since the light-emitting areas are formed on the substrate with the axially symmetric arrangement, the axially symmetric light-emitting diode assembly can present a well symmetric light pattern.

Abstract: An LED bulb structure having an insertion end includes a first electrically conducting pin, a second electrically conducting pin having a die pad at an end thereof, and an LED unit electrically connected to the first electrically conducting pin and the second electrically conducting pin through a first leading wire and a second leading wire, respectively, and a cap enclosing the above-mentioned components and leaving part of the first electrically conducting pin and the second electrically conducting pin exposed thereoutside. The first and second electrically conducting pins are adapted to form bayonet connections. An LED bulb structure having a heat dissipation element has the heat dissipation element attached to the pin portions of the electrically conducting pins. An LED bulb structure having a heat-and-electricity separated element further has a thermally conducting pin.

Abstract: The present invention relates to an alternating current (AC) light emitting diode (LED) structure with overload protection, which comprises an AC LED, a heat dissipating unit and an overload protecting unit. The AC LED is thermally connected with the heat dissipating unit, and the overload protecting unit is connected in series between the AC LED and a power source. Thus, when an overload current is inputted to the AC LED structure, the temperature of the overload protecting unit will rise to disconnect the AC LED from the power source. In this way, an open-circuit status can be produced timely in the AC LED structure to block the power input into the AC LED for purpose of protection against overload.

Abstract: A photo-catalyst ozone detector includes a base. A positive electrode and a negative electrode are respectively disposed on the base. A photo-catalyst coating is disposed on the base for connecting the positive electrode and the negative electrode, and reacting with the ozone to detect ozone consistency, wherein the photo-catalyst coating contains titanium dioxide.

Abstract: A manufacturing method for an axially symmetric light-emitting diode assembly disclosed herein includes steps of: providing a substrate; and forming a plurality of light-emitting areas on the substrate. The substrate has a central axis. The light-emitting areas are arranged with axial symmetry around the central axis while being insulated from each other. Each of the light-emitting areas has at least one light-emitting diode, and the light-emitting diodes are electrically connected to each other. Since the light-emitting areas are formed on the substrate with the axially symmetric arrangement, the axially symmetric light-emitting diode assembly can present a well symmetric light pattern.

Abstract: An AC LED structure includes an insulating substrate, an LED set, a first metal layer and a second metal layer. The LED set has a first light-emitting diode and a second light-emitting diode, which are deposited on the insulating substrate and insulated from each other. The first metal layer and the second metal layer commonly have a first profile and serve to electrically connect the first light-emitting diode and the second light-emitting diode in an inverse parallel connection. In virtue of the first metal layer and the second metal layer of the first profile deposited on the first light-emitting diode and the second light-emitting diode, the LED set is allowed to be connected in series or in parallel with another LED set according to practical needs, so as to be able to endure high current density or high voltage operation.

Abstract: An LED base structure with an embedded capacitor includes a body, at least one pair of metal layers, at least one dielectric layer, and at least two conductive channels. The body is an insulating base. The metal layers are disposed in the body, and the dielectric layer is disposed between the metal layers, so as to form an embedded capacitor. The conductive channels are electrically connected to the metal layers, respectively. The LED base structure is further electrically connected to a resistor for forming a resistor-capacitor delay circuit whereby a phase delay is effectuated whenever AC power is supplied to the LED base structure, so as to control the time for switching on one of two parallel-connected LEDs and, as a result, prevent the LEDs from flashing which might otherwise arise when the LEDs are supplied with AC power.

Abstract: A single molecule detection platform is disclosed. The single molecule detection platform comprises a light-transmissive substrate, a plurality of spherical particles and a thin film. The surface of the light-transmissive substrate is etched to form a plurality of cone-shaped structures. Each spherical particle is disposed on top of each cone-shaped structure. The sizes of the plurality of spherical particles are suitable to allow only a single protein to be attached to each spherical particle. The thin film is deposited on the surface of the plurality of cone-shaped structures and acts as a reflective layer of one-dimensional waveguide. The plurality of spherical particles is not covered by the thin film.

Abstract: A flexible backlight module includes a light source module and a flexible light guide panel, wherein the flexible light guide panel has a light incident surface, a light reflecting surface, and a light outgoing surface. The light incident surface of the flexible light guide panel is directly connected and thereby optically coupled to the light source module so that the light emitted by the light source module can be completely coupled to the flexible light guide panel. Consequently, the loss of light is reduced while the luminous efficiency of light is increased. Light entering the flexible light guide panel is reflected by the light reflecting surface to the light outgoing surface and then projected outward. The flexible light guide panel can be curved as needed thanks to its flexibility and thus features a wide application range.

Abstract: An LED structure includes a first substrate; an adhering layer formed on the first substrate; first ohmic contact layers formed on the adhering layer; epi-layers formed on the first ohmic contact layers; a first isolation layer covering the first ohmic contact layers and the epi-layers at exposed surfaces thereof; and first electrically conducting plates and second electrically conducting plates, both formed in the first isolation layer and electrically connected to the first ohmic contact layers and the epi-layers, respectively. The trenches allow the LED structure to facilitate complex serial/parallel connection so as to achieve easy and various applications of the LED structure in the form of single structures under a high-voltage environment.

Abstract: A parallel bridge circuit structure and a high-voltage parallel bridge circuit structure are disclosed. The parallel bridge circuit structure includes a first bridge circuit and a second bridge circuit. The first bridge circuit includes a plurality of first diodes, and the second bridge circuit includes a plurality of second diodes. Each of the second diodes is exclusively connected to one of the first diodes in parallel. With the design of the parallel connection between the first bridge circuit and the second bridge circuit, break of the entire circuit caused by a damaged diode is prevented. Moreover, with the aid of the AC signal phase delay circuit structure, the output voltage of the parallel bridge circuit structure can be stable and continuous voltage, while the high-voltage parallel bridge circuit structure includes a plurality of parallel bridge circuit structures so as to endure a high voltage input.

Abstract: A halation-free light-emitting diode holder includes a body and a retaining portion. The body has a die holder, which includes a first surface, a second surface, and an opened end. The retaining portion is provided on the second surface. By using the retaining portion, the optical gel in the die holder is blocked from capillary movement up along the second surface. Furthermore, having nano-material layers further formed on the second surface or having the area of the first surface made greater than the area of the opened-end also prevents the optical gel from climbing along the second surface. Thereby, a light halation circling a light pattern of the resultant light-emitting diode is avoided and the light-emitting diode is improved in luminance uniformity.

Abstract: A manufacturing method and a structure of a light-emitting diode (LED) with a multilayered optical lens are provided. The manufacturing method includes the steps of: providing an LED chip; forming at least one inner protective layer covering the LED chip and its wire connecting points; and forming an outer protective layer covering the inner protective layer. Both the inner and outer protective layers are optical resin layers while the inner protective layer is harder than the outer protective layer. The structure of the LED includes: an LED chip; at least one inner protective layer covering the LED chip and its wire connecting points; and an outer protective layer covering the said inner protective layer. The relatively hard said inner protective layer can resist external force transmitted by the outer protective layer and protect the LED chip and its wire connecting points from damage by the external force.

Abstract: An LED structure includes a first substrate; an adhering layer formed on the first substrate; first ohmic contact layers formed on the adhering layer; epi-layers formed on the first ohmic contact layers; a first isolation layer covering the first ohmic contact layers and the epi-layers at exposed surfaces thereof; and first electrically conducting plates and second electrically conducting plates, both formed in the first isolation layer and electrically connected to the first ohmic contact layers and the epi-layers, respectively. The first trenches or the second trenches allow the LED structure to facilitate complex serial/parallel connection so as to achieve easy and various applications of the LED structure in the form of single structures under a high-voltage environment.

Abstract: An LED bulb structure having an insertion end includes a first electrically conducting pin, a second electrically conducting pin having a die pad at an end thereof, and an LED unit electrically connected to the first electrically conducting pin and the second electrically conducting pin through a first leading wire and a second leading wire, respectively, and a cap enclosing the above-mentioned components and leaving part of the first electrically conducting pin and the second electrically conducting pin exposed thereoutside. The first and second electrically conducting pins are adapted to form bayonet connections. An LED bulb structure having a heat dissipation element has the heat dissipation element attached to the pin portions of the electrically conducting pins. An LED bulb structure having a heat-and-electricity separated element further has a thermally conducting pin.

Abstract: A light emitting diode (LED) package and process of making the same includes a silicon-on-insulator (SOI) substrate that is composed of two silicon based materials and an insulation layer interposed therebetween. The two silicon based materials of silicon-on-insulator substrate are etched to form a reflective cavity and an insulation trench, respectively, for dividing the silicon-on-insulator substrate into contact surfaces of positive and negative electrodes. A plurality of metal lines are then formed to electrically connect the two silicon based materials such that the LED chip can be mounted on the reflective cavity and electrically connected to the corresponding electrodes of the silicon-on-insulator substrate by the metal lines. Thus the properties of heat resistance and heat dispersal can be improved and the process can be simplified.